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features description/ordering information sn54lvt162244a, sn74lvt162244a 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs718d ? june 2000 ? revised december 2006 members of the texas instruments widebus? family output ports have equivalent 22- w series resistors, so no external resistors are required support mixed-mode signal operation (5-v input and output voltages with 3.3-v v cc ) support unregulated battery operation down to 2.7 v typical v olp (output ground bounce) <0.8 v at v cc = 3.3 v, t a = 25 c i off and power-up 3-state support hot insertion distributed v cc and gnd pins minimize high-speed switching noise flow-through architecture optimizes pcb layout latch-up performance exceeds 100 ma per jesd 78, class ii esd protection exceeds jesd 22 ? 2000-v human-body model (a114-a) ? 200-v machine model (a115-a) ? 1000-v charged-device model (c101) the 'lvt162244a devices are 16-bit buffers and line drivers designed for low-voltage (3.3-v) v cc operation, but with the capability to provide a ttl interface to a 5-v system environment. these devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. these devices provide true outputs and symmetrical active-low output-enable ( oe) inputs. the outputs, which are designed to source or sink up to 12 ma, include equivalent 22- w series resistors to reduce overshoot and undershoot. when v cc is between 0 and 1.5 v, the devices are in the high-impedance state during power up or power down. however, to ensure the high-impedance state above 1.5 v, oe should be tied to v cc through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. these devices are fully specified for hot-insertion applications using i off and power-up 3-state. the i off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. the power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. widebus is a trademark of texas instruments. unless otherwise noted this document contains copyright ? 2000?2006, texas instruments incorporated production data information current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www.ti.com sn54lvt162244a . . . wd p ackage sn74lvt162244a . . . dgg, dgv , or dl p ackage (t op view) 12 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 4847 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1oe 1y11y2 gnd 1y31y4 v cc 2y12y2 gnd 2y32y4 3y1 3y2 gnd 3y33y4 v cc 4y14y2 gnd 4y34y4 4oe 2oe 1a11a2 gnd 1a3 1a4 v cc 2a12a2 gnd 2a3 2a4 3a1 3a2 gnd 3a3 3a4 v cc 4a14a2 gnd 4a3 4a4 3oe
description/ordering information (continued) sn54lvt162244a, sn74lvt162244a 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs718d ? june 2000 ? revised december 2006 ordering information t a package (1) orderable part number top-side marking fbga ? grd sn74lvt162244agrdr reel of 1000 lz244a fbga ? zrd (pb-free) sn74lvt162244azrdr sn74lvt162244adl tube of 25 sn74lvt162244adlg4 ssop ? dl lvt162244a sn74lvt162244adlr reel of 1000 74lvt162244adlrg4 ?40 c to 85 c sn74lvt162244adggr tssop ? dgg reel of 2000 lvt162244a 74lvt162244adggre4 sn74lvt162244adgvr tvsop ? dgv reel of 2000 lz244a 74lvt162244adgvre4 vfbga ? gql sn74lvt162244agqlr reel of 1000 lz244a vfbga ? zql sn74lvt162244azqlr ?55 c to 125 c cfp ? wd tube SNJ544LVT162244AWD (2) snj54lvt162244awd (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. (2) product preview terminal assignments (1) (56-ball gql/zql package) 1 2 3 4 5 6 a 1 oe nc nc nc nc 2 oe b 1y2 1y1 gnd gnd 1a1 1a2 c 1y4 1y3 v cc v cc 1a3 1a4 d 2y2 2y1 gnd gnd 2a1 2a2 e 2y4 2y3 2a3 2a4 f 3y1 3y2 3a2 3a1 g 3y3 3y4 gnd gnd 3a4 3a3 h 4y1 4y2 v cc v cc 4a2 4a1 j 4y3 4y4 gnd gnd 4a4 4a3 xxx xxx k 4 oe nc nc nc nc 3 oe xxx xxx (1) nc ? no internal connection 2 submit documentation feedback www.ti.com gql or zql p ackage (t op view) j h g f e d c b a 2 1 3 4 6 5 k
