tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 1 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? applications ? repeaters ? mobile infrastructure ? lte / wcdma / cdma / gsm ? general purpose wireless ? tdd or fdd systems 2x2 mm 8 pin d fn package product features ? 50? 4000 mhz operating range ? 0 . 65 db noise figure @ 1 900 mhz ? 16.5 db gain @ 1 900 m hz ? +37 dbm output ip3 ? + 22.5 dbm p1db ? shut - down capability ? unconditionally stable ? 50 ohm cascadable gain block ? +5v single supply, 11 5 ma current ? 2x2 mm 8 pin dfn plastic package functional block diagram backside paddle - rf/dc gnd pin 1 reference mark 8 7 6 5 1 2 3 4 nc rf out shut down nc nc rf in nc nc general description the tqp3m9035 is a high - linearity, low noise gain block amplifier in a low - cost surface - mount package. at 1900 m hz, the amplifier typically provides 16.5 db gain, +37 dbm oip3, and 0. 65 db noise figure. the lna is also designed to be broadband without the requirement for external matching. the device is housed in a lead - free/green/rohs - compliant industry - standard 2x2 mm package. the tqp3m9035 has the benefit of having high linearity while also providing very low noise across a b road range of frequencies. this allows the device to be used in both receive and transmit chains for high performance systems. th e amplifier is internally matched using a high performance e - phemt process and only requires an external rf choke and blockin g/bypass capacitors for operation from a single +5v supply. the low noise amplifier integrates a shut - down biasing capability to allow for operation for tdd applications. the tqp3m9035 covers the 50 ? 4 000 m hz frequency band and is targeted for wireless in frastructure or other applications requiring high linearity and/or low noise figure. ordering information part no. description tqp3m903 5 high linearity lna gain block tqp3m903 5 - pcb 500 ? 4000 m hz eval . board standard t/r size = 2500 pieces on a 7 ree l. pin configuration pin # symbol 1, 3, 4, 5, 8 no connect or gnd 2 rf in 6 shut d own 7 rf out backside paddle rf/dc gnd
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 2 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? electrical specifications test conditions unless otherwise noted: +25c, v dd =+5v , 50 system. parameter conditions m in typ max units operational frequency range 50 4000 mhz test frequency 1900 mhz gain 15 16.5 18 db input return loss 1 3 db output return loss 10 db output p1db +20 + 23 dbm output ip3 pout=+ 4 dbm/tone, f=1 mhz +32.5 +37 dbm noise fi gure 0. 65 1.0 db power shutdown control (pin 6) on state 0 0.8 v off state (power down) 3 v dd v current, i dd on state 11 5 150 ma off state (power down) 3 ma shutdown pin current, i sd v pd 3 v 100 a thermal resistance, jc channel to ca se 50 c/w absolute maximum ratings parameter rating storage temperature ? 65 to 150 c supply voltage (v dd ) + 6 v rf input power, cw, 50,t = 25 c + 23 dbm operation of this device outside the parameter ranges given above may cause permanent dama ge. recommended operating conditions parameter min typ m ax units supply voltage (v dd ) +4.75 + 5 + 5.25 v t case ? 40 +85 c t j (for >10 6 hours mttf) 190 c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions.
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 3 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? device characterization data s - p arameter s test conditions unless otherwise noted: v dd =+5 v, i dd = 115 ma (typ.), temp=+25c, 50 ohm system freq ( g hz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang ) s22 (db) s22 (ang) 50 - 11.5 - 43.9 28.8 165.0 - 31.8 13.5 - 22.0 - 106.8 100 - 13.8 - 43.3 28.2 161.3 - 31.5 8.5 - 26.5 172.1 200 - 14.8 - 50.7 27.6 151.4 - 31.4 6.5 - 20.1 99.9 400 - 15.0 - 74.6 26.1 132.1 - 31.4 9.2 - 14.9 57.7 600 - 15.0 - 93.2 24.5 116.9 - 31.3 13.3 - 13.1 35.6 800 - 14.9 - 106.9 23.0 104.8 - 30.9 17.6 - 12.2 19.5 1000 - 15.0 - 117.2 21.6 94.8 - 30.3 21.5 - 11.8 6.5 1200 - 15.0 - 125.4 20.4 86.1 - 29.7 23.5 - 11.6 - 5.1 1400 - 15.1 - 131.8 19.4 78.2 - 29.0 25.1 - 11.4 - 16.0 1600 - 15.2 - 137.5 18.5 71.0 - 28.3 25.8 - 11.2 - 26.4 1800 - 15.4 - 142.3 17.6 64.2 - 27.6 25.5 - 11.0 - 36.2 2000 - 15.6 - 147.1 16.9 57.7 - 