101 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3004 series sp3004 low capacitance esd protection - sp3004 series description features applications the sp3004 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each i/o pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level ( level 4) speci?ed in the iec 61000-4-2 international standard without performance degradation. their very low loading capacitance also makes them ideal for protecting high speed signal pins such as hdmi, dvi, usb2.0, and ieee 1394. t - p x d b q b d j u b o d f p g 0.85pf (typ) per i/o t & 4 % q s p u f d u j p o p g ? l 7 contact discharge, 15kv air discharge, (iec61000-4-2) t & ' 5 q s p u f d u j p o
iec61000-4-4, 40a (5/50ns) t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m 4 0 5 q b d l b h f saves board space t - j h i u o j o h 1 s p u f d u j p o
iec61000-4-5, 4a (8/20s) t $ p n q v u f s 1 f s j q i f s b m t t . p c j m f 1 i p o f t t 1 % " t t % j h j u b m $ b n f s b t t / f u x p s l ) b s e x b s f 1 p s u t t 5 f t u & r v j q n f o u t . f e j d b m & r v j q n f o u pinout functional block diagram i/o2 i/o1 gnd i/o3 v cc i/o4 i/o 1 i/o 2 v cc i/o 3 i/o 4 gnd life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example clk+ gnd clk- d2+ gnd d2- d1+ gnd d1- d0+ gnd d0- hdmi or dvi connector hdmi or dvi interface ic d0+ d0- d1+ d1- d2+ d2- clk+ clk- 6 5 4 sp300x-0 4 1 2 3 + 5 v gnd 6 5 4 sp300x-0 4 1 2 3 a single 4 channel sp300x-04 device can be used to protect four of the data lines in a hdmi/dvi interface. two (2) sp300x-04 devices provide protection for the main data lines. low voltage asic hdmi/dvi drivers can also be protected with the sp300x-04, the +v cc pins on the sp300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +v cc of the sp300x-04 can be ?oated or nc. sp3004 series 0.85pf rail clamp array
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 102 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3004 series low capacitance esd protection - sp3004 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 4 a t op operating temperature -40 to 85 c t stor storage temperature -50 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6 v reverse leakage current i leak v r =5v 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 10.0 12.0 v i pp =2a, t p =8/20s, fwd 11.8 15.0 v esd withstand voltage 1 v esd iec61000-4-2 (contact) 12 kv iec61000-4-2 (air) 15 kv diode capacitance 1 c i/o-gnd reverse bias=0v 0.95 1.1 1.25 pf reverse bias=1.65v 0.7 0.85 1 pf diode capacitance 1 c i/o-i/o reverse bias=0v 0.5 pf note: 1 parameter is guaranteed by design and/or device characterization. capacitance vs. bias voltage insertion loss (s21) i/o to gnd -20 -1 5 -10 - 5 0 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 frequency [hz] insertion loss [db] 0.0 0. 5 1. 0 1. 5 2.0 2. 5 3.0 3. 5 4.0 4. 55 .0 i/o capacitance (pf) i/o dc bias (v) v cc = 5 v v cc = 3.3v v cc = float 1. 5 0 1.40 1.30 1.20 1. 10 1. 0 0 0.90 0.80 0.70 0.60 0. 5 0
103 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3004 series sp3004 low capacitance esd protection - sp3004 series capacitance vs. frequency 0 2e-13 4e-13 6e-13 8e-13 1e-12 1.2e-12 1.4e-12 1.6e-12 1.8e-12 2e-12 1.e+06 1.e+07 1.e+08 1.e+09 frequency [hz] capacitance [f] product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 104 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3004 series low capacitance esd protection - sp3004 series ordering information part number package marking min. order qty. SP3004-04XTG sot563 g x 4 5000 package dimensions sot563 package sot 563 pins 6 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1.10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 part numbering system part marking system sp 3004 -04 x t g series number of channels -04 = 4 channel package x = sot 5 63, 5 000 quantity t= tape & reel g= green silicon protection array (spa tm ) family of tvs diode arrays g x 4 g x 4 product series g = sp3004 series assembly site (varies) number of channels solder pad layout embossed carrier tape & reel speci?cation sot563 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 0.45 0.55 0.017 0.021 p0 3.90 4.10 0.154 0.161 10p0 40.0+/- 0.20 1.574+/-0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 1.73 1.83 0.068 0.072 b0 1.73 1.83 0.068 0.072 k0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max
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