Part Number Hot Search : 
1N980 MGA2805D ISL6217 LC74783 38922 SMB214B 5C32861 T8203050
Product Description
Full Text Search
 

To Download HDSP-5537 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  seven segment displays for high light ambient conditions technical data features ?high light output typical intensities of up to 7.0 mcd/seg at 100 ma pk 1 of 5 duty factor ?capable of high current drive excellent for long digit string multiplexing ?four character sizes 7.6 mm, 10.9 mm, 14.2 mm, and 20.3 mm ?choice of two colors high efficiency red yellow ?excellent character appearance evenly lighted segments wide viewing angle gray body for optimum contrast ?categorized for luminous intensity; yellow categorized for color use of like categories yields a uniform display ?ic compatible ?mechanically rugged description the hdsp-553x/-3900 and hdsp-4030/-4130/-5730/-4200 are 7.6 mm, 10.9 mm/14.2 mm/ 20.3 mm high efficiency red and yellow displays designed for use in high light ambient condition. the four sizes of displays allow for viewing distances at 3, 6, 7, and 10 meters. these seven segment displays utilize large junction high efficiency led chips made from gaasp on a transparent gap substrate. due to the large junction area, these displays can be driven at high peak current levels needed for high ambient conditions or many character multiplexed operation. these displays have industry standard packages, and pin configurations and 1 overflow display are available in all four sizes. these numeric displays are ideal for applications such as automotive and avionic instrumentation, point of sale terminals, and gas pump. high efficiency red hdsp-553x/-3900 series yellow hdsp-4030/-4130/-5730/ -4200 series
2 devices part no. package hdsp- color description drawing 4030 yellow 7.6 mm common anode left hand decimal a 4031 7.6 mm common anode right hand decimal b 4033 7.6 mm common cathode right hand decimal c 4036 7.6 mm universal overflow 1 right hand decimal d 4130 yellow 10.9 mm common anode left hand decimal e 4131 10.9 mm common anode right hand decimal f 4133 10.9 mm common cathode right hand decimal g 4136 10.9 mm universal overflow 1 right hand decimal h 5537 high efficiency red 14.2 mm overflow 1 common anode k 5538 14.1 mm overflow 1 common cathode l 5731 yellow 14.2 mm common anode right hand decimal i 5733 14.2 mm common cathode right hand decimal j 5737 14.2 mm overflow 1 common anode k 5738 14.1 mm overflow 1 common cathode l 3900 high efficiency red 20.3 mm common left hand decimal m 3901 20.3 mm common anode right hand decimal n 3903 20.3 mm common cathode right hand decimal o 3905 20.3 mm common cathode left hand decimal p 3906 20.3 mm universal overflow 1 right hand decimal q 4200 yellow 20.3 mm common left hand decimal m 4201 20.3 mm common anode right hand decimal n 4203 20.3 mm common cathode right hand decimal o 4205 20.3 mm common cathode left hand decimal p 4206 20.3 mm universal overflow 1 right hand decimal q note: universal pinout brings the anode and cathode of each segment? led out to separate pins. see internal diagrams d and h. absolute maximum ratings (all products) average power per segment or dp (t a = 25 c) ................................................................................. 105 mw peak forward current per segment or dp (t a = 25 c) ............................... 135 ma (pulse width = 0.16 ms) dc forward current per segment [2] or dp (t a = 25 c) ........................................................................ 40 ma operating temperature range ................................................................................................. -40 c to +85 c storage temperature range .................................................................................................... -4 0 c to +85 c reverse voltage per segment or dp .............................................................................................. .......... 5.0 v wavesolder temperature (1.59 mm [1/16 inch] below body) ................................................. 250 c for 3 sec notes: 1. see figure 1 to establish pulsed operating conditions 2. derate maximum dc current above t a = 25 c at 0.50 ma/ c per segment, see figure 2.