27.0 25.1 - 10.7 - 45.5 2200 - 15.8 - 151.7 16.2 51.4 - 26.4 24.4 - 10.4 - 54.5 2400 - 15.9 - 156.6 15.6 45.4 - 25.9 22.8 - 10.1 - 62.8 2600 - 16.1 - 161.5 1 5.0 39.5 - 25.4 21.2 - 9.7 - 70.6 2800 - 16.1 - 166.5 14.5 33.6 - 25.0 19.3 - 9.3 - 77.8 3000 - 16.5 - 174.6 14.0 27.9 - 24.6 17.4 - 8.7 - 82.9 3200 - 16.4 179.5 13.6 22.3 - 24.2 15.1 - 8.3 - 88.4 3400 - 16.0 176.3 13.2 16.8 - 23.8 12.8 - 8.0 - 94.5 3600 - 15.4 173.5 12.8 11.2 - 23.5 10.3 - 7.8 - 100.7 3800 - 14.8 170.9 12.5 5.6 - 23.2 7.9 - 7.6 - 106.8 4000 - 14.2 169.0 12.2 - 0.1 - 22.9 4.7 - 7.4 - 113.2 noise parameter s test conditions unless otherwise noted: v dd =+5 v, i dd =115 ma (typ.), temp=+25c, 50 ohm system freq ( m hz) n f min (db) magopt (mag) angopt (deg) rn ( ) 700 0.41 0.1 00 118 0.046 1 100 0. 50 0.127 140 0.048 1500 0.59 0.113 165 0.06 0 1 900 0.4 9 0.229 166 0.045 2300 0.59 0.267 179 0.048 2 700 0.74 0.3 00 - 166 0.051
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 4 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? tqp3m9035 - pcb evaluation board l1 c3 j4 j3 c4 r2 r1 c6 c5 j5 c1 c2 r3 u1 q1 j2 rf output j4 gnd j3 v dd 2 1,3,4,5,8 7 j1 rf input l1 68 nh (0603) c2 100 pf c1 100 pf c3 100 pf c4 1 uf r2 33k ? r1 10k ? j5 p d 6 notes: 1. see evaluation board pcb information section for material and stack -up. 2. r3 (0 jumper) is not shown on the schematic and may be replaced with copper trace in the target application layout. 3. all components are of 0402 size unless stated on the schematic. 4. c 1, c2, and c3 are non - critical values. the reactive impedance should be as low as possible at the frequency of operation for optimal performance. 5. the l1 value is non - critical and needs to provide high reactive impedance at the frequency of operation. 6. r1 a nd r2 are optional and do not need to be loaded if the shut - down functionality is not needed; i.e. fdd applications. if r1 and r2 are not loaded, the lna will operate in its standard on state. 7. a through line is included on the evaluation board to de - emb ed the board losses. bill of material - tqp3m9035 - pcb reference des. value description manuf. part number n/a n/a printed circuit board triquint 1084112 u1 n/a high linearity lna gain block triquint tqp3m903 5 r1 10k resistor, chip, 0402, 5%, 1/16w various various r2 33k resistor, chip, 0402, 5%, 1/16w various various r3 0 resistor, chip, 0402, 5%, 1/16w various various l1 68 nh inductor, 0603, 5%, ceramic various various c4 1.0 uf cap., chip, 0402, 10%, 10v, x5r various various c1, c2, c3, c5, c6 100 pf cap., chip, 0402, 5%, 50v, npo/cog various various j3, j4, j5 n/a solder turret various various see note 6. resistors are not needed if shut - down functionality is not used .
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 5 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? performance plots - tqp3m903 5 - pcb v dd = 5 v 0 5 10 15 20 25 30 0 500 1000 1500 2000 2500 3000 3500 4000 gain (db) frequency (mhz) gain vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 0 500 1000 1500 2000 2500 3000 3500 4000 input return loss (db) frequency (mhz) input return loss vs. frequency temp.=+25 c - 25 - 20 - 15 - 10 - 5 0 0 500 1000 1500 2000 2500 3000 3500 4000 output return loss (db) frequency (mhz) output return loss vs. frequency temp.=+25 c 20 21 22 23 24 25 0 500 1000 1500 2000 2500 3000 3500 4000 p1db (dbm) frequency (mhz) p1db vs. frequency 25 30 35 40 45 50 0 1 2 3 4 5 6 7 8 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone 900 mhz 1900 mhz 2600 mhz 0 0.5 1 1.5 2 0 500 1000 1500 2000 2500 3000 3500 4000 nf (db) frequency (mhz) noise figure vs. frequency - 20 0 20 40 60 80 100 120 140 0 1 2 3 4 5 idd (ma) shutdown voltage (v) idd vs. shutdown voltage +85 c +25 c - 40 c typical performance tqp3m9035 - pcb v dd = 5 v test conditions unless otherwise noted: v dd =+5 v, i dd =110 ma (typ.), temp=+25c parameter conditions typical value units frequency 900 1900 2600 mhz gain 22.0 16.5 14.0 db input return loss 14 1 3 15 db output return loss 13 10 8 db output p1db + 23 + 23 + 23 dbm o utput ip3 pout = +4 dbm/tone, f= 1 mhz +37.2 +37.0 +37.3 dbm noise figure (1) 0.55 0. 65 1.0 db notes: 1. noise figure data shown in the table above is de - embedded from the eval board loss.
