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agilent hsdl-3003 irda ? data compliant low power 115.2 kbit/s with remote control infrared transceiver data sheet description the hsdl-3003 is a small form factor enhanced infrared (ir) transceiver module that provides the capability of (1) interface between logic and ir signals for through-air, serial, half-duplex ir data link, and (2) ir remote control transmission operating at the optimum 940 nm wavelength for universal remote control applications. for ir data communication, the hsdl-3003 provides the flexibility of low power sir applications and remote control applications with no external components needed for the selection of the type of application. the transceiver is compliant to irda ? physical general features ? guaranteed temperature performance, C20 to 70 c C critical parameters are guaranteed over temperature and supply voltage ? low power consumption ? small module size C height: 2.70 mm C width: 8.00 mm C depth: 2.95 mm ? minimum external components C integrated single-biased led resistor C direct interoperability to mpu C programmable txd features C integrated remote control fet ? withstands >100 mv p-p power supply ripple typically ?v cc supply 2.4 to 3.6 volts ? integrated emi shield ? designed to accommodate light loss with cosmetic windows ? iec 825-class 1 eye safe remote control features ? wide angle and high radiant intensity ? spectrally suited to remote control transmission function at 940 nm typically ? typical link distance up to 8 meters caution: the bicmos inherent to this design of this component increases the components susceptibility to damage from electrostatic discharge (esd). it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by esd. irda ? data features ? fully compliant to irda ? physical layer specification 1.4 low power from 9.6 kbit/s to 115.2 kbit/s (sir) C excellent nose-to-nose operation C link distance up to 50 cm typically ? complete shutdown for txd_irda, rxd_irda, and pin diode ? low power consumption C low idle current, 50 m a typically C low shutdown current, 10 na typically ? led stuck-high protection applications ? mobile data communication and universal remote control transmission C personal digital assistants (pdas) C mobile phones
2 layer specification version 1.4 low power from 9.6 kbit/s to 115.2 kbit/s (sir) and it is iec 825-class 1 eye safe. the hsdl-3003 has very low idle current and can be shutdown completely to achieve very low power consumption. in the shutdown mode, the pin diode will be inactive and thus producing very little photocurrent even under very bright ambient light. such features are ideal for battery operated handheld products such as pdas and mobile phones. order information part number packaging type package quantity HSDL-3003-021 tape and reel front view 2500 marking information the unit is marked with yyww on the shield yy = year ww = work week figure 1. functional block diagram of low power irda link distance and remote control. 87654321 rear view v cc ir_led cx1 shield cx2 rxd_irda (4) v cc (6) gnd (8) rc_buffer ir_buffer gnd rc_led rc/ir transmitter select output buffer sd (5) txd_rc (7) txd_irda (3) leda (1) vled transmitter eye safety -ir eye safety -rc pre amp detector voltage/ current reference block receiver photo- detector transceiver ic hsdl-3003 transceiver module r1 shutdown shutdown cx3
3 i/o pins configuration table pin symbol i/o description notes 1 leda i ir and remote tied through external resistor, r1, to vled from 2.4 to 4.5 volt control led driver 2 n.c. C no connection no connection 3 txd_irda i irda transmitter data logic high turns on the irda led. if held high longer than input. active high ~50 m s, the irda led is turned off. txd_irda must be driven either high or low. do not leave the pin floating 4 rxd_irda o irda receiver data output is at low pulse response when light pulse is seen output. active low 5 sd i shutdown. active high complete shutdown txd_irda, rxd_irda, and pin diode. do not leave the pin floating 6v cc i supply voltage regulated, 2.4 to 3.6 volt 7 txd_rc i remote control logic high turns on the rc led. if held high longer than ~50 m s, transmission input. the rc led is turned off. txd_rc must be driven either high or active high low. do not leave the pin floating 8 gnd i connect to system tie this pin to system ground ground C shield C emi shield tie to system ground via a low inductance trace. for best performance, do not tie it to the hsdl-3003 gnd pin directly recommended application circuit components component recommended value r1 1.8 w 5%, 0.25 watt for 2.4 vled 2.7 v 2.7 w 5%, 0.25 watt for 2.7 vled 3.3 v 3.3 w 5%, 0.25 watt for 3.0 vled 3.6 v 4.7 w 5%, 0.25 watt for 3.6 vled 4.5 v cx1 [1] 0.47 m f 20%, x7r ceramic cx2 [2] 6.8 m f 20%, tantalum cx3 6.8 m f 20%, tantalum notes: 1. cx1 must be placed within 0.7 cm of hsdl-3003 to obtain optimum noise immunity. 2. the supply rejection performance can be enhanced by including cx2, as shown in figure 1, in environment with noisy power supplies.