3 package dimensions (hdsp-4030 series) package dimensions (hdsp-4130 series) function ab c d pin -4030 -4031 -4033 -4036 1 cathode-a cathode-a cathode [6] anode-d 2 cathode-f cathode-f anode-f no pin 3 anode [3] anode [3] anode-g cathode-d 4 no pin no pin anode-e cathode-c 5 no pin no pin anode-d cathode-e 6 cathode-dp no conn. [5] cathode [6] anode-e 7 cathode-e cathode-e anode-dp anode-c 8 cathode-d cathode-d anode-c anode-dp 9 no conn. [5] cathode-dp anode-b no pin 10 cathode-c cathode-c anode-a cathode-dp 11 cathode-g cathode-g cathode-b 12 no pin no pin cathode-a 13 cathode-b cathode-b anode-a 14 anode [3] anode [3] anode-b function ef g h pin -4130 -4131 -4133 -4136 1 cathode-a cathode-a anode-a cathode-d 2 cathode-f cathode-f anode-f anode-d 3 anode [3] anode [3] cathode [6] no pin 4 no pin no pin no pin cathode-c 5 no pin no pin no pin cathode-e 6 cathode-dp no conn. [5] no conn. [6] anode-e 7 cathode-e cathode-e anode-e anode-c 8 cathode-d cathode-d anode-d anode-dp 9 no conn. [5] cathode-dp anode-dp cathode-dp 10 cathode-c cathode-c anode-c cathode-b 11 cathode-g cathode-g anode-g cathode-a 12 no pin no pin no pin no pin 13 cathode-b cathode-b anode-b anode-a 14 anode [3] anode [3] cathode [8] anode-b
4 package dimensions (-3900/-4200 series) package dimensions (-553x/-5730 series) function k l pin -5537 -5538 1 cathode-c anode-c 2 anode-c,d cathode-c,d 3 cathode-b anode-b 4 anode-a,b, dp cathode-a,b dp 5 cathode dp anode dp 6 cathode-a anode-a 7 anode-a,b, dp cathode-a,b, dp 8 anode-c,d cathode-c,d 9 cathode-d anode-d 10 no pin [5] no pin [5]
5 internal circuit diagram (hdsp-4030 series) internal circuit diagram (hdsp-4130 series) internal circuit diagram (hdsp-553x/-5730 series)
6 electrical/optical characteristics at t a = 25 c device parameter sym. hdsp- min. typ. max. units test condition luminous intensity/ i v 553x 2200 7000 cd 100 ma pk segment [9,10] 3900 2200 7000 1 of 5 duty factor (digit average) 553x 4800 cd 20 ma dc 3900 4800 4030 1500 4500 cd 100 ma pk; 4130 1500 5000 1 of 5 duty factor 5730 2200 7000 4200 2200 7000 4030 2200 cd 20 ma dc 4130 2500 5730 3400 4200 3400 peak wavelength peak 553x/3900 635 nm 4030/4130/ 583 nm 5730/4200 dominant wavelength [11,12] d 553x/3900 626 nm (digit average) 4030/4130/ 581.5 586 592.5 nm 5730/4200 forward voltage/seg or d.p. v f all devices 2.6 3.5 v i f = 100 ma reverse current/seg or d.p. i r all devices 100 av r = 3.0 v temp. coeff. of v f /seg or d.p. ? v f / c all devices ?.1 mv/ ci f = 100 ma thermal resistance r j-pin 4030/4130 282 c/w/seg led junction-to-pin 553x/5730 345 c/w/seg 3900/4200 375 c/w/seg notes: 9. case temperature of the device immediately prior to the intensity measurement is 25 c. 10. the digits are categorized for luminous intensity with the intensity category designated by a letter on the side of the pac kage. 11. the dominant wavelength, d , is derived from the cie chromaticity diagram and is that single wavelength which defines the color of the device. 12. the yellow displays are categorizes as to dominant wavelength with the category designated by a number adjacent to the inte nsity category letter. internal circuit diagram (hdsp-3900/-4200 series)
7 figure 2. maximum allowable dc current per segment vs. ambient temperature. electrical these display devices are composed of eight light emitting diodes, with light from each led optically stretched to form individual segments and a decimal point. the devices utilize led chips which are made from gaasp on a transparent gap substrate. these display devices are designed for strobed operation. the typical forward voltage values, scaled from figure 4, should be used for calculating the current limiting resistor value and typical power dissipation. expected maximum v f values, for the purpose of driver circuit design and maximum power dissipation, may be calculated using the following v f max models: v f max = 2.15 v + i peak (13.5 ? ) for: i f 30 ma v f max = 1.9 v + i dc (21.8 ? ) for: 10 ma i f 30 ma temperature derated strobed operating conditions are obtained from figures 1 and 2. figure 1 relates pulse duration (t p ), refresh rate (f), and the ratio of maxi- mum peak current to maximum figure 1. maximum allowed peak current vs. pulse duration. figure 3. relative efficiency (luminous intensity per unit current) vs. peak segment current. figure 5. relative luminous intensity vs. dc forward current. figure 4. peak forward segment current vs. peak forward voltage. hdsp-553x/-3900 series hdsp-553x/-3900 series
