lead-free parts pb ligitek electronics co.,ltd. property of ligitek only rectangle type led lamps data sheet doc. no : qw0905-LI5130-PF rev. : a date : 14 - aug. - 2006 LI5130-PF
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only + - 25.0min 2.54typ 1.0min 0.5 typ 1.5 max LI5130-PF part no. 1/5 page 7.0 0.7 2.8 2.0 5.0
page ligitek electronics co.,ltd. property of ligitek only viewing angle 2 1/2 (deg) -40 ~ +100 tstg storage temperature material typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part no LI5130-PFgaasp/gap 20 forward voltage @ ma(v) luminous intensity @10ma(mcd) peak wave length pnm spectral halfwidth nm red diffused lens emitted orange 635 1.7 min. 45 2.6 max. 8.0 typ. 4.5 min. 88 color absolute maximum ratings at ta=25 operating temperature power dissipation peak forward current duty 1/10@10khz reverse current @5v parameter forward current i f pd i fp t opr ir symbol ma 30 10 -40 ~ +85 100 120 a ma mw i ratings unit 2/5 part no. LI5130-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 e - i chip page3/5 part no. LI5130-PF
60 seconds max page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 260 c3sec max 5 /sec max temp( c) 260 time(sec) 150 100 2 /sec max 120 0 25 50 0 preheat dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LI5130-PF
5/5 page reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test itemtest condition reliability test: high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test solderability test 1.t.sol=230 5 2.dwell time=5 1sec the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. part no. LI5130-PF
|