4 figure 2. drive irda led drive rc led drive irda led shutdown shutdown (active high) txd_irda (active high) txd_rc (gnd) reset tc t tl rc mode tb ta tc ? ? ? ? ? different remote control configurations for hsdl-3003 the hsdl-3003 can operate in the single-txd programmable mode or the two-txd direct transmission mode. single-txd programmable mode in the single-txd programmable mode, only one input pin (txd_irda input pin) is used to turn on either the 875 nm led or the 940 nm leds while the txd_rc input pin is grounded. the transceiver is in default mode (irda) when powered up. user needs to apply the following programming sequence to both the txd_irda and sd inputs to enable the transceiver to operate in either the irda or remote control mode. two-txd direct transmission mode in the two-txd direct transmission mode, the 875 nm led and the 940 nm leds are turned on separately by two different input pins. the txd_irda input pin is used to turn on the 875 nm led while the txd_rc input pin is used to turn on the 940 nm leds. please refer to the transceiver i/o truth table for more details. transceiver control i/o truth table for two-txd direct transmission mode sd txd_irda txd_rc irda led rc leds remarks 0 0 0 off off ir rx enabled. idle mode 0 0 1 off on remote control operation 0 1 0 on off irda tx operation 0 1 1 dim on not recommended 1 0 0 off off shutdown mode* * the shutdown condition will set the transceiver to the default mode (irda).
5 absolute maximum ratings at t a = 25 c for implementations where case to ambient thermal resistance is 50 c/w parameter symbol min. max. units conditions storage temperature t s -40 100 c operating temperature t a -20 70 c led supply voltage v led 06 v supply voltage v cc 06 v output voltage: rxd v o 06 v total led current pulse amplitude i vled 580 ma 90 m s pulse width 20% duty cycle ir led current pulse amplitude (i vled ) ir 280 ma 90 m s pulse width 20% duty cycle rc led current pulse amplitude (i vled ) rc 580 ma 90 m s pulse width 20% duty cycle recommended operating conditions parameter symbol min. max. units conditions operating temperature t a -20 70 c supply voltage v cc 2.4 3.6 v led supply voltage v led 2.4 4.5 v logic input voltage logic high v ih 2/3 v cc v cc v for txd_irda, txd_rc logic low v il 0 1/3 v cc v receiver input logic high e ih 0.0081 500 mw/cm 2 for in-band signals 115.2 kbit/s [3] irradiance logic low e il 0.3 m w/cm 2 for in-band signals [3] txd_irda pulse width (sir) t tpw (sir) 1.5 1.6 m s receiver data rate 9.6 115.2 kbit/s
6 electrical and optical specifications specifications (min. and max. values) hold over the recommended operating conditions unless otherwise noted. unspecified test conditions may be anywhere in their operating range. all typical values (typ.) are at 25 c with v cc at 3.0 v unless otherwise noted. parameter symbol min. typ. max. units conditions infrared (irda) receiver viewing angle 2 q 1/2 30 peak sensitivity wavelength l p 875 nm rxd_irda logic high v oh v cc - 0.2 v cc vi oh = -200 m a, ei 0.3 m w/cm 2 output voltage logic low v ol 0 0.4 v rxd_irda pulse width (sir) [4] t rpw 1 2.3 7.5 m s q 1/2 15 , c l = 9 pf rxd_irda rise & fall times tr, tf 30 100 ns c l = 9 pf receiver latency time [5] t l 26 50 m s ei = 9.0 m w/cm 2 receiver wake up time [6] t rw 75 200 m s ei = 10 mw/cm 2 infrared (irda) transmitter ir radiant intensity i eh 4 13 mw/sr i vleda = 100 ma, q 1/2 15 , txd_irda 3 v ih , t a = 25 c ir viewing angle 2 q 1/2 30 60 ir peak wavelength l p 875 nm txd_irda high v ih 2/3 v