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-1- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d lb700d part no. blue oval lamp led model specifications specifications [cont ents] 1. devi ces ---------- --------------- ------------- ------------ 2. outli ne di mensio ns --------------- ----------- --------- 3. abso lute maxi mum rat i ngs ---- ----------- ---------- 4. el ect r o-optical ch aracteristics - ------------ --------- 5. reli ability tests - ---- --- --- --- -- ---- --- --- --- -- ---- --- -- 6. charact eristic di agram s ------------ ------------------ 7. bin code descri pt ion -------------- ------------------- 8. packi ng --------- --------------------- ----------- --------- 9. soldering profile ------------------- ----------- --------- 10. re fer e nc e --------- --------------- ------------- ----------- 11. preca ution for u s e -------------------- ----------------- 2 2 3 4 5 6 8 9 12 13 14
-2- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 1. devices color diffus i on source lens part numb er dice source color blue ingan di ffused blue lb700d 2. outli ne dem e nsions notes : 1. all di m e nsions are in m illim eters. 2 . protru ded epox y is 1 . 0 mm maximum. 1.0 2.5 0.0 5 m i n 28.0 min1 .0 ca t hod e m ax1 .0 de ta il +0.2 -0.0 0.5 0 . 5 0.0 5 5.25 0.2 3.75 0.1 7.06 0.1 x y
-3- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 3. absolute maximum ratings (a t t a = 25oc) mw 125 p d power dissipation v 5 v r reverse voltage oc 260 oc for 10 second 2 t s solder te mperature oc -30 ~ 85 t opr operating temper ature ma 100 i fp 1 forward peak pulse current oc -40 ~ 100 t stg storage temperatur e ma 30 i f dc forward current unit value symbol item no tes : 1 . t 0. 1m s, d = 1/ 10 2. 3m m bel l o w seat i n g pl ane
-4- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 4. electro-optical characteristics (at i f = 20ma, t a = 25oc) nm 476 470 464 d dom i nant wa vel e ngth 5 - - 500 300 v 4.0 3.6 - v f forward vo ltage a - i r reverse current (at v r = 5 v) max. typ. min. deg. 100/50 2 ? view angle mcd i v luminous intensity 1 unit value symbol item no te : 1. lu m i n o u s in ten s ity to ler a n c e 10%
-5- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 5. reliability tests 0/ 22 1 t i m e 1kv, 1.5k ; 100 pf es d (hum an body mo del ) 0/ 50 100c y c les t a = -40o c (30m in) ~ 100o ( 30m in) (transfe r tim e : 5sec, 1cycle = 1hr) therm a l shock 0/ 22 100h rs t a = 85o c , rh = 85% i f = 8ma tem p erature hu m i dity operating 0/ 22 1000 hrs t a = 85o c , rh = 85% tem p erature hu m i dity storage 0/ 22 1000 hrs t a = -40o c lo w te m p erature storage 0/ 22 1000 hrs t a = 100 oc high tem p erature storage 0/ 22 0/ 22 0/ 22 0/ 22 failures 1 t i m e t s = 255 5oc, t = 10sec resistance to soldering h eat 1000 hrs t a = 85o c , i f = 8ma high tem p erature operating 1000 hrs t a = -30o c, i f = 20ma lo w te m p erature operating 1000 hrs t a = r t , i f = 30m a life test note condition item < judging criteria for reliability tests > lsl 2 x 0.5 i v us l x 2.0 i r us l 1 x 1.2 v f no tes : 1 . usl : up p e r standard lev e l 2 . lsl : lo wer s tan d a rd lev e l.
