a - 2006 10 - jul. LVYVG3363-PF ligitek electronics co.,ltd. property of ligitek only LVYVG3363-PF bipolar round type led lamps data sheet doc. no : qw0905- rev. : date : pb lead-free parts
ligitek electronics co.,ltd. property of ligitek only 1/6 page LVYVG3363-PF 5.9 5.0 8.6 7.6 0.5 typ 1.5 max part no. package dimensions 1 2 1.0min 2.54typ 30 0 -30 60 100% 50%75% -60 25% 25% 0 50% 100%75% note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 25.0min 1 2 vg vy
lens water clear algainp material LVYVG3363-PF part no color emitted yellow luminous intensity @20ma(mcd) dominant wave length dnm peak wave length pnm ----- 590 spectral halfwidth nm forward voltage @ ma(v) 20 min. 1.7 20 2.6 90 max.min. viewing angle 2 1/2 (deg) 16020 typ. note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr esd symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 75 -40 ~ +100 -40 ~ +85 ir 2000 10 ratings vy 60 30 mw v a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/6 100 120 30 vg 30 green gap----- 56520 130 65 1.72.6 ---- * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. LVYVG3363-PF part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy chip page 3/6 LVYVG3363-PF part no.
fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 20 060100 0.0 2.5 1.5 1.0 2.0 3.0 ambient temperature( ) -40-2002060 40100 80 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics cur v e 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 vg chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 4/6 page forward current(ma) 1.0101001000 LVYVG3363-PF part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 50 0 0 preheat 25 120 2 /sec max 150 100 time(sec) 260 c3sec max 5 /sec max 260 temp( c) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 5/6 60 seconds max LVYVG3363-PF part no.
the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec thermal shock test high temperature high humidity test solder resistance test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test high temperature storage test low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test condition test item description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard 6/6 page LVYVG3363-PF part no.
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