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?products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by aptin a without notice. products are only warranted by aptina to meet aptinas production data sheet specifications. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance ? pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 1 ?2009 aptina imaging corporation all rights reserved. 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die MT9M114 die data sheet for the product data sheet, refer to aptinas web site: www.aptina.com features ? digitalclarity ? cmos imaging technology ? system-on-a-chip (soc)? completely integrated camera system ? ultra low-power, low-cost cmos image sensor ? superior low-light performance ? electronic rolling shutter (ers) ? up to 30 fps progressive scan for high-quality video at 720p resolution ? on-die image flow processor (ifp) performs sophisticated processing: color recovery and correction, sharpening, gamma, lens shading correction, on-the-fly defect correction, zoom ? image decimation to arbi trary size with smooth, continuous zoom and pan ? automatic exposure, white balance and black compensation, color saturation, and defect identification and correction, aperture correction ? two-wire serial programming interface ? progressive itu-r bt.656 (ycbcr), yuv, 565rgb, 555rgb, or 444rgb output data formats ? adaptive polynomial lens shading correction ?uvc interface ? perspective correction ? multi-camera sync general physical specifications ? die thickness: 200 m 12 m (consult factory for other die thickness) ? back side die surface of polished bare silicon ? typical metal 1 thickness: 3.1 k? ? typical metal 2 thickness: 3.1 k? ? typical metal 3 thickness: 3.1 k? ? typical metal 4 thickness: 4.15 k? ? metallization composition: 99.5 percent al and 0.5 percent cu over ti ? typical topside passivation: 2.2 k? nitride over 5.0 k? of undoped oxide ? passivation openings (min): 75 m x 90 m die database ? die outline, see figure 2 on page 9 ? singulated die size (nominal dimension): 3858 m 25 m x 4658 m 25 m ? ?bond pad location and identification tables?, see page 5?8 order information die: MT9M114d00stck24bc1 note: consult die distributor or factory before order- ing to verify long-term availability of these die products. key performance parameters ? optical format: 1/6-inch (4:3) ? active imager size: 2.45 mm(h) x 1.84 mm(v), 3.06 mm diagonal ? active pixels: 1296 h x 976 v (1.2mp) ? pixel size:1.9 m x 1.9 m ? color filter array: rgb bayer pattern ? shutter type: electronic rolling shutter (ers) ? maximum data rate/mas ter clock: 48 mps/96 mhz ? frame rate: 720p (1280 h x 720 v) 30 fps at 96 mhz (default), assuming a 24mhz extclk ? adc resolution: 10-bit, on die ? responsivity: 0.95v /lux-sec (550 nm) ? pixel dynamic range: 70 db ?snr max: 40 db ? supply voltage: - i/o digital: 1.8 v or 2.8 v - core digital: 1.8 v - analog: 2.8 v ? pll voltage:2.8v ? mipi voltage:1.8v ? typical power consumption: 150.7 mw ? operating temperature: ?30c to +70c ? chief ray angle (cra): 25.18 options ?form ? die d ?testing ? standard (level 1) probe c1 product# MT9M114d00stck224bc1 form temp chrom die database testing level
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 2 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance general description the aptina MT9M114 die is a 1.2mp-format 1/ 6-inch cmos active-pixel digital image sensor using aptina?s latest digital image flow processor (ifp) technology. the MT9M114 has an active imaging pixel array of 1296 x 976, capturing high-quality color images at 1.2mp resolution. the sensor is a complete camera system-on-a-chip solution and is designed specifically to meet the demands of products in pc and notebook camera applications. it incorporates multiple soph isticated on-die camera functions and is programmable through a simple two-wire serial interface. this soc (system-on-a-chip) 1.2mp cmos image sensor die features digitalclarity ? ?aptina?s breakthrough, low-noise cmos imaging technology that achieves near- ccd image quality (based on signal-to-noise ratio and low-light sensi- tivity) while maintaining the inherent size, cost, and integration advantages of cmos. the MT9M114 die is a fully-automatic, single-chip camera, requiring only a power supply, lens and clock source for basic operation. output video is streamed through a parallel 8-bit d out or mipi port as shown in figure 1 on page 3. output pixel clock is used to latch the data, while frame_valid and line_valid signals indicate the active video. output pads can also be tri-stated by de-asserting the oe_bar signal. the MT9M114 die internal registers can be configured using a two-wire serial interface. die testing procedures aptina imager die products are tested with a standard probe (c1) test. wafer probe is performed at an elevated temperature to test product functionality in aptina?s standard package. because the package environment is not within aptina?s control, the user must determine the necessary heat sink requirements to ensure that the die junction temper- ature remains within specified limits. image quality is