sn54lvt162244a, sn74lvt162244a 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs718d ? june 2000 ? revised december 2006 terminal assignments (1) (54-ball grd/zrd package) 1 2 3 4 5 6 a 1y1 nc 1 oe 2 oe nc 1a1 b 1y3 1y2 nc nc 1a2 1a3 c 2y1 1y4 v cc v cc 1a4 2a1 d 2y3 2y2 gnd gnd 2a2 2a3 e 3y1 2y4 gnd gnd 2a4 3a1 f 3y3 3y2 gnd gnd 3a2 3a3 g 4y1 3y4 v cc v cc 3a4 4a1 h 4y3 4y2 nc nc 4a2 4a3 j 4y4 nc 4 oe 3 oe nc 4a4 (1) nc ? no internal connection function table (each 4-bit buffer/driver) inputs output y oe a l h h l l l h x z 3 submit documentation feedback www.ti.com grd or zrd p ackage (t op view) j h g f e d c b a 2 1 3 4 6 5
sn54lvt162244a, sn74lvt162244a 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs718d ? june 2000 ? revised december 2006 logic diagram (positive logic) 4 submit documentation feedback www.ti.com 1oe 1a11a2 1a3 1a4 1y11y2 1y3 1y4 147 46 44 43 23 5 6 2oe 2a12a2 2a3 2a4 2y12y2 2y3 2y4 4841 40 38 37 89 11 12 3oe 3a13a2 3a3 3a4 3y13y2 3y3 3y4 2536 35 33 32 1314 16 17 4oe 4a14a2 4a3 4a4 4y14y2 4y3 4y4 2430 29 27 26 1920 22 23 pin numbers shown are for the dgg, dgv , dl, and wd packages.
absolute maximum ratings (1) recommended operating conditions (1) sn54lvt162244a, sn74lvt162244a 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs718d ? june 2000 ? revised december 2006 over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ?0.5 4.6 v v i input voltage range (2) ?0.5 7 v v o voltage range applied to any output in the high-impedance or power-off state (2) ?0.5 7 v v o voltage range applied to any output in the high state (2) ?0.5 v cc + 0.5 v i o current into any output in the low state 30 ma i o current into any output in the high state (3) 30 ma i ik input clamp current v i < 0 ?50 ma i ok output clamp current v o < 0 ?50 ma dgg package 70 dgv package 58 q ja package thermal impedance (4) dl package 63 c/w gql/zql package 42 grd/zrd package 36 t stg storage temperature range ?65 150 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (3) this current flows only when the output is in the high state and v o > v cc . (4) the package thermal impedance is calculated in accordance with jesd 51-7. sn54lvt162244a (2) sn74lvt162244a unit min max min max v cc supply voltage 2.7 3.6 2.7 3.6 v v ih high-level input voltage 2 2 v v il low-level input voltage 0.8 0.8 v v i input voltage 5.5 5.5 v i oh high-level output current ?12 ?12 ma i ol low-level output current 12 12 ma d t/ d v input transition rise or fall rate outputs enabled 10 10 ns/v d t/ d v cc power-up ramp rate 200 200 m s/v t a operating free-air temperature ?55 125 ?40 85 c (1) all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. (2) product preview 5 submit documentation feedback www.ti.com
electrical characteristics switching characteristics sn54lvt162244a, sn74lvt162244a 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs718d ? june 2000 ? revised december 2006 over recommended operating free-air temperature range (unless otherwise noted) sn54lvt162244a (1) sn74lvt162244a parameter test conditions unit min typ (2) max min typ (2) max v ik v cc = 2.7 v, i i = ?18 ma ?1.2 ?1.2 v v oh v cc = 3 v, i oh = ?12 ma 2 v v ol v cc = 3 v, i ol = 12 ma 0.8 0.8 v v cc = 0 or 3.6 v, v i = 5.5 v 10 10 control inputs v cc = 3.6 v, v i = v cc or gnd 1 1 i i m a v i = v cc 1 1 data inputs v cc = 3.6 v v i = 0 ?5 ?5 i off v cc = 0, v i or v o = 0 to 4.5 v 100 m a i ozh v cc = 3.6 v, v o = 3 v 5 5 m a i ozl v cc = 3.6 v, v o = 0.5 v ?5 ?5 m a v cc = 0 to 1.5 v, v o = 0.5 v to 3 v, i ozpu 100 (3) 100 m a oe = don't care v cc = 1.5 v to 0, v o = 0.5 v to 3 v, i ozpd 100 (3) 100 m a oe = don't care outputs high 0.19 0.19 v cc = 3.6 v, i cc i o = 0, outputs low 5 5 ma v i = v cc or gnd outputs disabled 0.19 0.19 v cc = 3 v to 3.6 v, one input at v cc ? 