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july 29, 2011 www.clare.com 1 rohs 2002/95/ec e 3 pb features ? eight (8) outputs rated at 60v, 80ma ? push-pull driver configuration ? 6v to 60v driver supply range ? 2.7v to 5.5v logic supply range ? 3-wire serial interface plus chip select ? captures serial & parallel input data ? outputs can be paralleled ? 28-lead qfn package applications ? white goods ? at e ? industrial equipment description the MX877 is an 8-channel, high voltage switch with 8-bit parallel or serial input control. the MX877 connects directly to a microprocessor through a standard 3-wire serial interface. the push-pull output configuration can drive up to 60 volts at 80ma. outputs can be paralleled for increased drive current up to a device total of 400ma, sink or source. the MX877 is designed to operate over a temperature range of -40c to +85c, and is available in a 28-lead qfn package. ordering information functional block diagram part description MX877r qfn-28 (73/tube) MX877rtr qfn-28 tape & reel (2500/reel) parallel inp u ts shift direction v cc v p w r cs* sdo i n 7 i n 6 out7 i n 5 i/o register latch register dri v er out6 i n 4 out5 i n 3 out4 i n 2 out3 i n 1 out2 i n 0 out1 out0 sck sdi oe g n d parallel in & o u t le v el translator MX877 8-channel, 60v driver with push-pull output, 3 wire interface
MX877 2 www.clare.com july 29, 2011 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.4 dc electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.5 dynamic electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.6 serial timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.7 parallel timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2. functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 parallel in / parallel out application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 serial cascade application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3 control system application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.2 esd sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.3 reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.4 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
MX877 july 29, 2011 www.clare.com 3 1 specifications 1.1 package pinout 1.2 pin description bottom v ie w 7 6 5 4 3 2 1 15 16 17 1 8 19 20 21 14 13 12 11 10 9 8 22 23 24 25 26 27 2 8 pin# name description 1out7 parallel output 2n/c no connection 3gnd ground 4 v pwr high voltage supply (6v to 60v) 5n/c no connection 6 v cc logic supply (2.7v to 5.5v) 7sdo serial data output 8in7 parallel input 9in6 parallel input 10 in5 parallel input 11 in4 parallel input 12 in3 parallel input 13 in2 parallel input 14 in1 parallel input 15 in0 parallel input 16 sck serial clock 17 v pwr high voltage supply (6v to 60v) 18 sdi serial data input 19 cs* chip select (active low) 20 oe output enable 21 gnd ground 22 out0 parallel output 23 out1 parallel output 24 out2 parallel output 25 out3 parallel output 26 out4 parallel output 27 out5 parallel output 28 out6 parallel output
MX877 4 www.clare.com july 29, 2011 1.3 absolute maximum ratings voltages with respect to gnd=0v. absolute maximum electrical ratings are at 25c absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operatio n of the device at these or any other conditions beyo nd those indicated in the operational sections of this data sheet is not implied. exposure of the device to the absolute maximum ratings for an extended period may degrade the device and affect its reliability. esd warning: esd (electrostatic discharge) sensitive device. alth ough the MX877 features proprietary esd protection circuitry, permanent damage may be sustained if subjected to hi gh energy electrostatic discharges. proper esd precautions are recommended to avoid performance degradation or loss of functionality. 