verified through various imag ing tests. the probe functional test flow provides test coverage for the on-die a/d converter, logic, serial interface bus, and pixel array. test conditions, margins, limits, and test sequence are determined by individual product yields and reliability data. aptina retains a wafer map of each wafer as part of the probe records, along with a lot summary of wafer yields for each lot probed . aptina reserves the right to change the probe program at any time to improve the reli ability, packaged device yield, or perfor- mance of the product. die users may experience differences in performance relative to aptina?s data sheets. this is due to differences in package capacitance, inductance, resistance, and trace length. functional specifications the specifications provided in this document are for reference only. for target functional and parametric specifications, refer to the product data sheet found on aptina?s web site.
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 3 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance bonding instructions the MT9M114 imager die has 55 bond pads. refer to table 1 on page 5 and table 2 on page 7 for a complete list of bond pads and coordinates. the MT9M114 imager die does not require the user to determine bond option features. the MT9M114 imager die also has several pads defined as ?do not use.? these pads are reserved for engineering purposes and should not be used. bonding these pads could result in a nonfunctional die. figure 1 on page 3 shows the MT9M114 typical die connections. for low-noise opera- tion, the MT9M114 die requires separate supplies for analog and digital power. storage requirements aptina die products are packaged for shipping in a cleanroom environment. upon receipt, the customer should transfer the die to a similar environment for storage. aptina recommends the die be maintained in a filt ered nitrogen atmosphere until removed for assembly. the moisture content of the stor age facility should be maintained at 30 percent relative humidity 10 percent. esd damage precautions are necessary during handling. the die must be in an esd-protected environment at all times for inspection and assembly. figure 1: typical configuration (connection) notes: 1. this typical configuration shows only one scenario out of multiple possible variations for this sensor. 2. if a mipi interface is not required, the following signals must be left floating: data_p, data_n, clk_p, and clk_n. the vdd_phy power signal must always be connected to the 1.8v supply. 3. only one of the output modes (serial or parallel) can be used at any time. v aa 7 analog power s data sclk frame_valid pixclk line_valid s addr gnd_pll a gnd v dd _phy i/o 5 power digital core power v dd pll power v dd _pll v aa two-wire serial interface parallel port or 4 r pull-up 5 reset_bar 6 extclk external clock in (6C54 mhz) active low reset d gnd d out [7:0] v dd 7 clk_p data_p clk_n mipi serial port data_n v dd _phy 2, 7 v dd _pll 7 v dd _io 5, 7 phy 2 power v dd _io oe_bar trst_bar 8
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 4 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance 4. aptina recommends a 1.5k resistor value for the two-wire serial interface r pull - up ; however, greater values may be used for slower transmission speed. 5. all inputs must be configured with v dd _io. 6. reset_bar has an internal pull-up resistor and can be left floating. 7. aptina recommends that 0.1 f and 1 f decoupling capacitors for each power supply are mounted as close as possible to the pad. actual values and numbers may vary depending on layout and design con- siderations. 8. trst_bar connects to gnd for normal operation. decoupling capacitor recommendations it is important to provide clean, well-regulated power to each power supply. the customer is ultimately responsible for ensuring that clean power is provided for their own designs because hardware design is influenced by many factors, such as layout, operating conditions, and component selection. the recommendations for capacitor placement and values listed below are based on our internal demo camera design and verified in hardware. in order of preference, aptina recommends: 1. mount 0.1f and 1f decoupling capacitors for each power supply as close as possi- ble to the pad and place a 10 f capacitor nearby off-module. 2. if module limitations allow for only six decoupling capacitors for a three-regulator design (v dd _pll tied to v aa ), use a 0.1f and 1f capacitor for each of the three regu- lated supplies. aptina also recommends placing a 10 f capacitor for each supply off- module, but close to each supply. 3. if module limitations allow for only three decoupling capacitors, use a 1f capacitor (preferred) or a 0.1 f capacitor for each of the three regulated supplies. aptina also recommends placing a 10 f capacitor for each supply off-module but close to each supply. 4. give priority to the v aa supply for additional decoupling capacitors. inductive filtering components are not recommended. follow best practices when performing ph ysical layout. refer to technical note tn-09-131.