dc current (i peak max/i dc max). figure 2 presents the maximum allowed dc current vs. ambient temperature. figure 1 is based on the principle that the peak junc- tion t emperature for pulsed opera tion at a specified peak current, pulse duration and refresh rate should be the same as the junction temperature at maximum dc operation. refresh rates of 1 khz or faster minimize the pulsed junction heating effect of the device resulting in the maximum possible time average luminous intensity. the time average luminous inten- sity can be calculated knowing the average forward current and relative efficiency characteristic, |peak , of figure 3. time average luminous intensity for a device case temperature of 25 c, i v (25 c), is calculated as follows: i avg i v (25 c) = [ ] [ |peak ] [i v data sheet ] 20 ma example: for hdsp-4030 series |peak = 1.00 at i peak = 100 ma. for df = 1/5: 20 ma i v (25 ) = [ ] [1.00][4.5 mcd] 20 ma = 4.5 mcd/segment the time average luminous inten- sity may be adjusted for operat- ing junction temperature by the following exponential equation: i v (t j ) = i v (25 c) e [k(t j + 25 c)] where t j = t a + p d ?r j-a mechanical these devices are constructed utilizing a lead frame in a standard dip package. the led dice are attached directly to the lead frame. therefore, the cathode leads are the direct thermal and mechanical stress paths to the led dice. the absolute maximum allowed junction temperature, t j max, is 105 c. the maximum power ratings have been established so that the worst case v f device does not exceed this limit. worst case thermal resistance pin-to-ambient is 400 c/w/seg when these devices are soldered into minimum trace width pc boards. when installed in a pc board that provides r pin-a less than 400 c/w/seg these displays may be operated at higher average currents as shown in figure 2. optical the radiation pattern for these devices is approximately lam- bertian. the luminous sterance may be calculated using one of the two following formulas. i v (cd) l v (cd/m 2 ) = a(m 2 ) i v (cd) l v (footlamberts) = a(ft 2 ) contrast enhancement the objective of contrast enhance- ment is to optimize display readability. adequate contrast enhancement can be achieved in indoor applications through luminous contrast techniques. luminous contrast is the observed brightness of the illuminated segment compared to the brightness of the surround. appropriate wavelength filters maximize luminous contrast by reducing the amount of light reflected from the area around the display while transmitting most of the light emitted by the segment. these filters are described further in application note 1015. chrominance contrast can further improve display readability. chrominance contrast refers to the color difference between the illuminated segment and the surrounding area. these displays are ass embled with a gray package and untinted encapsulating epoxy in the segments to improve chrominance contrast of the on segments. additional contrast enhancement in bright ambients may be achieved by using a neutral density gray filter such as panelgraphic chromafilter gray 10, or 3m light control film (louvered film). device k -553x/-3900 -0.0131/ c -4030/-4130/ -0.0112/ c -5730/-4200 area/seg. area/seg. device mm 2 in 2 -4030 2.5 0.0039 -4130 4.4 0.0068 -553x/-5730 8.8 0.0137 -3900/-4200 14.9 0.0231 www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. obsoletes 5964-6374e copyright ? 2004 agilent technologies, inc. july 12, 2004 5988-1734en


▲Up To Search▲   

 
Price & Availability of HDSP-5537

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X