cc v cc v logic levels low v il 0 1/3 v cc v txd_irda high i h 0.02 1 m av i 3 v ih input current low i l -0.02 1 m a0 v i v il led current shutdown i vled 0.02 10 m av i (sd) 3 v ih wake up time [7] t tw 180 500 ns data setup time ta 25 ns data pulsewidth tb 25 ns programming time tc 75 ns maximum optical t pw(max) 120 m s pulse width [8] txd rise & fall times tr, tf 600 ns (optical) led anode on-state voltage v on (leda) 2.4 v i vleda = 100 ma, v i (txd) 3 v ih remote control (rc) transmitter rc radiant intensity i eh 15 [9] 36 mw/sr i vleda = 400 ma, q 1/2 15 , txd_rc 3 v ih , t a = 25 c rc viewing angle 2 q 1/2 30 60 rc peak wavelength l p 940 nm txd_rc logic high v ih 2/3 v cc v cc v levels low v il 0 1/3 v cc v txd_rc input high i h 0.02 1 m av i 3 v ih current low i l -0.02 1 m a0 v i v il maximum optical pulse t pw(max) 120 m s width [8] leda voltage v on (leda) 1.65 2.3 v i leda = 400 ma, v i (txd) 3 v ih
7 transceiver parameters symbol min. typ. max. units conditions input current high i h 0.01 1 m av i 3 v ih low i l -1 -0.02 1 m a0 v i v il supply current shutdown i cc1 0.01 1 m av sd 3 v cc - 0.5, t a = 25 c idle (standby) i cc2 50 100 m av i(txd) v il , ei = 0 active i cc3 300 m av i(txd) 3 v il , ei = 10 mw/cm 2 notes: 3. an in-band optical signal is a pulse/sequence where the peak wavelength, l p , is defined as 850 nm l p 900 nm, and the pulse characteristics are compliant with the irda serial infrared physical layer link specification version 1.4. 4. for in-band signals 9.6 kbit/s to 115.2 kbit/s where 9 m w/cm 2 ei 500 mw/cm 2 . 5. latency is defined as the time from the last txd_irda light output pulse until the receiver has recovered full sensitivity. 6. receiver wake up time is measured from v cc power on to valid rxd_irda output. 7. transmitter wake up time is measured from v cc power on to valid light output in response to a txd_irda pulse. 8. the optical pw is defined as the maximum time which the irda/rc led will turn on, this is to prevent the long turn on time for the irda and rc led. 9. this limits is production test limits. figure 3. typical 875 nm led vleda vs. ileda at room temperature. figure 5. typical 940 nm led vleda vs. ileda at room temperature performance. figure 4. typical 875 nm led radiant intensity vs. iled current at room temperature. figure 6. typical 940 nm led radiant intensity vs. iled current at room temperature. ileda (a) 0.40 vleda (v) 0.10 0 1.5 4.0 0.20 2.0 0.25 0.05 3.0 0.35 3.5 2.5 0.15 0.30 ileda (a) 0.8 vleda (v) 0.2 0 1.0 2.0 0.4 1.2 0.5 0.1 1.6 0.7 1.8 1.4 0.3 0.6 radiant intensity (mw/sr) 50 ileda current (a) 40 0.4 0 0 0.2 0.7 15 0.1 0.3 0.5 25 5 10 20 35 45 0.6 30 radiant intensity (mw/sr) 40 iled current (a) 10 0 0 0.3 20 0.05 25 5 0.15 35 0.2 0.1 15 30 0.25
8 figure 7. rxd output waveform. figure 11. transmitter wakeup time definition. figure 10. receiver wakeup time definition. figure 9. txd stuck on protection. figure 8. led optical waveform. t f v oh 90% 50% 10% v ol t pw t r t f led off 90% 50% 10% led on t pw t r t pw (max.) txd led rx light t rw rxd sd tx light t tw txd sd
9 hsdl-3003 package outline (with integrated emi shield) figure 12. package outline drawing. 0.50 0.60 pitch 0.95 2.95 2.90 8.00 5.10 1.20 1.20 1.425 2.70 123456 2.10 2.70 0.425 1.025 78 4.00 mounting center r 1.03 r 1.10 coplanarity: +0.05 to -0.15 mm 0.95 0.80 0.70 receiver emitter 1 vleda 2 nc 3 txd irda 4 rxd 5 sd 6 v cc 7 txd rc 8 gnd notes: 1. all dimensions in millimeters (mm). 2. dimension tolerance is 0.2 mm unless otherwise specified.
