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  rev.1.00, aug.06.2004, page 1 of 7 CR3KM-12 thyristor low power use rej03g0386-0100 rev.1.00 aug.06.2004 features ? i t (av) : 3 a ? v drm : 600 v ? i gt : 100 a ? viso : 2000 v ? insulated type ? glass passivation type ? ul recognized : yellow card no. e223904 file no. e80271 outline 2 to-220fn 1 3 1. cathode 2. anode 3. gate 1 3 2 applications tv sets, control of household equipment such as electric blanket, and other general purpose control applications maximum ratings voltage class parameter symbol 12 unit repetitive peak reverse voltage v rrm 600 v non-repetitive peak reverse voltage v rsm 720 v dc reverse voltage v r (dc) 480 v repetitive peak off-state voltage note1 v drm 600 v dc off-state voltage note1 v d (dc) 480 v
CR3KM-12 rev.1.00, aug.06.2004, page 2 of 7 parameter symbol ratings unit conditions rms on-state current i t (rms) 4.7 a average on-state current i t (av) 3.0 a commercial frequency, sine half wave 180 conduction, tc = 103 c surge on-state current i tsm 70 a 60hz sine half wave 1 full cycle, peak value, non-repetitive i 2 t for fusing i 2 t 24.5 a 2 s value corresponding to 1 cycle of half wave 60hz, surge on-state current peak gate power dissipation p gm 0.5 w average gate power dissipation p g (av) 0.1 w peak gate forward voltage v fgm 6v peak gate reverse voltage v rgm 6v peak gate forward current i fgm 0.3 a junction temperature tj ? 40 to +125 c storage temperature tstg ? 40 to +125 c mass ? 2.0 g typical value isolation voltage viso 2000 v ta = 25 c, ac 1 minute, each terminal to case notes: 1. with gate to cathode resistance r gk = 220 ? . electrical characteristics parameter symbol min. typ. max. unit test conditions repetitive peak reverse current i rrm ? ? 2.0 ma tj = 125 c, v rrm applied, r gk = 220 ? repetitive peak off-state current i drm ? ? 2.0 ma tj = 125 c, v drm applied, r gk = 220 ? on-state voltage v tm ? ? 1.6 v tc = 25 c, i tm = 10 a, instantaneous value gate trigger voltage v gt ? ? 0.8 v tj = 25 c, v d = 6 v, i t = 0.1 a gate non-trigger voltage v gd 0.1 ? ? v tj = 125 c, v d = 1/2 v drm r gk = 220 ? gate trigger current i gt 1 ? 100 note3 atj = 25 c, v d = 6 v, i t = 0.1 a thermal resistance r th (j-c) ??4.1 c/w junction to case note2 notes: 2. the contact thermal resistance r th (c-f) in case of greasing is 0.5c/w. 3. if special values of i gt are required, choose at least two item s from those listed in the table below. (example: bc) item b c i gt ( a) 20 to 50 40 to 100 the above values do not include the current flowing through the 220 ? resistance between the gate and cathode.
CR3KM-12 rev.1.00, aug.06.2004, page 3 of 7 performance curves maximum on-state characteristics on-state current (a) on-state voltage (v) rated surge on-state current surge on-state current (a) conduction time (cycles at 60hz) maximum transient thermal impedance characteristics (junction to case) transient thermal impedance (c/w) time (s) gate trigger voltage vs. junction temperature gate trigger voltage (v) junction temperature (c) gate voltage (v) gate current (ma) gate trigger current vs. junction temperature junction temperature (c) gate characteristics 100 (%) gate trigger current (tj = tc) gate trigger current (tj = 25c) 10 0 23 7 510 1 40 20 10 2 4237 5 4 60 80 100 30 10 50 70 90 0 3.8 0.6 1.4 2.2 3.0 1.0 1.8 2.6 3.4 10 2 7 5 3 2 10 1 7 5 3 2 10 0 7 5 3 2 10 ?1 10 0 57 57 10 0 23 5710 1 23 5710 2 23 23 10 ?1 7 10 ?1 7 5 5 3 2 10 1 7 5 3 2 10 2 7 5 3 2 120 60 ?20 ?40 0 20 40 80 100 10 3 7 5 3 2 10 2 7 5 3 2 10 1 7 5 3 2 10 0 # 2 # 1 23 10 0 5710 1 23 5710 2 23 5710 3 10 0 23 10 ?3 5710 ?2 23 5710 ?1 23 5710 0 10 2 7 5 3 2 10 1 7 5 3 2 7 5 3 2 10 ?1 1.0 0.7 0.6 0.3 0.2 0 120 ?40 ?20 20 80 0.1 0.5 0.4 0.8 0.9 060 40 100 tc = 25c v gd = 0.1v p gm = 0.5w p g(av) = 0.1w v fgm = 6v v gt = 0.8v i fgm = 0.3a i gt = 100 a (tj = 25c) i gt (25c) # 1 45 a # 2 18 a typical example distribution typical example
CR3KM-12 rev.1.00, aug.06.2004, page 4 of 7 maximum average power dissipation (single-phase half wave) average power dissipation (w) average on-state current (a) allowable case temperature vs. average on-state current (single-phase half wave) case temperature (c) average on-state current (a) allowable case temperature vs. average on-state current (single-phase full wave) case temperature (c) average on-state current (a) maximum average power dissipation (single-phase full wave) average power dissipation (w) average on-state current (a) allowable ambient temperature vs. average on-state current (single-phase full wave) ambient temperature (c) average on-state current (a) allowable ambient temperature vs. average on-state current (single-phase half wave) ambient temperature (c) average on-state current (a) 8 6 3 2 1 7 5 4 0 5.0 0 1.0 4.0 2.0 3.0 = 30 60 120 90 180 160 120 60 40 20 140 100 80 0 5.0 0 1.0 4.0 2.0 3.0 = 30 120 60 90 180 160 120 60 40 20 140 100 80 0 1.6 0 0.4 0.8 1.2 1.4 0.2 0.6 1.0 = 180 90 120 60 30 8 6 3 2 1 7 5 4 0 5.0 0 4.0 1.0 2.0 3.0 = 30 60 90 180 120 160 120 60 40 20 140 100 80 0 5.0 0 4.0 1.0 2.0 3.0 180 60 90 = 30 120 160 120 60 40 20 140 100 80 0 1.6 0 0.4 0.8 1.2 1.4 0.2 0.6 1.0 = 180 90 120 60 30 360 resistive, inductive loads 360 resistive, inductive loads 360 resistive, inductive loads natural convection 360 resistive loads 360 resistive loads 360 resistive loads natural convection
