(1,00mm) .03937" fsi series fsi?140?03?g?d?e?ad fsi?120?03?g?d?ad fsi?150?03?g?d?ad (1,00mm) .03937" choice of board stacking pro les short version or optional threaded inserts www.samtec.com (no. of positions x (1,00) .03937) + (0,76).030 (8,76) .345 (0,64) .025 typ 02 01 (1,00) .03937 (0,36) .014 (0,89) .035 (8,22) .324 (0,15) .006 (3,00) .118 (14,22) .560 (1,40) .055 (1,07) .042 dia (1,40) .055 (no. of positions x (1,00) .03937) + (7,24) .285 (no. of positions x (1,00) .03937) + (14,10) .555 (no. of positions x (1,00) .03937) + (22,09) .870 (no. of positions/2 x (1,00) .03937) + (7,62) .300 for complete speci cations and recommended pcb layouts see www.samtec.com?fsi insulator ma te ri al: liquid crystal polymer contact material: becu current rating: 1a @ 80? ambient operating temp range: -55? to +125? plating: au over 50? (1,27?) ni rohs compliant: ye s processing: max processing temp: 230? for 60 seconds, or 260? for 20 seconds 3x lead-free solderable: ye s smt lead coplanarity: (0,10mm) .004" max (05-35) (0,15mm) .006" max (40-50) compression board: gold pads required f-210 short version insert option (10, 20 & 30 pins/row) insert option (40 & 50 pins/row) fsi plating option pins per row 1 10, 20, 30, 40 & 50 (insert/screw option) 05, 10, 15, 20, 25, 30, 35, 40, 45, 50 (short version) d insert option body height other option ?03 = 3,00mm ?sd = screw down (for mating with fsif series flex data link) (10, 20, 30 positions only) (threaded insert option not available) ?k = polyimide film pick & place pad ?tr = tape & reel packaging leave blank for short version (no screw down inserts or holes) ?e = #2-56 x 1/16" screw thread (-sd not available) ?g = 10" (0,25m) gold specifications ad application specific option metric insert, no alignment pin, top side alignment pin and bottom side alignment pin. call samtec. also available .100" (2,54mm) pitch see sib series. flex data link see fsif series. low pro? le see sei series. note: applications requiring 40-50 positions without threaded inserts, please contact samtec interconnect processing group. note: some lengths, styles and options are non-standard, non-returnable. contact detail ?sd option high density see gfz series. low profile one piece interfaces
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