ldbk2643/h round type led lamps data sheet 30 - mar. doc. no : qw0905- rev. : date : b - 2009 ldbk2643/h ligitek electronics co.,ltd. property of ligitek only pb lead-free parts l dcc
ligitek electronics co.,ltd. property of ligitek only package dimensions page 1/5 part no. ldbk2643/h note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation x 30 60 x x 0 100% 75% 50% 25% 0 25% x -30 -60 x 100% 75% 50% 4.3 3.3 1.5 max ?? 0.5 typ 1.0min 25.0min 2.54typ 3.1 2.9 + -
parameter power dissipation peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) storage temperature ingan/gan material operating temperature note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. absolute maximum ratings at ta=25 j typical electrical & optical characteristics (ta=25 j ) ldbk2643/h part no forward current v 150 esd luminous intensity @20ma(mcd) forward voltage @20ma(v) water clear blue color emitted lens 470 30 3.5 4.0 spectral halfwidth ??f nm wave length f nm d dominant typ. max. 30 700 350 viewing angle 2 c 1/2 (deg) typ. min. t opr tstg -30 ~ +100 -20 ~ +80 j j ir pd i fp i f 120 50 100 30 symbol dbk ratings g a mw ma ma unit page 2/5 ligitek electronics co.,ltd. property of ligitek only * static electricity or power surge will damage the led. use of a c onductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. part no. ldbk2643/h
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.0 3.0 4.0 0 1 1.0 relative intensity@20ma wavelength (nm) 450 0.0 400 500 550 0.5 0.5 relative intensity@20ma normalize @25 j forward voltage@20ma normalize @25 j 20 ambient temperature( j ) ambient temperature( j ) 0 -20 -40 0.8 0 -40 -20 100 80 60 40 20 0.0 60 100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 relative intensity normalize @20ma forward current(ma) forward current(ma) forward voltage(v) 2.0 5.0 1 10 0.0 0.5 1.0 1.5 2.0 100 1000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip page 3/5 part no. ldbk2643/h
page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 5 /sec max 260 c3sec max temp(c) 260x 150 100 time(sec) 50 2 /sec max 25x 0 0x preheat note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 120x dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max part no. ldbk2643/h
reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test item operating life test test condition reliability test: high temperature storage test 1.ta=105 j ? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test 1.ta=-40 j ? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 thermal shock test solder resistance test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202:103b jis c 7021: b-11 high temperature high humidity test 1.ta=65 j ? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs the purpose of this test is the resistance of the device under tropical for hours. page 5/5 part no. ldbk2643/h
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