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 5 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance bond pad location and identification tables table 1: bond pad location and identification from center of pad 1 pad number pad name x 1 microns y 1 microns x 1 inches y 1 inches 1gnd_pll00 0 0 0 2 flash 4496.98 C129.775 0.177046457 C0.005109252 3v dd 3 4496.98 C279.775 0.177046457 C0.011014764 4 pixclk 4496.98 C429.775 0.177046457 C0.016920276 5 extclk 4496.98 C579.775 0.177046457 C0.022825787 6 gnd7 4496.98 C729.775 0.177046457 C0.028731299 7 gnd6 4496.98 C879.775 0.177046457 C0.034636811 8reserved 2 4496.98 C1029.775 0.177046457 C0.040542323 9v dd _io4 4496.98 C1179.775 0.177046457 C0.046447835 10 chain 4496.98 C1329.775 0.177046457 C0.052353346 11 trst_bar 4496.98 C1488.28 0.177046457 C0.058593701 12 config 4496.98 C1642.13 0.177046457 C0.064650787 13 s addr 4496.98 C1792.13 0.177046457 C0.070556299 14 s clk 4496.98 C1942.13 0.177046457 C0.076461811 15 v dd 2 4496.98 C2092.13 0.177046457 C0.082367323 16 s data 4496.98 C2242.13 0.177046457 C0.088272835 17 oe_bar 4496.98 C2392.13 0.177046457 C0.094178346 18 gnd5 4496.98 C2542.13 0.177046457 C0.100083858 19 reset_bar 4496.98 C2692.13 0.177046457 C0.10598937 20 reserved 2 4153.505 C3464.74 0.163523819 C0.136407087 21 v aa 0 3986.4 C3464.74 0.156944882 C0.136407087 22 v aa 1 3876 C3464.74 0.152598425 C0.136407087 23 a gnd 0 3726 C3464.74 0.146692913 C0.136407087 24 a gnd 1 3615.6 C3464.74 0.142346457 C0.136407087 25 reserved 2 3465.6 C3464.74 0.136440945 C0.136407087 26 d out 7 3248.505 C3464.74 0.127893898 C0.136407087 27 v dd _io0 3098.505 C3464.74 0.121988386 C0.136407087 28 d out 6 2948.505 C3464.74 0.116082874 C0.136407087 29 gnd0 2798.505 C3464.74 0.110177362 C0.136407087 30 d out 5 2648.505 C3464.74 0.10427185 C0.136407087 31 d out 4 2483.975 C3464.74 0.097794291 C0.136407087 32 v dd _io1 2334.345 C3464.74 0.091903346 C0.136407087 33 d out 3 2184.345 C3464.74 0.085997835 C0.136407087 34 d out 2 2019.815 C3464.74 0.079520276 C0.136407087 35 gnd1 1870.185 C3464.74 0.073629331 C0.136407087 36 d out 1 386.21 C3464.74 0.015205118 C0.136407087 37 v dd 0 236.21 C3464.74 0.009299606 C0.136407087 38 gnd2 0 C3234 0 C0.127322835 39 d out 0 0 C3076.8 0 C0.121133858 40 v dd _io2 0 C2919.6 0 C0.114944882 41 frame_valid 0 C2762.4 0 C0.108755906 42 gnd8 0 C2605.2 0 C0.102566929 43 line_valid 0 C2448 0 C0.096377953
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 6 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance notes: 1. reference to center of each bond pad from center of bond pad 1. 2. dnu = do not use. see bonding instructions on page 3. 44 v dd _io3 0 C2290.8 0 C0.090188976 45 d out _lsb1 0 C2133.6 0 C0.084 46 gnd3 0 C1976.4 0 C0.077811024 47 dout_lsb0 0 C1819.2 0 C0.071622047 48 v dd 1 0 C1662 0 C0.065433071 49 gnd4 0 C1504.8 0 C0.059244094 50 v dd _phy0 0 C1347.6 0 C0.053055118 51 data_p 0 C1166.24 0 C0.045914961 52 data_n 0 C946.24 0 C0.037253543 53 clk_n 0 C558.56 0 C0.021990551 54 clk_p 0 C338.56 0 C0.013329134 55 v dd _pll0 0 C157.2 0 C0.006188976 table 1: bond pad location and identification from center of pad 1 (continued) pad number pad name x 1 microns y 1 microns x 1 inches y 1 inches
