publication number s72ms-p_00 revision 01 issue date september 14, 2006 s72ms-p based mcp/pop products s72ms-p based mcp/pop products cover sheet 1.8 volt-only x16 flash memo ry and sdram on split bus nand interface ornand ? flash on bus 1 mobile sdram on bus 2 data sheet (advance information) notice to readers: this document states the current techni cal specifications regarding the spansion product(s) described herein. each product describ ed herein may be designated as advance information, preliminary, or full production. see notice on data sheet designations for definitions.
ii s72ms-p based mcp/pop products s72ms-p_00_01 september 14, 2006 data sheet (advance information) notice on data sheet designations spansion inc. issues data sheets with advance informati on or preliminary designations to advise readers of product information or int ended specifications throu ghout the product life cycle, including development, qualification, initial production, and fu ll production. in all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. the following descriptions of spansion data sheet designations are presented here to highlight their presence and definitions. advance information the advance information designation indicates that spansion inc. is developing one or more specific products, but has not committed any design to production. information pr esented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. spansion inc. therefore places the following c onditions upon advance information content: ?this document contains information on one or mo re products under development at spansion inc. the information is intended to help you evaluate th is product. do not design in this product without contacting the factory. spansion inc. reserves t he right to change or discont inue work on this proposed product without notice.? preliminary the preliminary designation indicates that the produc t development has progressed such that a commitment to production has taken place. this designation covers several aspects of the product life cycle, including product qualification, initial produc tion, and the subsequent phases in t he manufacturing process that occur before full production is achieved. changes to the technical specifications presented in a preliminary document should be expected while keeping these as pects of production under consideration. spansion places the following conditions upon preliminary content: ?this document states the current technical sp ecifications regarding the spansion product(s) described herein. the preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. due to the phases of the manufacturing process that require maintaining efficiency and quality, this doc ument may be revised by subsequent versions or modifications due to changes in technical specifications.? combination some data sheets contain a combination of products with different designations (advance information, preliminary, or full production). this type of docum ent distinguishes these prod ucts and their designations wherever necessary, typically on the first page, t he ordering information page, and pages with the dc characteristics table and the ac erase and program ta ble (in the table notes). the disclaimer on the first page refers the reader to the notice on this page. full production (no designation on document) when a product has been in production for a period of time such that no changes or only nominal changes are expected, the preliminary designation is remove d from the data sheet. nominal changes may include those affecting the number of ordering part numbers available, such as t he addition or deletion of a speed option, temperature range, package type, or v io range. changes may also include those needed to clarify a description or to correct a typographical error or incorre ct specification. spansion inc. applies the following conditions to documents in this category: ?this document states the current technical sp ecifications regarding the spansion product(s) described herein. spansi on inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. however, typographical or specification corrections, or mo difications to the valid comb inations offered may occur.? questions regarding these docum ent designations may be directed to your local sales office.
this document contains information on one or more products under development at spansion inc. the information is intended to he lp you evaluate this product. do not design in this product without contacting the factory. spansion inc. reserves the right to change or discontinue work on this proposed pr oduct without notice. publication number s72ms-p_00 revision 01 issue date september 14, 2006 features ? power supply voltage of 1.7 to 1.95v ? flash access time: 25 ns for ornand flash ? mobile sdram burst frequency: 104 mhz (sdr), 133 mhz (ddr) ? ornand bus width: x8 or x16 ? package: ? 11.0 x 13.0 mm mcp ? operating temperature ? ?25c to +85c (wireless) the s72ms series is a product line of stacked packages and consists of: ? one or two nand interface ornand die ? separate bus for one or more mobile sdram die the products covered by this document are listed in the table below. for detailed specifications, please re fer to the individual data sheets. s72ms-p based mcp/pop products 1.8 volt-only x16 flash memo ry and sdram on split bus nand interface orna nd? flash on bus 1 mobile sdram on bus 2 data sheet (advance information) device ornand flash density dram density 1024mb 512mb 512mb 256mb 128mb s72ms512pe0hf94v x (x8) x (x16 sdr) document publication identification number (pid) s30ms-p s30ms-p_00 256 mb mobile sdr-dram type 5 sdram_10
