1 05107.r7 11/02 p0402fc3.3c* thru p0402fc36c* bidirectional flip chip applica tions ? cellular phones ? mcm boards ? wireless communication circuits ? ir leds ? smart cards & pcmcia cards iec compa tibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns fea tures ? esd protection > 25 kilovolts ? available in multiple voltage types ranging from 3.3v to 36v ? 250 watts peak pulse power dissipation per line (8/20s) ? monolithic structure mechanical characteristics ? standard eia chip size: 0402 ? weight 0.73 milligrams (approximate) ? flammability rating ul 94v-0 ? 8mm tape and reel per eia standard 481(plastic or paper) ? device marking on reel ? top contacts: solder bump 0.004? in height (nominal) 0402 circuit diagram 05107 . . . engineered solutions for the transient environment? * u.s. patent no. des. d456,367 s www.protekdevices.com
2 * u.s. patent no. des. d456,367 s www.protekdevices.com 05107.r7 11/02 p0402fc3.3c* thru p0402fc36c* device characteristics maximum ratings @ 25c unless otherwise specified operating temperature symbol value -55 c to 150 cc c -55 c to 150 c units t j t stg parameter storage temperature peak pulse power (t p = 8/20s) - see figure 1 p pp 250 watts electrical characteristics per line @ 25c unless otherwise specified pa r t number (see note 1 & note 2) minimum breakdown voltage @ 1ma v (br) volts maximum clamping voltage (see fig. 2) @ i p = 1a v c volts maximum clamping voltage (see fig. 2) @8/20s v c @ i pp typical capacitance 0v @ 1 mhz c pf p0402fc3.3c p0402fc05c p0402fc08c p0402fc12c p0402fc15c p0402fc24c p0402fc36c 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 9.8 13.4 19.0 24.0 43.0 64.0 12.5v @ 20a 14.7v @ 17a 19.2v @ 13a 29.7v @ 9.0a 35.7v @ 7.0a 55.0v @ 5.0a 84.0v @ 3.0a 150 100 75 50 40 30 25 maximum leakage current @v wm i d a 75 10 10 1 1 1 1 rated stand-off voltage v wm volts note 1: all devices are bidirectional. electrical characteristics apply in both directions. note 2: spice model and parameters are available for the p0402fc05c on the protek devices website: http://www .protekde vices .com/spice . 0.01 1 10 100 1,000 t d - pulse duration - s 0 5 10 15 20 25 30 t - time - s 0 20 40 60 80 100 120 i pp - peak pulse current - % of i pp test waveform parameters t f = 8s t d = 20s t f peak value i pp e -t t d = t i pp /2 figure 2 pulse wave form 10 100 1,000 10,000 p pp - peak pulse current - watts figure 1 peak pulse power vs pulse time 250w, 8/20s waveform
3 * u.s. patent no. des. d456,367 s www.protekdevices.com 05107.r7 11/02 p0402fc3.3c* thru p0402fc36c* graphs esd test pulse - 12 kilovolt, 1/30ns (waveshape) figure 5 overshoot & clamping voltage for p0402fc05c 5 volts per division 0 10 20 30 40 p0402fc05c 0 5 10 15 20 v c - clamping voltage - volts 0 4 8 12 14 figure 6 typical clamping voltage vs peak pulse current 10 6 2 i pp - peak pulse current - amps figure 4 reflow solder profile 225c 5-10 sec instantaneous to 200c soldering time cool down time 1-2 minutes to 150c 1-2 minutes to 25c pre-heat time 100c 200c note: this reflow profile does not take into account the printed circuit board (pcb) material heating time. additional time may be required for the preheat time and cool down time upon the pcb or board material. 0 25 50 75 100 125 150 t l - lead temperature - c 20 40 60 80 100 % of rated power peak pulse power 8/20s average power figure 3 power derating curve 0
4 * u.s. patent no. des. d456,367 s www.protekdevices.com 05107.r7 11/02 p0402fc3.3c* thru p0402fc36c* application note the p0402fc series are flip-chip components that provide board level eft and esd protection > 25 kilovolts with an additional s urge capability of 250 watts p pp per line for an 8/20s waveform. bidirectional common mode configuration (figure 1) the 0402fc series provides single line, bidirectional protection in a common mode configuration as depicted in figure 1. circuit bo ard la y out recommend a tions circuit board layout is critical for electromagnetic compatibility (emc) protection. the following guide- lines are recommended: ? the protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. ? the path length between the tvs device and the protected line should be minimized. ? all conductive loops including power and ground loops should be minimized. ? the transient current return path to ground should be kept as short as possible to reduce parasitic inductance. ? ground planes should be used whenever possible. for multilayer pcbs, use ground vias. figure 1 - bidirectional configuration common-mode i/o port protection
5 * u.s. patent no. des. d456,367 s www.protekdevices.com 05107.r7 11/02 p0402fc3.3c* thru p0402fc36c* copyright ? protek devices 2003 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the fi nal judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility with respect to the selection or specifications of such products. package outline & dimensions protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com t ape & reel ordering informa tion: surface mount product is taped and reeled in accordance with eia-481. plastic tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-1 (i.e., p0402fc05c-t75-1). paper tape: 7 inch reels - 10,000 pieces per reel. ordering suffix: -t710-2 (i.e., p0402fc05c-t710-2). a b c d e f g h i 0.46 nom 0.86 nom 0.99 0.0254 0.10 nom 0.35 nom 0.483 0.0254 0.20 nom 0.127 max 0.076 min 0.406 nom 0.018 nom 0.034 nom 0.039 0.001 0.004 nom 0.014 nom 0.019 0.001 0.008 nom 0.005 max 0.003 min 0.016 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002 ? ). 3. maximum chip size: 1.02 (0.040 ? ) by 0.51(0.020 ? ). package outline 0402 mounting pad tape & reel orienta tion note: 1. top view of tape. solder bumps are face down in tape package. single die 0402 g d h e f i side a b c top end 06001 rev 3 - 11/02 0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005 a b c d e f g h i 0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13 dim millimeters inches pad dimensions note: preferred: using 0.1mm (0.004 ? ) stencil. b c solder bump a h d i solder print diameter 0.010? - 0.012? f g die e solder pad
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