1.4 dc electrical characteristics v cc =5v, v pwr =42v, t a =25c, unless otherwise specified. notes: to avoid unwanted output during v pwr application and system initializati on, keep oe at a logic low until cs* has completed one cycle. thermal resistance is measured in still air with th e device soldered to a 6 square inch board without a ground plane. applications may require derating of t he specified maximum currents to avoid exceeding the maximum operation junction temperature. parameter symbol min max units v pwr supply voltage v pwr -60v logic supply voltage v cc -6v input pin voltage vin - 6 v continuous output current out0 - out7 i outn -100ma operating junction temperature t j -150c thermal resistance (junction to ambient) r ? ja 110 typical c/w operating temperature t a -40 85 c storage temperature t stg -55 150 c parameter conditions symbol minimum typical maximum units logic supply voltage - v cc 2.7 - 5.5 v logic supply current f sck =5mhz i cc -50- ? a quiescent logic supply current f sck =0 i cc --1 ? a v pwr voltage - v pwr 6-60v v pwr current total of all outputs i pwr - - 400 ma gnd current total of all outputs ---400ma quiescent v pwr current v pwr =42v, no load i pwr -0.75-ma high level input voltage in0-in7, sck, sdi, oe, cs* v ih v cc -0.5 --v low level input voltage - v il --0.5v input leakage current - --1 ? a sdo tri-state leakage current cs*=logic high --1 ? a out0-out7 current any one output, sink or source i outn --80ma out0-out7 on resistance v pwr =42v r outn -9- ? out0-7 tri-state leakage current oe=logic low i outn --1 ? a
MX877 july 29, 2011 www.clare.com 5 1.5 dynamic electrical characteristics v cc =5v, v pwr =42v, t a =25c, unless otherwise specified. parameter conditions symbol minimum typical maximum units sck period - - 100 - dc ns sck high time - - 40 - - ns sck low time - - 40 - - ns cs* high time - tcswh 50 - - ns cs* falling to sck rising setup time tcss 150 - - ns cs* low time sck low (parallel input mode) tcswl 150 - - ns inx to cs falling (setup time) -tins15--ns inx to cs falling (hold time) -tinh30--ns sdi to sck rising (setup time) - tsdis 20 - - ns sdi to sck rising (hold time) - tsdih 25 - - ns sck falling to to sdo data valid -tsdo-10-ns cs* rising to sdo high z -tsdoz-12-ns cs* rising to outx rising to 50%, c(outx)=1000pf toutr - 750 - ns cs* rising to outx falling to 50%, c(outx)=1000pf toutf - 570 - ns outx rise time from 10% to 90%, c(outx)=1000pf - - 110 - ns outx fall time from 10% to 90%, c(outx)=1000pf - - 75 - ns oe rising to outx rising to 90% - - 580 - ns oe rising to outx falling to 90% - - 390 - ns oe falling to outx high z to 10%, outx high - - 130 - ns to 10%, outx low - - 90 - ns
MX877 6 www.clare.com july 29, 2011 1.6 serial timing 1.7 parallel timing inx cs* sck sdi sdo outx tinh tins tcss tsdis tsdih tsdo tcswh tsdoz toutr toutf inx cs* outx tins tinh tcswl toutr toutf
MX877 july 29, 2011 www.clare.com 7 2 functional description the MX877 is an 8 channel high voltage driver with 8-bit input control. the MX877 interfaces to a microprocessor through a standard 3 wire serial interface and an active-low chip select, or can be used in a parallel-in, parallel-out configuration. parallel data is transferred to the i/o register of the MX877 through the parallel input pins, in0 through in7 on the falling edge of the chip select pin, cs*. when cs* is in a logic low state, serial data can be transferred to the i/o register through the serial input pin, sdi, and from the i/o register through the serial output pin, sdo. parallel or serial input data is transferred from the i/o register to the latch and high voltage output drivers, out0 through out7, on the positive edge of cs*. this data remains latched until the next positive edge of cs*. the 8-bit i/o shift register is clocked by the serial clock pin, sck. serial data pr esented at the sdi pin is transferred to the shift register on the positive edge of sck. data shifts out of the register through the sdo pin on the negative edge of sck. sdi and sck are ignored, and sdo transitions to a high impedance condition when cs* is at a logic high state. serial data is received by the MX877 through the sdi pin. this data is accepted on the rising edge of sck. a specific output is programmed to a logic high state if sdi is at a logic high state during the rising edge of sck. conversely, a specific output is programmed to a logic low state if sdi is at a logic low state during the rising edge of sck. outputs transition to their programmed states on the positive edge of cs* if the output enable pin, oe is in a logic high state. the msb input