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 7 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance table 2: bond pad location and identification from center of die (0,0) pad number pad name "x" 1 microns "y" 1 microns "x" 1 inches "y" 1 inches 1 gnd_pll0 C2248.49 1616.45 C0.088523228 0.063639764 2 flash 2248.49 1486.675 0.088523228 0.058530512 3v dd 3 2248.49 1336.675 0.088523228 0.052625 4 pixclk 2248.49 1186.675 0.088523228 0.046719488 5 extclk 2248.49 1036.675 0.088523228 0.040813976 6 gnd7 2248.49 886.675 0.088523228 0.034908465 7 gnd6 2248.49 736.675 0.088523228 0.029002953 8reserved 2 2248.49 586.675 0.088523228 0.023097441 9v dd _io4 2248.49 436.675 0.088523228 0.017191929 10 chain 2248.49 286.675 0.088523228 0.011286417 11 trst_bar 2248.49 128.17 0.088523228 0.005046063 12 config 2248.49 C25.68 0.088523228 C0.001011024 13 s addr 2248.49 C175.68 0.088523228 C0.006916535 14 s clk 2248.49 C325.68 0.088523228 C0.012822047 15 v dd 2 2248.49 C475.68 0.088523228 C0.018727559 16 s data 2248.49 C625.68 0.088523228 C0.024633071 17 oe_bar 2248.49 C775.68 0.088523228 C0.030538583 18 gnd5 2248.49 C925.68 0.088523228 C0.036444094 19 reset_bar 2248.49 C1075.68 0.088523228 C0.042349606 20 reserved 2 1905.015 C1848.29 0.075000591 C0.072767323 21 v aa 0 1737.91 C1848.29 0.068421654 C0.072767323 22 v aa 1 1627.51 C1848.29 0.064075197 C0.072767323 23 a gnd 0 1477.51 C1848.29 0.058169685 C0.072767323 24 a gnd 1 1367.11 C1848.29 0.053823228 C0.072767323 25 reserved 2 1217.11 C1848.29 0.047917717 C0.072767323 26 d out 7 1000.015 C1848.29 0.039370669 C0.072767323 27 v dd _io0 850.015 C1848.29 0.033465157 C0.072767323 28 d out 6 700.015 C1848.29 0.027559646 C0.072767323 29 gnd0 550.015 C1848.29 0.021654134 C0.072767323 30 d out 5 400.015 C1848.29 0.015748622 C0.072767323 31 d out 4 235.485 C1848.29 0.009271063 C0.072767323 32 v dd _io1 85.855 C1848.29 0.003380118 C0.072767323 33 d out 3 C64.145 C1848.29 C0.002525394 C0.072767323 34 d out 2 C228.675 C1848.29 C0.009002953 C0.072767323 35 gnd1 C378.305 C1848.29 C0.014893898 C0.072767323 36 d out 1 C1862.28 C1848.29 C0.07331811 C0.072767323 37 v dd 0 C2012.28 C1848.29 C0.079223622 C0.072767323 38 gnd2 C2248.49 C1617.55 C0.088523228 C0.063683071 39 d out 0 C2248.49 C1460.35 C0.088523228 C0.057494094 40 v dd _io2 C2248.49 C1303.15 C0.088523228 C0.051305118 41 frame_valid C2248.49 C1145.95 C0.088523228 C0.045116142 42 gnd8 C2248.49 C988.75 C0.088523228 C0.038927165 43 line_valid C2248.49 C831.55 C0.088523228 C0.032738189 44 v dd _io3 C2248.49 C674.35 C0.088523228 C0.026549213
