doc. no : qw0905- rev. : date : data sheet round type led lamps LDGM2040 ligitek electronics co.,ltd. property of ligitek only LDGM2040 08 - nov. - 2006 a lead-free parts pb
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions directivity radiation part no. LDGM2040 ligitek electronics co.,ltd. property of ligitek only page 1/5 25% -60 100% 75% 50% -30 75% 025%50% 0 30 60 100% + - 3.0 4.2 5.2 1.5 max 1.0min 2.54typ 25.0min 0.5 typ 4.0
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr esd symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 120 -30 ~ +100 -20 ~ +80 ir 150 50 ratings dgm 100 30 mw v a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 34 viewing angle 2 1/2 (deg) min. 900 20 typ. 3.5 forward voltage @ ma(v) max. 4.0 peak wave length pnm 518 spectral halfwidth nm 36 typ. luminous intensity @20ma(mcd) 1500 emitted green part no LDGM2040 material ingan/gan lens color green diffused dominant wave length dnm 525 * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. LDGM2040 part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 450550600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 dgm chip 3/5 page LDGM2040 part no.
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. LDGM2040 part no.
page 5/5 description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 reliability test: high temperature storage test operating life test test item low temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 high temperature high humidity test solderability test solder resistance test thermal shock test LDGM2040 part no.
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