rsg electronic components gmbh - sprendlinger landstr. 115 - 63069 offenbach - germany - www.rsg-electronic.de s y s t e m c e r t i f i c a t i o n i s o 9 0 0 1 description t h e c x 6 s m q u a r t z c r y s t a l s a r e l e a d l e s s d e v i c e s d e s i g n e d f o r surface mounting on printed circuit boards or hybrid substrates. they are hermetically sealed in a rugged, m i n i a t u r e c e r a m i c p a c k a g e . t h e y a r e m a n u f a c t u r e d u s i n g t h e st a tek-developed photolithographic process, and are d e s i g n e d u t i l i z i n g t h e e x p e r i e n c e a c q u i r e d b y p r o d u c i n g m i l l i o n s o f c r y s t a l s f o r i n d u s t r i a l , c o m m e r c i a l , m i l i t a r y a n d m e d i c a l a p p l i c a t i o n s . m a x i m u m p r o c e s s t e m p e r a t u r e s h o u l d n o t e x c e e d 2 6 0 o c . fea tures ultra-low profile (1mm) extensional mode ideal for use with microprocessors designed for low power applications low aging full military testing available ideal for battery operated applications designed and manufactured in the usa c x 6 s m c r y s t a l 8 0 0 k h z t o 1 . 3 5 m h z ultra-low profile (1mm) miniature surface mount quartz crystal 10133 - rev b typ . max. dim inches mm inches mm a 0.265 6.73 0.280 7.11 b 0.103 2.62 0.114 2.90 c - - see below d 0.050 1.27 0.060 1.52 dim ? glass lid ceramic lid max inches mm inches mm sm1 0.039 0.99 0.053 1.35 sm2 0.041 1.04 0.055 1.40 sm3 0.044 1.12 0.058 1.47 0.070 (1.78) 0.215 (5.46) 0. 120 (3.05) inches (mm) a b d d t o p b o t t o m c p ackage dimensions suggested land p a ttern c 0 c 1 r 1 2 1 l 1 equiv alent circuit r 1 motional resistance l 1 motional inductance c 1 motional capacitance c 0 shunt capacitance actual size side view glass lid shown
h o w t o o r d e r c x 6 s m c r y s t a l s cx6 s c sm1 1.0m, 500 / m rsg electronic components gmbh - sprendlinger landstr. 115 - 63069 offenbach - germany - www.rsg-electronic.de s y s t e m c e r t i f i c a t i o n i s o 9 0 0 1 10133 - rev b specifica tions specifications are typical at 25 o c unless otherwise noted. specifications are subject to change without notice. frequency range 800 khz - 1.35 mhz functional mode extensional calibration t olerance* 500 ppm (0.05%) 1000 ppm (0.1%) 10000 ppm (1.0%) load capacitance 7 pf (unless specified by customer) motional resistance (r 1 ) 5 k ? max motional capacitance (c 1 ) 1.2ff quality factor (q) 150 k shunt capacitance (c 0 ) 1.0 pf drive level 3 w max t urning point (t 0 )** 35 o c t emperature coef ficient (k) -0.035 ppm/ o c 2 aging, first year 5 ppm max shock, survival 1 , 0 0 0 g p e a k , 0 . 3 m s , 1 / 2 s i n e v ibration, survival 10 g rms, 20-1,000 hz random operating t emp. range -10 o c to +70 o c (commercial) -40 o c to +85 o c (industrial) -55 o c to +125 o c (military) storage t emp. range -55 o c to +125 o c max process t emperature 260 o c for 20 sec. note: frequency f at temperature t is related to frequency f 0 at turning point temperature t 0 by: * tighter tolerances available. ** other values available. + _ + _ + _ f-f 0 = k (t -t 0 ) 2 f 0 termina tions d e s i g n a t i o n t e r m i n a t i o n s m 1 g o l d p l a t e d s m 2 s o l d e r p l a t e d s m 3 s o l d e r d i p p e d p ackaging cx6sm - t ray pack - t ape and reel (reference tape and reel data sheet 10109) typical applica tion for a pierce oscilla tor t h e l o w p r o f i l e c x m i n i a t u r e s u r f a c e m o u n t c r y s t a l i s i d e a l f o r s m a l l , h i g h d e n s i t y , b a t t e r y o p e r a t e d p o r t a b l e p r o d u c t s . t h e c x c r y s t a l d e s i g n e d i n a p i e r c e o s c i l l a t o r ( s i n g l e i n v e r t e r ) c i r c u i t p r o v i d e s v e r y l o w c u r r e n t c o n s u m p t i o n a n d h i g h s t a b i l i t y . a c o n v e n t i o n a l c m o s p i e r c e o s c i l l a t o r c i r c u i t i s s h o w n b e l o w . t h e c r y s t a l i s e f f e c t i v e l y i n d u c t i v e a n d i n a p i - n e t w o r k c i r c u i t w i t h c d a n d c g p r o v i d e s t h e a d d i t i o n a l p h a s e s h i f t n e c e s s a r y t o s u s t a i n o s c i l l a t i o n . t h e o s c i l l a t i o n f r e q u e n c y ( f 0 ) i s 1 5 t o 1 5 0 p p m a b o v e t h e c r y s t a l s s e r i e s r e s o n a n t f r e q u e n c y ( f s ) . drive level r a is used to limit the crystal s drive level by forming a voltage divider between r a and c d . r a also stabilizes the oscillator against changes in the amplifiers output resistance (r 0 ). r a should be increased for higher voltage operation. load capacitance t h e c x c r y s t a l c a l i b r a t i o n t o l e r a n c e i s i n f l u e n c e d b y t h e ef fective circuit capacitances, specified as the load c a p a c i t a n c e ( c l ) . c l i s a p p r o x i m a t e l y e q u a l t o : note: c d and c g include stray layout to ground and c s is the stray shunt capacitance between the crystal terminal. in practice, the ef fective value of c l will be less than that calculated from c d , c g and c s values because of the ef fect of the amplifier output resistance. c s should be minimized. the oscillation frequency (f 0 ) is approximately equal to: conventional cmos pierce oscilla tor circuit amplifier buffer c g c d r a cx6 osc freq (f r f f 0 = f s [ 1 + c 1 ] 2(c 0 + c l ) (2) where f s = series resonant frequency of the crystal c 1 = motional capacitance c 0 = shunt capacitance c l = c d x c g + c s c d + c g (1) ??if special or custom design. blank if srd. blank = glass lid c = ceramic lid sm1 = gold plated sm2 = solder plated sm3 = solder dipped frequency k = khz m=mhz calibration t olerance @ 25 o c (in ppm) operating t emp. range: c = -10 o c to +70 o c i = -40 o c to +85 o c m = -55 o c to +125 o c s = customer specified
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