data (in7) is presented at the serial output pin, sdo on the falling edge of cs*. input data from in6 through in0 is sequentially presented at sdo on negative sck transitions if cs* remains in a logic low state. if cs* is at a logic low state beyond 8 cycles of sck, sdi data that has propagated through the i/o register will then be presented at sdo. the sdo pin transitions to a high impedance state when cs* is in a logic level high state, thus allowing multiple serial peripherals to share the microprocessor data pin. figure 1. serial data transfer example devices may be serially cascaded by connecting sdo to sdi of the next device. pins sck and cs* are common to all devices in serial cascade. for n-cascaded devices the cs* should remain low for 8n cycles of sck. an output enable pin, oe enables the driver outputs out0 through out7 when logic high. a logic low level on oe forces the out0 through out7 outputs to a high impedance state. the MX877 can also operate as a parallel-in, parallel-out level shifter and driver. sck must remain at a logic low state when operating in this mode. parallel input data presented to in0 through in7 is captured on the falling edge of cs*. this data is transferred to out0 through out7 on the rising edge of cs*, and remains latched until the next rising edge of cs*. 0 0 0 00 0 0 00 0 0 0 1 1 1 1 111 1111 0 i n 7 i n 6 i n 5 i n 4 i n 3 i n 2 i n 1 i n 0 sdi sck cs * sdo t1 sdi at time t1 1 1 1 0 0 0 0 0 out7 out6 out5 out4 out3 out2 out1 out0
MX877 8 www.clare.com july 29, 2011 3 application examples 3.1 parallel in / parallel out application 3.2 serial cascade application i n out 8 8 cs* sdi oe sck master i n sdo i n out 8 8 sck cs* oe sdi sdo i n out 8 8 sck cs* oe sdi master out
MX877 july 29, 2011 www.clare.com 9 3.3 control system application system mx 8 77 capt u re sensors i n 8 sdi sdo dri v e sck c act u ators out cs* 8 oe type 1 timing: capt u re n dri v e n analyze n , calc u late n +1 capt u re n +1 dri v e n +1 cs* sdi c o u tp u t n c o u tp u t n +1 sck sdo inp u t n c inp u t n +1 c type 2 timing: capt u re n analyze n , calc u late n +1 dri v e n +1 capt u re n +1 cs* sdi don't care c o u tp u t n +1 sck sdo inp u t n c
MX877 10 www.clare.com july 29, 2011 4 manufacturing information 4.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 4.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 4.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device moisture sensitivity level (msl) rating MX877r msl 3 device maximum temperature x time MX877r 260c for 30 seconds rohs 2002/95/ec e 3 pb
MX877 july 29, 2011 www.clare.com 11 4.4 mechanical dimensions 4.4.1 qfn-28 package & recommended pcb land pattern 4.4.2 tape & reel dimensions n otes: (unless other w ise specified) 1. coplanarity applies to the exposed heat sink sl u g as w ell as the terminals. 2. dimensions and tolerancing conform to asme y14.5m-1994. 3. molded package shall conform to jedec standard config u ration mo-220 v ariation v hhd-1. dimensions mm min / mm max (inches min / inches max) pin 1 ref 2 1 28 5.00 bsc (0.197 bsc) 5.00 bsc (0.197 bsc) 0.200 ref (0.008 ref) 0.80 / 1.00 (0.031 / 0.039) 0.00 / 0.05 (0.000 / 0.002) 3.00 / 3.25 (0.118 / 0.128) 3.00 / 3.25 (0.118 / 0.128) 0.45 / 0.65 (0.018 / 0.026) 0.18 / 0.30 (0.007 / 0.012) 0.500 bsc (0.0197 bsc) 0.50 (0.020) 1.00 (0.039) 0.30 (0.012) 4.70 (0.185) 3.25 (0.128) 4.70 (0.185) 3.25 (0.128) em b ossment em b ossed carrier to p c o v er tape thickness 0.066 max. (0.0026 max.) 330.2 dia. (13.00 dia.) n otes: 1. a0 & b0 meas u red at 0.3mm a b o v e b ase of pocket. 2. 10 pitches c u m u lati v e tol. 0.2mm dimensions mm (inches) b o =5.30 0.10 (0.209 0.004) a o =5.30 0.10 (0.209 0.004) k o =1.10 0.10 (0.043 0.004) b b a a section b-b section a-a 4.00 0.10 (0.157 0.004) 2.00 0.05 (0.079 0.002) ?1.55 0.05 (?0.061 0.002) 8 .00 0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 5.50 0.05 (0.217 0.002) 1.75 0.10 (0.069 0.004) r0.50 typ (r0.020 typ) ?1.50 mi n (?0.059 mi n ) for additional information please vi sit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-MX877-20110729 ?copyright 2011, clare, inc. all rights reserved. printed in usa. 7/29/2011

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