10 hsdl-3003 tape and reel dimensions figure 13. tape and reel dimensions. 16.40 + 2.00 0 b c 2.0 ?0.50 8.00 ?0.10 4.0 ?0.1 16.0 ?0.3 1.75 ?0.10 1.55 ?0.05 0.40 ?0.10 3.00 ?0.10 polarity parts mounted leader (40 mm min.) empty (40 mm min.) 2.0 ?0.1 progressive direction "b" "c" quantity pin 8: gnd pin 1: vled 7.5 ?0.1 r 1.0 2.0 ?0.50 dia. 13.0 ?0.50 21.0 ?0.80 label detail a detail a 330 80 2500 8.30 ?0.10 5.00?(max.) 3.25 ?0.10 5?max.) material of carrier tape: conductive polystyrene material of cover tape: pvc method of cover: heat activated adhesive unit: mm empty (40 mm min.) 1.50 ?0.10 aa section a-a b b section b-b
11 moisture proof packaging all hsdl-3003 options are shipped in moisture proof package. once opened, moisture absorption begins. this part is compliant to jedec level 4. package temp. time in reels 60 c 3 48 hours in bulk 100 c 3 4 hours 125 c 3 2 hours 150 c 3 1 hour baking should only be done once. baking conditions if the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. recommended storage conditions storage temperature 10 c to 30 c relative humidity below 60% rh time from unsealing to soldering after removal from the bag, the parts should be soldered within two days if stored at the recom- mended storage conditions. if times longer than 72 hours are needed, the parts must be stored in a dry box. figure 14. baking conditions chart. units in a sealed moisture-proof package package is opened (unsealed) environment less than 25?, and less than 60% rh? package is opened more than 72 hours? perform recommended baking conditions no baking is necessary yes no yes no
12 recommended reflow profile figure 15. reflow graph. 0 t-time (seconds) t ?temperature ?(?) 230 200 160 120 80 50 150 100 200 250 300 180 220 255 p1 heat up p2 solder paste dry p3 solder reflow p4 cool down 25 r1 r2 r3 r4 r5 60 sec. max. above 220? max. 260? the reflow profile is a straight- line representation of a nominal temperature profile for a con- vective reflow solder process. the temperature profile is divided into four process zones, each with different d t/ d time tempera- ture change rates. the d t/ d time rates detailed in the above table. the temperatures are measured at the component to printed circuit board connections. in process zone p1 , the pc board and i/o pins are heated to a temperature of 160 c to activate the flux in the solder paste. the temperature ramp up rate, r1, is limited to 4 c per second to allow for even heating of both the pc board and hsdl-3003 i/o pins. process symbol d t maximum d t/ d time heat up p1, r1 25 c to 160 c4 c/s solder paste dry p2, r2 160 c to 200 c 0.5 c/s solder reflow p3, r3 200 c to 255 c (260 c at 10 seconds max.) 4 c/s p3, r4 255 c to 200 cC6 c/s cool down p4, r5 200 c to 25 cC6 c/s process zone p2 should be of sufficient time duration (60 to C120 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the solder, usually 200 c (392 f). process zone p3 is the solder reflow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 255 c (491 f) for optimum results. the dwell time above the liquidus point of solder should be between 20 and 60 seconds. it usually takes about 20 seconds to assure proper coalescence of the solder balls into liquid solder and the formation of good solder connections. beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. the temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200 c (392 f), to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25 c (77 f) should not exceed C6 c per second maximum. this limitation is necessary to allow the pc board and transceivers castellation i/o pins to change dimensions evenly, putting minimal stresses on the hsdl-3003.