2 s72ms-p based mcp/pop products s72ms-p_00_01 september 14, 2006 data sheet (advance information) 1. product selector guide 2. product block diagram 2.1 ornand flash + dram mcp note 1. for mcps, v ss is shared between all flash (nor and ornand). also, v ssq is tied to v ss internally within the mcp. device-model# ornand flash density ornand bus width ecc required dram density dram speed dram supplier package s72ms512pe0hf94v 512 mb x8 yes 256 mb 104 mhz (sdr) type 5 mcp 11x13mm 137-ball n-i/o0-n-i/o7 i/o0-i/o7 n-rb# rb# n-cle cle n-ce# ce# n-ale ale n-vss n-re# # e r n-pre n-wp# wp# n-we# we# n-vcc d-a0-d-a12 a0-a12 d-ba0 ba0 d-dq0-d-dq15 d-ba1 ba1 d-clk clk d-cke cke d-ce# ce# d-ldqm ldqm d-we# we# d-ras# ras# d-cas# cas# d-udqm m q d u d-vss d-vssq d-vcc d-vccq dq0-dq15 ms512p x8 ornand memory 256mb x16 sdr dram memory vss e r p vcc s s v vssq vcc vccq
september 14, 2006 s72ms-p_00_01 s72ms-p based mcp/pop products 3 data sheet (advance information) 3. connection diagrams 3.1 512 mb x8 ornand flash with 256 mb dram 3.1.1 special handling instru ctions for fbga package special handling is required for flash memory products in fbga packages. flash memory devices in fbga packages may be damaged if exposed to ultrasonic cleaning methods. the package and/or data integrity may be compromised if t he package body is exposed to temperatures above 150c for prolonged periods of time. 3.1.2 look-ahead ballout for future designs please refer to the design-in scalable wireless solutions with spansion products application note (publication number: design_scalable_wir eless_a0_e). contact your local spansion sales representative for more details. 3 2910 5 47 68 1 d-clk# d-clk d-vss d-ce# d-vss rfu d-a12 d-vcc d-a11 d-cke b d e f g h j k l m n p a c d-a9 d-we# rfu d-cas# d-vssq d-a8 d-a7 d-vccq d-a6 d-ras# vss rfu cle rfu rfu rfu pre rfu ale d-a10 rfu rfu ce# d-a5 f-acc d-dm0 rfu f-we# rfu d-a0 rfu rfu rfu d-vccq f-rst# d-dm1 rfu dnu rfu d-vccq rfu rfu rfu d-vssq rfu rfu rfu rfu rfu d-vssq rfu rfu rfu d-dq15 rfu rfu rfu rfu d-dq0 vss rfu rfu d-dq14 n-io1 n-io6 rfu d-dq1 rfu rfu dnu d-dq13 n-io3 rfu rfu n-io4 rfu d-dq2 n-io0 dnu vss d-dq12 rfu rfu rfu vcc n-io7 d-dq3 rfu vcc wp# d-dq11 rfu n-io2 n-io5 rfu rfu d-dq4 rfu rfu dnu d-dq10 rfu vss dnu rfu rfu d-dq5 d-dq6 d-ba0 d-ba1 re# d-vssq d-dq7 d-dq8 d-vccq d-dq9 we# d-a1 d-vss ry/by# d-dqs1 d-vss d-a2 d-a3 d-vcc d-a4 d-dqs0 legend reserved fo r future use do not use ornand flash 1 only sdr dram only
4 s72ms-p based mcp/pop products s72ms-p_00_01 september 14, 2006 data sheet (advance information) 3.2 dram input/output descriptions note some of the signal descriptions specifically apply to ddr dram only. 3.2.1 ornand sig nal descriptions d-amax-d-a0 sdram address inputs d-dq15-d-dq0 sdram data input/output d-clk sdram system clock d-ce# sdram chip select d-cke sdram clock enable d-ba1-ba0 sdram bank select d-ras# sdram row address strobe d-cas# sdram column address strobe d-dm1-d-dm0 sdram data input mask d-we# sdram write enable input d-v ss sdram ground d-clk# ddr sdram clock - in addition to d-clk, this signal is available for ddrams that need clk# for normal operations d-v ssq sdram input/output buffer ground d-v ccq sdram input/output buffer power supply d-v cc sdram device power supply d-dqs0 - d- dqs1 ddr sdram data strobe pins. dqs provides the read data strobes (as output) and the write data strobes (as input). each dqs pin corresponds to eight dq pins, respectively. n-pre ornand power-on read enable. tie to v ss on customer board if not used n-ale ornand address latch enable n-cle ornand command latch enable n-ce# ornand chip-enable n-wp# ornand write-protect n-we# ornand write-enable n-re# ornand read-enable n-ry/by# ornand ready-busy n-i/o0-n-i/o15 ornand i/o signals (i/o0-i/o7 for x8 bus width) n-v cc ornand power supply
september 14, 2006 s72ms-p_00_01 s72ms-p based mcp/pop products 5 data sheet (advance information) 4. ordering information the order number is formed by a valid combinations of the following: s72ms 512 p f0 hf 0 4 v 0 packing type 0 = tray 2 = 7? tape and reel 3 = 13? tape and reel model number 2 v = 104 mhz dram speed, x8 ms-p (ecc required) model number 1 4 = x16 sdr dram type 5 package descriptor depends on character 12. for a more detailed description see table 4.1 . package type & material set hf = 1.2 mm mcp fbga, pb-free dram density f0 = 512 mb dram e0 = 256 mb dram process technology p = 90 nm, mirrorbit tm technology ornand flash density 01g = 1024 mb 512 = 512 mb product family s72ms stacked products (mcp/pop) 1.8 v ornand flash on bus 1 with mobile dram on bus 2 table 4.1 character position descriptions (sheet 1 of 2) character 12 character 13 character 14 description package area package ball count raw ball size h, j, or g 07x9mm56 0.35 mm 17x9 mm80 2 8x11.6 mm 64 3 8x11.6 mm 84 4 9x12 mm 84 5 9x12 mm 115 6 9x12 mm 137 7 11x13 mm 84 8 11x13 mm 115 9 11x13 mm 137
