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1 publication date: may 2012 ver. eb data sheet (tentative) part no. package code no. AN26031A alga005-w-0609ana
AN26031A 2 ver. eb contents ? overview ????????????????????????????????????????? 3 ? features ????????????????????.????????????????????? 3 ? applications ??????????????????.?????????????.????????? 3 ? package ???????????????????.?????????????????????? 3 ? type ????????????????????.??????????????????????? 3 ? application circuit example (block diagram) ?????????????????????????? 4 y 2.5 ghz band application ????????????????? ?????????? ??????? 4 y 3.5 ghz band application ????????????????? ?????????? ??????? 5 ? pin descriptions ??????????????.???????????????????????? 6 ? absolute maximum ratings ????????????????????????????????? 7 ? operating supply voltage r ange ????????????????? ?????????????? 7 ? allowable voltage range ???? ???????????? ???????????? ?????? 8 ? electrical characteristics ?????????????????????????????????? 9 ? electrical characteristics (reference values for design) ?????????????????????. 11 ? control pin mode table ???? ???????????? ???????????? ??????? 12 ? truth table ???????????????????????????????????????? 12 ? technical data ??????????????????????????????????????? 13 y i/o block circuit diagrams and pin function descriptions ???????????? ????????? 13 y p d ? t a diagram ????????????????????????????????????? 14 ? usage note ????????????.??? ????????? ????????????????? 15
AN26031A 3 ver. eb AN26031A (tentative) single band lna-ic for 2. 5 ghz band applications ? overview y AN26031A is a single band lna (low noise am plifier)-ic for 2.5 ghz band applications. y realizing high performance by using 0.18 m sigec bi-cmos process (f t = 90 ghz, f max = 140 ghz). y high/low gain-mode is changeable, contro lled by integrated cmos logic circuit. y achieving miniaturization by using small size wafer level chip size package (wlcsp). ? features y low voltage operation +3.0 v typ. y low current consumption 7.5 ma typ. (high-gain mode) 7.5 a typ. (low-gain mode) y high gain 18.5 db typ. (high-gain mode) y low noise figure 0.8 db typ. (high-gain mode) y low distortion +2.5 dbm typ. (high-gain mode) y small package ? applications y 2.5 ghz single band lna ? package y 5 pin wafer level chip size package (wlcsp) size : 0.86 0.56 mm 2 (0.3 mm pitch) ? type y bi-cmos ic
AN26031A 4 ver. eb 50 50 a3 a2 a1 b1 l1 c1 v cc c2 cnt (gain cnt) b3 (top view) notes) y this application circuit is an example. the operation of mass production set is not guaranteed. perform enough evaluation and verif ication on the design of mass production set. y this block diagram is for explaining functions. the part of the block diagram may be omitted, or it may be simplified. ? application circuit example (block diagram) y 2.5 ghz band application rf output (2.5 ghz band) rf input (2.5 ghz band)
AN26031A 5 ver. eb notes) y this application circuit is an example. the operation of mass production set is not guaranteed. perform enough evaluation and verif ication on the design of mass production set. y this block diagram is for explaining functions. the part of the block diagram may be omitted, or it may be simplified. ? application circuit example (block diagram) (continued) y 3.5 ghz band application (top view) 50 rf input (3.5ghz band) 50 rf output (3.5 ghz band) a3 a2 a1 b1 l1 c1 v cc c2 cnt (gain cnt) b3 l2
AN26031A 6 ver. eb v cc power supply vcc b3 high-gain/low-gain switch input cnt b1 rf output output out a3 gnd ground gnd a2 rf input input in a1 description type pin name pin no. ? descriptions
AN26031A 7 ver. eb ? ma 18 i cc supply current 2 notes unit rating symbol parameter a no. *3 c ?55 to +125 t stg storage temperature 5 *3 c ?40 to +85 t opr operating ambient temperature 4 *2 mw 29 p d power dissipation 3 *1 v 3.7 v cc supply voltage 1 notes unit range symbol parameter * v 2.7 to 3.6 v cc supply voltage range note) absolute maximum ratings are limit values which do not result in damages to this ic, and ic operation is not guaranteed at th ese limit values. ? absolute maximum ratings notes) *1 :the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : the power dissipation shown is the value at t a = 75 c for the independent (unmounted) ic package with a heat sink. when using this ic , refer to the p d -t a diagram of the package standard and design the heat radiation with sufficie nt margin so that the allowable value might not be exceeded based on the conditi ons of power supply voltage, load, and ambient temperature. *3 : except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for t a = 25 c. ? operating supply voltage range note) * : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
AN26031A 8 ver. eb *1 v ? in a1 ? v ? 0.3 to v cc cnt b1 ? 0.3 to v cc out note unit rating pin name pin no. ? v a3 notes) y allowable current and voltage ranges are limit ranges which do not result in damages to this ic, and ic operation is not guaran teed within these limit ranges. y voltage values, unless otherwise specified, are with respect to gnd. y do not apply external currents or voltages to any pin not specifically mentioned. y for the circuit currents, "+" denotes current flowing into the ic, and " ? " denotes current flowing out of the ic. ? allowable voltage range note) *1 : rf signal input pin. do not apply dc curre nt. do not apply more than 0 dbm to rf input.
AN26031A 9 ver. eb ? ? a 15 7.5 ? v cc current at low-gain mode no input signal i cc l supply current lg dc-2 ? v 3.6 ? 1.48 ? vih input voltage (high-gain mode) dc-3 ? v 0.6 ? 0 vil input voltage (low-gain mode) dc-4 ? a 30 19 ? current at cnt pin vih = v cc iih sw current (high) dc-5 dc electrical characteristics ? ma 10 7.5 ? v cc current at high-gain mode no input signal i cc h supply current hg dc-1 limits typ unit max note min conditions symbol parameter b no. ? electrical characteristics at v cc = 3.0 v note) t a = 25 c 2 c unless otherwise specified.