13 appendix a: smt assembly application note 1.0 solder pad, mask and metal stencil figure 16. stencil and pcba. 1.1 recommended land pattern figure 17. land pattern. metal stencil for solder paste printing land pattern pcba stencil aperture solder mask 0.60 1.25 1.75 1.35 0.475 1.425 2.375 3.325 c l mounting center shield solder pad 2.05 0.775 0.10 fiducial
14 figure 18. solder stencil aperture. 1.2 recommended metal solder stencil aperture it is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. this is to ensure adequate printed solder paste volume and no shorting. see the table below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern. aperture size(mm) stencil thickness, t (mm) length, l width, w 0.152 mm 2.60 0.05 0.55 0.05 0.127 mm 3.00 0.05 0.55 0.05 1.3 adjacent land keepout and solder mask areas adjacent land keepout is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. the minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm . it is recommended that two fiducial crosses be placed at mid- length of the pads for unit alignment. note: wet/liquid photo- imageable solder resist/mask is recommended. figure 19. adjacent land keepout and solder mask areas. apertures as per land dimensions l w t 0.2 3.0 10.1 3.85 solder mask units: mm
15 appendix b: pcb layout suggestion the following pcb layout guidelines should be followed to obtain a good psrr and em immunity resulting in good electrical performance. things to note: 1. the ground plane should be continuous under the part, but should not extend under the shield trace. 2. the shield trace is a wide, low inductance trace back to the system ground. cx1, cx2 and cx3 are optional supply filter capacitors; they may be left out if a clean power supply is used. 3. vled can be connected to either unfiltered or unregulated power supply. if vled and vcc share the same power supply, cx3 need not be used and the connections for cx1 and cx2 should be before the current limiting resistor r1. in a noisy environment, including capacitor cx2 can enhance supply rejection. cx1 is generally a ceramic capacitor of low inductance providing a wide frequency response while cx2 and cx3 are tantalum capacitors of big volume and fast frequency response. the use of a tantalum capacitor is more critical on the vled line, which carries a high current. 4. preferably a multi-layered board should be used to provide sufficient ground plane. use the layer underneath and near the transceiver module as vcc, and sandwich that layer between ground connected board layers. refer to the diagram below for an example of a four-layer board. the area underneath the module at the second layer, and 3 cm in all directions around the module, is defined as the critical ground plane zone. the ground plane should be maximized in this zone. top view refer to application note an1114 or the agilent irda data link design guide for details. the layout below is based on a two-layer pcb. bottom view top layer connect the metal shield and module ground pin to bottom ground layer. layer 2 critical ground plane zone. do not connect directly to the module ground pin. layer 3 keep data bus away from critical ground plane zone. bottom layer (gnd)
16 transceiver mod/ de-modulator speaker rf interface audio interface user interface microcontroller dsp core asic controller ir microphone mobile phone platform rc hsdl-3003 figure 1. ir layout in mobile phone platform. appendix c: general application guide for the hsdl-3003 infrared irda ? compliant 115.2 kb/s transceiver description the hsdl-3003, a wide-voltage operating range infrared transceiver is a low-cost and small form factor device that is designed to address the mobile computing market such as pdas, as well as small embedded mobile products such as digital cameras and cellular phones. it is spectrally suited to universal remote control transmission function at 940 nm typically. it is fully compliant to irda 1.4 low power specification from 9.6 kb/s to 115.2 kb/s, and supports most remote control codes. the design of the hsdl- 3003 also includes the following unique features: ? spectrally suited to universal remote control transmission function at 940 nm typically. ? low passive component count. ? shutdown mode for low power consumption requirement. selection of resistor r1 resistor r1 should be selected to provide the appropriate peak pulse led current over different ranges of vcc as shown on page 3 under "recommended application circuit components". interface to recommended i/o chips the hsdl-3003s txd data input is buffered to allow for cmos drive levels. no peaking circuit or capacitor is required. data rate from 9.6 kb/s up to 115.2 kb/s is available at the rxd pin. the txd_rc, (pin 7), or the txd_irda, (pin 3), can be used to send remote control codes. the block diagrams below show how the irda port fits into a mobile phone and pda platform.