CR3KM-12 rev.1.00, aug.06.2004, page 5 of 7 breakover voltage vs. junction temperature junction temperature (c) 100 (%) breakover voltage (tj = tc) breakover voltage (tj = 25c) holding current vs. junction temperature holding current (ma) junction temperature (c) holding current vs. gate to cathode resistance gate to cathode resistance (k ? ) 100 (%) holding current (r gk = rk ? ) holding current (r gk = 1k ? ) ?40?200 20406080100120140160 160 0 80 100 120 140 40 60 20 160 60 ?20 ?40 0 20 40 80 100 120 140 10 2 7 5 3 2 10 1 7 5 3 2 10 0 7 5 3 2 10 ?1 10 ?1 10 1 7 5 3 2 10 0 257 7 10 1 10 0 7 5 3 2 10 2 4 4 4 3 25 4 3 # 23 10 ?1 5710 0 23 5710 1 23 5710 2 400 0 200 250 300 350 100 150 50 # 2 # 1 turn-on time vs. gate current turn-on time ( s) gate current (ma) turn-off time vs. junction temperature turn-off time ( s) junction temperature (c) junction temperature (c) 100 (%) repetitive peak reverse voltage (tj = tc) repetitive peak reverse voltage (tj = 25c) repetitive peak reverse voltage vs. junction temperature ?40 ?20 0 20 40 60 80 100 120 140 160 160 0 80 100 120 140 40 60 20 80 60 30 20 10 70 50 40 0 160 0 40 80 120 140 20 60 100 typical example r gk = 220 ? distribution v d = 12v r gk = 1k ? typical example typical example i gt (25c) 25 a # 1 50 a # 2 i gt (25c) # 33 a typical example v d = 100v ta = 25c v d = 50v, v r = 50v dv/dt = 5v/ s i t = 2a typical example distribution typical example
CR3KM-12 rev.1.00, aug.06.2004, page 6 of 7 gate trigger current vs. gate current pulse width 100 (%) gate trigger current (tw) gate trigger current (dc) gate current pulse width ( s) 10 2 23 10 0 5710 1 23 5710 2 23 5710 3 10 4 7 5 3 2 10 3 7 5 3 2 7 5 3 2 10 1 typical example 0.1s tw
CR3KM-12 rev.1.00, aug.06.2004, page 7 of 7 package dimensions to-220fn eiaj package code jedec code mass (g) (reference value) lead material ? 2.0 cu alloy ? symbol dimension in millimeters min typ max a a 1 a 2 b d e e x y 1 y zd ze 10 0.3 15 0.3 14 0.5 3 0.3 3.6 0.3 2.54 0.25 1.1 0.2 1.1 0.2 0.75 0.15 2.54 0.25 6.5 0.3 2.6 0.2 4.5 0.2 2.8 0.2 0.75 0.15 3.2 0.2 note 1) the dimensional figures indicate representative values unless otherwise the tolerance is specified. order code lead form standard packing quantity standard order code standard order code example straight type plastic magazine (tube) 50 type name CR3KM-12 lead form plastic magazine (tube) 50 type name ? lead forming code CR3KM-12-a8 note : please confirm the specificat ion about the shipping in detail.
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is a lways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placeme nt of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies o r errors. please also pay attention to information published by renesas technology corp. by various means, including the renesas techn ology corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under ci rcumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materi als. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500 fax: <1> (408) 382-7501 renesas technology europe limited. dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, united kingdom tel: <44> (1628) 585 100, fax: <44> (1628) 585 900 renesas technology europe gmbh dornacher str. 3, d-85622 feldkirchen, germany tel: <49> (89) 380 70 0, fax: <49> (89) 929 30 11 renesas technology hong kong ltd. 7/f., north tower, world finance centre, harbour city, canton road, hong kong tel: <852> 2265-6688, fax: <852> 2375-6836 renesas technology taiwan co., ltd. fl 10, #99, fu-hsing n. rd., taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology (shanghai) co., ltd. 26/f., ruijin building, no.205 maoming road (s), shanghai 200020, china tel: <86> (21) 6472-1001, fax: <86> (21) 6415-2952 renesas technology singapore pte. ltd. 1, harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas sales offices ? 200 4. re nesas technology corp ., all rights reser v ed. printed in ja pan. colophon .1.0


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