6 s72ms-p based mcp/pop products s72ms-p_00_01 september 14, 2006 data sheet (advance information) 4.1 valid combinations valid combinations list configurations planned to be supported in volume for this device. consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. notes: 1. packing type 0 is standard. specify other options as required. 2. bga package marking omits leading s and packing type designator from ordering part number. k a 11x11 mm 112 0.45 mm b 11x11 mm 112 0.50 mm d 12x12 mm 128 0.45 mm f 12x12 mm 128 0.50 mm g 14x14 mm 152 0.45 mm h 14x14 mm 152 0.50 mm j 15x15 mm 160 0.45 mm k 15x15 mm 160 0.50 mm l 17x17 mm 192 0.45 mm m 17x17 mm 192 0.50 mm table 4.1 character position descriptions (sheet 2 of 2) character 12 character 13 character 14 description package area package ball count raw ball size s72ms-p valid combinations ornand flash bus width dram supplier dram speed package type package markings base ordering number package & material set package descriptor packing type s72ms512pe0 hf 9 0, 2, 3 (note 1) x8 (ecc) type 5 104 mhz 11x13 mm (mcp) (note 2)
september 14, 2006 s72ms-p_00_01 s72ms-p based mcp/pop products 7 data sheet (advance information) 5. physical dimensions 5.1 tlk137?137-ball fine-pitch ball grid array (fbga) 13 x 11 mm package 3606 \ 16-038.43 \ 9.14.06 package tlk 137 jedec n/a d x e 13.00 mm x 11.00 mm package symbol min nom max note a --- --- 1.20 profile a1 0.17 --- --- ball height a2 0.79 --- 0.96 body thickness d 13.00 bsc. body size e 11.00 bsc. body size d1 10.40 bsc. matrix footprint e1 7.20 bsc. matrix footprint md 14 matrix size d direction me 10 matrix size e direction n 137 ball count ?b 0.35 0.40 0.45 ball diameter ee 0.80 bsc. ball pitch ed 0.80 bsc ball pitch sd se 0.40 bsc. solder ball placement g5,h5,h6 depopulated solder balls notes: 1. dimensioning and tolerancing methods per asme y14.5m-1994. 2. all dimensions are in millimeters. 3. ball position designation per jep95, section 4.3, spp-010. 4. e represents the solder ball grid pitch. 5. symbol "md" is the ball matrix size in the "d" direction. symbol "me" is the ball matrix size in the "e" direction. n is the number of populated solder ball positions for matrix size md x me. 6 dimension "b" is measured at the maximum ball diameter in a plane parallel to datum c. 7 sd and se are measured with respect to datums a and b and define the position of the center solder ball in the outer row. when there is an odd number of solder balls in the outer row sd or se = 0.000. when there is an even number of solder balls in the outer row, sd or se = e/2 8. "+" indicates the theoretical center of depopulated balls. 9 a1 corner to be identified by chamfer, laser or ink mark, metallized mark indentation or other means.
8 s72ms-p based mcp/pop products s72ms-p_00_01 september 14, 2006 data sheet (advance information) 6. revision history 6.1 revision 01 (september 14, 2006) initial release. colophon the products described in this document are designed, developed and manufactured as contemplated for general use, including wit hout limitation, ordinary industrial use, genera l office use, personal use, and household use, but are not designed, developed and m anufactured as contemplated (1) for any use that includes fatal risks or dangers t hat, unless extremely high safety is secured, could have a s erious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic contro l, mass transport control, medical life support system, missile launch control in we apon system), or (2) for any use where chance of failure is intole rable (i.e., submersible repeater and artifi cial satellite). please note that spansion will not be liable to you and/or any third party for any claims or damages arising in connection with abo ve-mentioned uses of the products. any semic onductor devices have an inherent chance of failure. you must protect agains t injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. if any products described in this document r epresent goods or technologies s ubject to certain restriction s on export under the foreign exchange and foreign trade law of japan, the us export ad ministration regulations or the applicable laws of any oth er country, the prior authorization by the respective government entity will be required for export of those products. trademarks and notice the contents of this document are subjec t to change without notice. this document ma y contain information on a spansion product under development by spansion. spansion reserves the right to change or discontinue work on any product without notice. the informati on in this document is provided as is without warran ty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. spansion assume s no liability for any damages of any kind arising out of the use of the information in this document. copyright ? 2006 spansion inc. all rights reserved. spansion, t he spansion logo, mirrorbit, orna nd, hd-sim, and combinations th ereof are trademarks of spansion inc. other names are for informational purposes only and may be trademarks of their respective owners.
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