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 6 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? performance plots - tqp3m9035 - pcb v dd = 3.3 v test conditions unles s otherwise noted: v dd =+3.3 v, i dd = 67 ma, t case = +25 c, 50 ? system 0 5 10 15 20 25 30 0 1000 2000 3000 4000 gain (db) frequency (mhz) gain vs. frequency temp.=+25 c - 20 - 15 - 10 - 5 0 0 1000 2000 3000 4000 |s11| (db) frequency (mhz) input return loss vs. frequency temp.=+25 c - 20 - 15 - 10 - 5 0 0 1000 2000 3000 4000 |s22| (db) frequency (mhz) output return loss vs. frequency temp.=+25 c 31 32 33 34 0 1 2 3 4 5 6 7 8 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone 900 mhz 1900 mhz temp.=+25 c 1 mhz tone spacing typical performance ? tqp3m9035 - pcb v dd = 3.3 v test conditions unless otherwise noted: v dd =+ 3.3 v, i dd = 67 ma (typ.), temp=+25c parameter conditions typical value units frequency 900 1900 mhz gain 21.2 15.8 db input return loss 11.4 11.9 db output return loss 15.6 10.6 db output p1db + 19 + 18.8 dbm o utput ip3 pout= +5 dbm/tone, f=1 mhz + 32.7 +33 dbm noise figure (1) 0. 55 0. 65 db notes: 1. noise figur e data shown in the table above is de - embedded from the eval board loss.
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 7 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? evaluation board pcb information triquint pcb 10 84112 material and stack - up 50 ohm line dimensions: width = .031, spacing = .035 pin configuration and description backside paddle - rf/dc gnd pin 1 reference mark 8 7 6 5 1 2 3 4 nc rf out shut down nc nc rf in nc nc pin no. symbol description 2 rf i n rf input pin. a dc block is required. 6 shut d own a high voltage turns off the device. if the pin is not connected or is less than 1v, then the device will operate under its normal operating condition. 7 rf o ut / dc b ias rf output pin. dc bias will also need to be injected through a rf bias choke/inductor for operation. 1, 3, 4, 5, 8 n c no electrical connection. provide grounded land pads for pcb mounting integrity. backside paddle rf/dc gnd rf/dc ground. use re commended via pattern to minimize inductance and thermal resistance; see pcb mounting pattern for suggested footprint.
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 8 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? pcb mounting pattern notes: 1. all dimensions are in millimeters. angles are in degrees. 2. use 1 oz. copper minimum for top and bot tom layer metal. 3. vias are required under the backside paddle of this device for proper rf/dc grounding and thermal dissipation. we recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10). 4. ensure good package backside paddle solder attach for reliable operation a nd best electrical performance. mechanical information package marking and dimensions marking: part number C 9035 lot code C xxxx notes: 1. all dimensions are in millimeters. angles are in degrees. 2. except where noted, this part outline conforms to jedec standard mo - 220, issue e (variation vggc) for thermally enhanced plastic very thin fine pitch quad flat no lead package (qfn). 3. dimension and tolerance formats conform to asme y14.4m - 1994. 4. the terminal #1 identifier and terminal numbering conform to jesd 95 - 1 spp -012. 9035 xxxx
tqp3m903 5 high linearity lna gain block data sheet: rev e 10/2 9 /2012 - 9 of 9 - disclaimer: subject to change without notice ? 201 2 triquint semiconductor, inc. connectin g the digital world to the global network ? product compliance information esd sensitivity ratings esd rating: class 1a value: passes 250 v to < 500 v test: human body model (hbm) standard: jedec standard jesd22 - a114 esd rating: class i v value: passes 1000 v test: charged device model (cdm) standard: jedec standard jesd22 - c101 solderability compatible with both lead - free (260 c max. reflow temperature) and tin/lead (245 c max. reflow temperature) soldering processes. package contact plating: nipdau rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substan ces in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating msl rating : level 1 test: 260c convection r eflow standard: jedec standard ipc/jedec j - std - 020 contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability wh atsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything descr ibed by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe person al injury or death.
|