AN26031A 10 ver. eb ? dbm ? 2.5 ?2 high-gain mode f1 = frx ? 10 mhz f2 = frx ? 20 mhz input 2 signals (f1, f2) iip3h1s iip3 ?10 mhz offset hg a-3 ? db ?5.2 ?7 ?8.8 low-gain mode gls power gain lg a-2 ac electrical characteristics ? db 20 18.5 16.6 high-gain mode ghs power gain hg a-1 limits typ unit max note min conditions symbol parameter b no. ? electrical characteristics (continued) at v cc = 3.0 v note) t a = 25 c 2 c, frx = 2.5 ghz, prx = ?30 dbm, cw unless otherwise specified.
AN26031A 11 ver. eb ? electrical characteristics (reference values for design) at v cc = 3.0 v notes) t a = 25 c 2 c, frx = 2.3 ghz, 2.5 ghz, 2.7 ghz, prx = ?30 dbm, cw unless otherwise specified. the characteristics listed below are reference values derived fr om the design of the ic and are not guaranteed by inspection. if a problem does occur related to these characteris tics, we will respond in good faith to user concerns. ? dbm ? 24.5 10 low-gain mode f1 = frxa f2 = frxa + 100 khz input 2 signals (f1, f2) iip3la iip3 +100 khz offset lg c-8 ? dbm ? 8 0 low-gain mode ip1dbla input p1db lg c-9 ? db ? 8.5 7 low-gain mode s11la input return loss lg c-13 ? db ? 19 10 high-gain mode s22ha output return loss hg c-14 ? db ? 7 4.5 low-gain mode isola reverse isolation lg c-11 ? db ? 16 10 high-gain mode s11ha input return loss hg c-12 ? db ? 31 26 high-gain mode isoha reverse isolation hg c-10 ? dbm ? ?8.5 ?12 high-gain mode ip1dbha input p1db hg c-7 ? db ? 14.5 9.5 low-gain mode s22la output return loss lg c-15 high-gain mode f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) low-gain mode low-gain mode prx = ?20 dbm *1 db 1.45 0.95 ? high-gain mode nfha noise figure hg c-3 *1 db 9.5 7 ? nfla noise figure lg c-4 ? dbm ? 2.5 ?2.5 high-gain mode f1 = frxa ? 10 mhz f2 = frxa ? 20 mhz input 2 signals (f1, f2) iip3h1a iip3 ?10 mhz offset hg c-5 ac electrical characteristics ? db 20.5 18.5 16.1 high-gain mode gha power gain hg c-1 ? db ?5 ?7 ?9 gla power gain lg c-2 ? dbm ? 2.0 ?2.5 iip3h2a iip3 +10 mhz offset hg c-6 reference values typ unit max note min conditions symbol parameter b no. note) *1 : connector & substrate loss (0.14 db) included.
AN26031A 12 ver. eb pin voltage high-gain high ? low-gain high-gain/low-gain switching (gain control) b1 remarks low description pin no. ? control pin mode table note) see parameters b no. dc-3 / b no. dc-4 in the electrical characteristics fo r control voltage retention ranges. high-gain high-gain high mode lna cnt low-gain low-gain low ? truth table note) see parameters b no. dc-3 / b no. dc-4 in the electrical characteristics fo r control voltage retention ranges.
AN26031A 13 ver. eb high-gain/low-gain sw input less than 0.60 v : low-gain mode more than 1.48 v : high-gain mode 160 k ? b1 gnd ? ? 0.0 v a2 lna input ? 0.8 v a1 ? ? impedance voltage supply 3.3 v b3 lna output ? a3 description internal circuit waveform and voltage pin no. a3 v cc gnd b3 gnd a1 v cc gnd gnd b1 ? technical data y i/o block circuit diagram and pin function descriptions note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed.
AN26031A 14 ver. eb ? technical data (continued) y p d ? t a diagram
AN26031A 15 ver. eb ? usage notes y special attention and precaution in using 1. this ic is intended to be used for general electronic equipment [2.5 ghz band applications]. consult our sales staff in advance for in formation on the foll owing applications: x special applications in which ex ceptional quality and reli ability are required, or if the fail ure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliability equivalent to (1) to (7) is required it is to be understood that our company shall not be held respons ible for any damage incurred as a result of or in connection w ith your using the ic described in this book for any special applicatio n, unless our company agrees to your using the ic in this bo ok for any special application. 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it migh t smoke or ignite. 3. pay attention in the pcb (printed-circu it-board) pattern layout in order to preven t damage due to short circuit between pins . in addition, refer to the pin description for the pin configuration. 4. perform a visual inspection on the pcb be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perfo rm a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substanc es, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- vcc short (power supply fault), output pin-gnd short (ground fault), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage a nd operating environment etc.). esp ecially, please be careful not to exceed the range of absolu te maximum rating on the transient state, such as power-on, power-off and mode -switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, ta ke into the consideration of incidence of break down and failur e mode, possible to occur to semiconductor produc ts. measures on the system s such as redundant design, arresting the spread of fi re or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the produ cts. 7. when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 8. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book. 9. due to unshielded structure of this ic, under exposure of li ght, function and characteristic of the product cannot be guarante ed. during normal operation or even under testing condition, please ensure that ic is not exposed to light. 10. basically, chip surface is ground potential. please design to ensure no contact between chip surface and metal shielding.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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