0.6 d i cc (4) 0.2 0.2 ma v, other inputs at v cc or gnd c i v i = 3 v or 0 4 4 pf c o v o = 3 v or 0 9 9 pf (1) product preview (2) all typical values are at v cc = 3.3 v, t a = 25 c. (3) on products compliant to mil-prf-38535, this parameter is not production tested. (4) this is the increase in supply current for each input that is at the specified ttl voltage level, rather than v cc or gnd. over recommended operating free-air temperature range, c l = 50 pf (unless otherwise noted) (see figure 1 ) sn54lvt162244a (1) sn74lvt162244a v cc = 3.3 v v cc = 3.3 v from to v cc = 2.7 v v cc = 2.7 v parameter 0.3 v 0.3 v unit (input) (output) typ (2 min max min max min max min max ) t plh 1.1 4.6 5.1 1.4 3.4 4 4.8 a y ns t phl 1.1 3.9 4.5 1.2 2.9 3.6 4.1 t pzh 1.1 5.4 6.7 1.2 3.9 5.1 6.5 oe y ns t pzl 1.3 4.9 6.1 1.4 3.8 4.5 5.8 t phz 1.6 5.9 6.5 2.2 4.4 5 5.4 oe y ns t plz 1 5.9 5.8 2 4.2 5 5.4 t sk(lh) 0.5 ns t sk(hl) 0.5 (1) product preview (2) all typical values are at v cc = 3.3 v, t a = 25 c. 6 submit documentation feedback www.ti.com
parameter measurement information sn54lvt162244a, sn74lvt162244a 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs718d ? june 2000 ? revised december 2006 figure 1. load circuit and voltage waveforms 7 submit documentation feedback www.ti.com t h t su from output under t est c l = 50 pf (see note a) load circuit s1 6 v gnd 500 w 500 w data input t iming input 2.7 v0 v 2.7 v 0 v 2.7 v0 v t w input volt age w aveforms setup and hold times volt age w aveforms propaga tion dela y times inverting and noninverting outputs volt age w aveforms pulse dura tion t plh t phl t phl t plh v oh v oh v ol v ol 2.7 v0 v input output control output w aveform 1 s1 at 6 v (see note b) output w aveform 2 s1 at gnd (see note b) v ol v oh t pzl t pzh t plz t phz 3 v 0 v v ol + 0.3 v v oh ? 0.3 v 0 v 2.7 v volt age w aveforms enable and disable times low - and high-level enabling outputoutput t plh /t phl t plz /t pzl t phz /t pzh open 6 v gnd test s1 notes: a. c l includes probe and jig capacitance. b. w aveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 w , t r 2.5 ns, t f 2.5 ns. d. the outputs are measured one at a time, with one transition per measurement. open 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v1.5 v
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 74lvt162244adggre4 active tssop dgg 48 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74lvt162244adgvre4 active tvsop dgv 48 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74lvt162244adlrg4 active ssop dl 48 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvt162244adggr active tssop dgg 48 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvt162244adgvr active tvsop dgv 48 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvt162244adl active ssop dl 48 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvt162244adlg4 active ssop dl 48 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvt162244adlr active ssop dl 48 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvt162244agqlr nrnd bga mi crosta r juni or gql 56 1000 tbd snpb level-1-240c-unlim sn74lvt162244agrdr active bga mi crosta r juni or grd 54 1000 tbd snpb level-1-240c-unlim sn74lvt162244azqlr active bga mi crosta r juni or zql 56 1000 green (rohs & no sb/br) snagcu level-1-260c-unlim sn74lvt162244azrdr active bga mi crosta r juni or zrd 54 1000 green (rohs & no sb/br) snagcu level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder package option addendum www.ti.com 30-mar-2007 addendum-page 1
temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 30-mar-2007 addendum-page 2
tape and reel information package materials information www.ti.com 19-may-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74lvt162244adggr dgg 48 mla 330 24 8.6 15.8 1.8 12 24 q1 sn74lvt162244adgvr dgv 48 mla 330 24 6.8 10.1 1.6 12 24 q1 sn74lvt162244adlr dl 48 mla 330 32 11.35 16.2 3.1 16 32 q1 sn74lvt162244agqlr gql 56 hij 330 16 4.8 7.3 1.45 8 16 q1 sn74lvt162244agrdr grd 54 hij 330 16 5.8 8.3 1.55 8 16 q1 sn74lvt162244azqlr zql 56 hij 330 16 4.8 7.3 1.45 8 16 q1 sn74lvt162244azrdr zrd 54 hij 330 16 5.8 8.3 1.55 8 16 q1 tape and reel box information device package pins site length (mm) width (mm) height (mm) sn74lvt162244adggr dgg 48 mla 333.2 333.2 31.75 sn74lvt162244adgvr dgv 48 mla 333.2 333.2 31.75 sn74lvt162244adlr dl 48 mla 336.6 342.9 41.3 sn74lvt162244agqlr gql 56 hij 346.0 346.0 33.0 sn74lvt162244agrdr grd 54 hij 346.0 346.0 33.0 sn74lvt162244azqlr zql 56 hij 346.0 346.0 33.0 sn74lvt162244azrdr zrd 54 hij 346.0 346.0 33.0 package materials information www.ti.com 19-may-2007 pack materials-page 2
package materials information www.ti.com 19-may-2007 pack materials-page 3

mechanical data mpds006c february 1996 revised august 2000 post office box 655303 ? dallas, texas 75265 dgv (r-pdso-g**) plastic small-outline 24 pins shown 14 3,70 3,50 4,90 5,10 20 dim pins ** 4073251/e 08/00 1,20 max seating plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 112 24 13 4,30 4,50 0,16 nom gage plane a 7,90 7,70 38 24 16 4,90 5,10 3,70 3,50 a max a min 6,60 6,20 11,20 11,40 56 9,60 9,80 48 0,08 m 0,07 0,40 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. d. falls within jedec: 24/48 pins mo-153 14/16/20/56 pins mo-194

mechanical data msso001c ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 dl (r-pdso-g**) plastic small-outline package 4040048 / e 12/01 48 pins shown 56 0.730 (18,54) 0.720 (18,29) 48 28 0.370 (9,40) (9,65) 0.380 gage plane dim 0.420 (10,67) 0.395 (10,03) a min a max 0.010 (0,25) pins ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) seating plane 0.020 (0,51) 0.040 (1,02) 25 24 0.008 (0,203) 0.0135 (0,343) 48 1 0.008 (0,20) min a 0.110 (2,79) max 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) m 0.005 (0,13) 0.025 (0,635) 0 ? 8 0.005 (0,13) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). d. falls within jedec mo-118
mechanical data mtss003d january 1995 revised january 1998 post office box 655303 ? dallas, texas 75265 dgg (r-pdso-g**) plastic small-outline package 4040078 / f 12/97 48 pins shown 0,25 0,15 nom gage plane 6,00 6,20 8,30 7,90 0,75 0,50 seating plane 25 0,27 0,17 24 a 48 1 1,20 max m 0,08 0,10 0,50 0 8 56 14,10 13,90 48 dim a max a min pins ** 12,40 12,60 64 17,10 16,90 0,15 0,05 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold protrusion not to exceed 0,15. d. falls within jedec mo-153
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com telephony www.ti.com/telephony low power www.ti.com/lpw video & imaging www.ti.com/video wireless wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2007, texas instruments incorporated

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