17 pcmcia controller cpu for embedded application ir ram rom touch panel rs232c driver com port pda platform lcd panel rc hsdl-3003 figure 2. ir layout in pda platform. the link distance testing was done using typical hsdl-3003 units with smcs fdc37c669 and fdc37n769 super i/o controllers. an irda link distance of up to 70 cm was demonstrated. remote control operation the hsdl-3003 is spectrally suited to universal remote control transmission function at 940 nm typically. remote control applications are not governed by any standards, owing to which there are numerous remote control codes in the market. each of these standards results in receiver modules with different sensitivities, depending on the carrier frequencies and responsivity to the incident light wavelength. based on a survey of some commonly used remote control receiver modules, the irradiance is found to be in the range of 0.05 ~ 0.07 mw/cm2. based on a typical irradiance of 0.05 mw/ cm2 and 0.075 mw/cm2 and turning on the rc led, a typical link distance of 8 m and 7 m is achieved typically.
18 z ir transparent window opaque material opaque material ir transparent window x y appendix d: window designs for hsdl-3003 to ensure irda compliance, some constraints on the height and width of the window exist. the minimum dimensions ensure that the irda cone angles are met in the figure above, x is the width of the window, y is the height of the window, and z is the distance from the hsdl-3003 to the back module depth min aperture width min aperture height (z, mm) (x, mm) (y, mm) 0.5 11.45 4.20 1.0 11.75 4.45 1.5 12.00 5.00 2.0 12.50 5.25 3.0 13.50 6.30 4.0 15.15 8.40 5.0 15.65 9.45 without vignetting. the maximum dimensions minimize the effects of stray light. the minimum size corresponds to a cone angle of 30 and the maximum size corresponds to a cone angle of 60 . of the window. our simulations result in the following tables and graphs.
19 for module depth values that are not shown on the table above, the minimum x and y values can be interpolated. an example of this interpolation for module depth of 0.8 mm is as follows: material # light transmission haze refractive index lexan 141 88% 1% 1.586 lexan 920a 85% 1% 1.586 lexan 940a 85% 1% 1.586 note: 920a and 940a are more flame retardant than 141. recommended dye: violet #21051 (ir transmissant above 625 nm) window material almost any plastic material will work as a window material. polycarbonate is recommended. the surface finish of the plastic should be smooth, without any texture. an ir filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window should be 10% or less for best optical performance. light loss should be measured at 875 nm. the recommended plastic materials for use as a cosmetic window are available from general electric plastics. recommended plastic materials: aperture width (x) vs. module depth. aperture width (x) ?mm 18 module depth (z) ?mm 14 4 0 02 6 6 135 10 2 x min. 4 8 12 16 aperture height (y) ?mm 10 module depth (z) ?mm 8 4 0 02 6 4 135 6 2 y min. 1 3 5 7 9 aperture height (y) vs. module depth. x min = x (11.75 C 11.45) + 11.45 = 11.63 0.8 C 0.5 1.0 C 0.5 y min = x (4.45 C 4.20) + 4.20 = 4.35 0.8 C 0.5 1.0 C 0.5
shape of the window from an optics standpoint, the window should be flat. this ensures that the window will not alter either the radiation pattern of the led, or the receive pattern of the photodiode. if the window must be curved for mechanical or industrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. while this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. the amount of change in the radiation pattern is dependent curved front and back (second choice) curved front, flat back (do not use) flat window (first choice) upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. the following drawings show the effects of a curved window on the radiation pattern. in all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm. 20
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2003 agilent technologies, inc. june 11, 2003 5988-9510en

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