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 8 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance notes: 1. reference to center of each bond pad from center of die (0, 0). 2. dnu = do not use. see bonding instructions on page 3. 45 d out _lsb1 C2248.49 C517.15 C0.088523228 C0.020360236 46 gnd3 C2248.49 C359.95 C0.088523228 C0.01417126 47 dout_lsb0 C2248.49 C202.75 C0.088523228 C0.007982283 48 v dd 1 C2248.49 C45.55 C0.088523228 C0.001793307 49 gnd4 C2248.49 111.65 C0.088523228 0.004395669 50 v dd _phy0 C2248.49 268.85 C0.088523228 0.010584646 51 data_p C2248.49 450.21 C0.088523228 0.017724803 52 data_n C2248.49 670.21 C0.088523228 0.02638622 53 clk_n C2248.49 1057.89 C0.088523228 0.041649213 54 clk_p C2248.49 1277.89 C0.088523228 0.05031063 55 v dd _pll0 C2248.49 1459.25 C0.088523228 0.057450787 table 2: bond pad location and identification from center of die (0,0) (continued) pad number pad name "x" 1 microns "y" 1 microns "x" 1 inches "y" 1 inches
pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 9 ?2009 aptina imaging corporation. all rights reserved. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die aptina confidential and proprietary advance die features figure 2: die outline (top view) notes: 1. this figure is not drawn to scale. +y pad 1 (table 1) or center of die (table 2) -y +x -x d ie center (0 m, 0 m) optical center (-0.1 m, - 87.195 m) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 f ir st active pixel (col 8 , row 2) last active pixel (col 1303 , r ow 977)
MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die pdf: 0834020843/source:7792798679 aptina eserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 10 ?2009 aptina imaging corporation all rights reserved. aptina confidential and proprietary advance physical specifications figure 3: die orientation in reconstructed wafer table 3: die dimensions features dimensions die thickness 200 m 12 m singulated die size width: length: 3858 m 25 m 4658 m 25 m bond pad size (min) 85 m x 100 m (3.35 mil x 3.94 mil) passivation openings (min) 75 m x 90 m (2.95 mil x 3.54 mil) minimum bond pad pitch 110.4 m (4.34203 mil) optical array optical center from die center: x = C0.1 m, y = C87.195 m first active pixel (col. 8, row 2) from die center: x = C1231.30 m, y = C1014.395 m last active pixel (col. 11303, row 977) from die center: x =1231.10 m, y = 840.005 m singulated die size: width: 3858 m 25 m length: 4658 m 25 m reconstructed wafer street width: 762 m number of rows: 35 number of columns: 41 dicing tape: adwill d-175 film frame: disco maximum total die count: 1170 276mm 276mm bond pad 1 orientation 762m 762m
10 eunos road 8 13-40, singapore post center, singapore 408600 prodmktg@aptina.com www.aptina.com aptina, aptina imaging, digitalclarity, and the aptina logo are the property of aptina imaging corporation all other trademarks are the property of their respective owners. advance: this data sheet contains initial descriptions of products still under development. MT9M114 1/6-inch 720p high-definition (hd) system-on-a-chip (soc) digital image sensor die pdf: 0834020843/source:7792798679 aptina reserves the right to change products or specifications without notice. MT9M114 dds - rev. a 9/09 en 11 ?2009 aptina imaging corporation all rights reserved. aptina confidential and proprietary advance revision history rev. a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9/25/09 ?initial release

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