-6- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 6. characteristic diagrams i f = f ( v f ), t a = 25 o c i rel = f ( ), t a = 25 o c off axis angle vs. relative intens it y forward voltage vs. for w ard current 2. 4 2 .6 2.8 3 .0 3.2 3 .4 3 . 6 1 10 10 0 forw ard curre nt i f [m a] f o r w a r d v o l t ag e v f [v] - 100 - 8 0 - 60 -4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 00 0.0 0.2 0.4 0.6 0.8 1.0 y x re l a t i ve l u m i nous i n te ns it y of f ax is angle [ d eg. ] - 4 0 - 2 0 0 2 04 06 0 8 0 1 0 0 0 10 20 30 40 forw ard cu r r e n t i f [ma ] ambi en t temper a t ur e t a [ o c] i v = f ( i f ), t a = 25 o c i f = f ( t a ), t a = 25o c for w ard cu rrent vs. relative intens ity ambient temperature vs. forward cu rrent 0 5 10 15 20 25 30 0.0 0.4 0.8 1.2 1.6 re la t i v e lum i nous inte ns it y fo rw a r d c u rre n t i f [m a ]
-7- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d - 4 0 - 2 0 0 2 0 4 06 08 0 1 0 0 0. 5 0. 6 0. 7 0. 8 0. 9 1. 0 1. 1 1. 2 1. 3 re lative lum i nuo s i n tensity ambi ent te mper a t ur e t a [ o c] i v /i v( 25c) = f ( t a ), i f = 20ma 400 500 600 700 0.0 0.5 1.0 re l a ti ve lum i nous int e ns it y w a v e le ng th [ n m ] i rel = f ( d ), t a = 25o c , i f = 20ma waveleng th vs. relat i ve i n tensi t y ambi ent temperature vs. relative intensity
-8- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 7. bin code description 2 1 t forward vo ltage color ranks intensity bin code 800 600 u 450 300 s 600 450 t max. mi n. bi n code intens ity (m cd) @ i f = 20m a 3.2 3.0 0 4.0 3.8 4 3.6 3.4 2 3.8 3.6 3 3.4 3.2 1 max. mi n. bi n code forward voltage ( v) @ i f = 20m a 476 470 2 470 464 1 max. mi n. bi n code do m i nan t w a veleng t h ( n m ) @ i f = 20m a
-9- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 8. packi n g (1) antistatic poly vinyl bag apply poly bag: ra n k lxxxx qty : pcs lot : 200 x. x x .x x x x x seo u l sem i co nd uctor c o ., l t d ooo rank
-10- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 2) tapping outline dimensions ho po w1 do w2 w wo f p 0 1.3 0 2 . 0 p 4.0 0.5 5.0 0.5 12.7 0.3 12.7 0.5 9.0 0.5 1.0 0.5 13.0 0.3 18.0 +1.0 w2 do w1 f wo po w p ho * package di mensions (u nit : mm ) -0.5 1 box cont a i n quanti t y . * remark : ho - us e r s de f i ne . ? 3 la mp series : 3000pcs * 5 la mp series : 2000pcs
-11- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 3) form ing outline dimensions do po p h h1 ho w wo w1 f w2 p 4.0 0.5 5.0 0.5 12.7 0.3 12.7 0.5 9.0 0.5 1.0 0.5 13.0 0.3 18.0 +1.0 w1 do wo f w po h1 * p ho * w2 h * package di mensions (u nit : mm ) -0.5 1 box cont a i n quanti t y . ? 3 la mp series : 2000pcs * 5 la mp series : 1500pcs * remark : h / h o / h1 - u sers defi n e .
-12- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 9. soldering profile 1) wave sol d ering conditions / profile ? p reli minar y heat ing to be at 85oc(1 20 oc max) for 20 seconds(60 seconds max). ? s oldering heat to be at 235 oc (260o c m ax) for 5 seconds (10 seconds max.) ? s oak ti me above 200 o c is 5 seconds 2) hand soldering condi tions ? n ot m o r e t h an 5 seconds at max. 300oc, under soldering iron. 0 2 4 6 8 10 12 1 4 1 6 18 20 22 2 4 2 6 28 30 3 2 3 4 36 0 50 10 0 15 0 20 0 25 0 t e mpera t ure [ o c] ti m e [ s ] p r eheat 20 s (3 0 s m a x) 85 oc ( 1 0 0 o c m a x) peak 5s ( 1 0 s m a x) 23 5 o c (2 6 0 oc m a x) note : in case th e soldered produ cts are reused in soldering process, we don?t guar a ntee the products.
-13- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 10. part numbering system * 8 * * * - * * * * * * l c b a 7 6 5 4 3 2 1 1) lamp led initial 2) color u: ultra violet, b : bl ue (460~ 490nm ), c : cyan (490~510nm) t : true gre e n (510~540nm ), g : ye llow-green (540~580nm) y : yellow (580~600nm) o : o r ange (600~620nm ) r : red (620~700nm) w : w h ite m : w a rm i : inf r ared 3) if the products have 2 or 3chips gr : green + red ( according to wa velength), fl : full color 4) outline type 1 : 3x2(square), 2 : 5x2(square), 3 : phi3, 5 : phi 5 , 6 : 3phi oval, 7 : 5phi oval 5) half angl e 1: ~14 o , 2: 15~24 o , 3: 25~34 o , 4: 35~44 o , 5 : 45~54 o ? 0 : more than 100 o 6) 1 st development according to a chip 7) 2 nd development (other material) d : diffused c : colored z : zener chip attached 8) stand off type a, b, c : bi n cord description a: iv, b: wd c: vf
-14- seoul semiconductor co., ltd. 148-29, kasan-dong, keumchun-gu, seoul, korea tel : 82-2-3281-6269 fax : 82-2-857-5430 <060712> rev. 0.1 lb700d 11. precaution for use 1) in order to a void the absorption of moisture, it is recomme n ded to store i n the dry box (or desiccators) with a desiccant . 2) in case of mor e than 1 week passed aft e r opening or c h ange color o f indi ca tor on desiccant components sh a ll be dried 10-12hr, at 60

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