application note vsc8201 confidential an0057 rev 01 - 00 12 april 2005 ? vitesse semiconductor corporation ? 741 calle plano ? camarillo, ca 93012 tel: (800) vitesse ? fax: (805) 987 - 5896 ? e - mail: prodinfo@vitesse.com internet: www.vitesse.com page 1 VSC8201XVZ solder reflow profile g eneral d escription while the VSC8201XVZ is a lead - free device, it is not compatible with a 260 c solder reflow profile. this document will describe the proper solder reflow profile for use with the VSC8201XVZ. 1.0 i ntroduction as with all bga packaged devices, reliable mounting of the VSC8201XVZ requires careful attention to the temperature profile used in the solder reflow process. reflow process, equipment, and the thermal characteristics of each circuit board design can all affect the required profile. this application note provides guidelines that can be used to develop a reliable reflow profile for each application. 1.1 references 1.1.1 vitesse documents vmds - 10103 vsc8201 datasheet 1.1.2 jedec standard ip c/jedec j - std - 020 moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices
application note VSC8201XVZ solder reflow profile page 2 confidential an0057 rev 01 - 00 12 april 2005 2.0 r eflow p rofile s pecifications note: all temperatures refer to topside of the package, measured on the package body surface. table 1. reflow profile s pecifications specification value units average ramp - up rate (ts max to t p ) 3 c/second (max) preheat - temperature min (ts min ) - temperature max (ts max ) - time (ts min to ts max ) 100 150 60 - 120 c c seconds time maintained above: - temperature (t l ) - time (t l ) 183 60 - 150 c seconds peak temperature (t p ) 240 c time within 5 c of actual peak temperature (t p ) 10 - 30 seconds ramp - down rate 6 c/second time 25 c to peak temperature 6 minutes (max) maximum number of reflow cycles 6
application note VSC8201XVZ solder reflow profile page 3 an0057 rev 01 - 00 12 april 2005 confidential 3.0 e xample p rofile the p lot below shows an example thermal profile that meets the above specifications. VSC8201XVZ reflow profile 0 50 100 150 200 250 0 20 40 60 80 100 120 140 160 180 200 time (sec) temperature (c) figure 1. reflow profile t s preheat t 25 c to peak ts min ts max t l t l t p t p
application note VSC8201XVZ solder reflow profile page 4 confidential an0057 rev 01 - 00 12 april 2005 d ocument h istory & n otes table 2. document history rev date description 01 - 00 12 april 2005 initial document release
application note VSC8201XVZ solder reflow profile page 5 an0057 rev 01 - 00 12 april 2005 confidential corporate headquarters vitesse semiconductor corporation 741 calle plano camarillo, ca 93012 tel: 1 - 800 - vitesse ? fax: 1 - 805 - 987 - 5896 for application support, latest technical literature, and locations of sales offices, please visit our web site at www.vitesse.com copyright ? 2005 by vitesse semiconductor corporation printed in the u.s.a vitesse semiconductor corporation (?vitesse?) retains the right to make changes to its products or specifications to improve performance, reliability or manufacturab ility. all information in this document, including descriptions of features, functions, performance, technical specifications and availability, is subject to change without notice at any time. while the information furnished herein is held to be accurate a nd reliable, no responsibility will be assumed by vitesse for its use. furthermore, the information contained herein does not convey to the purchaser of microelectronic devices any license under the patent right of any manufacturer. vitesse products are no t intended for use in life support products where failure of a vitesse product could reasonably be expected to result in death or personal injury. anyone using a vitesse product in such an application without express written consent of an officer of vitess e does so at their own risk, and agrees to fully indemnify vitesse for any damages that may result from such use or sale. vitesse semiconductor corporation is a registered trademark. all other products or service names used in this publication are for iden tification purposes only, and may be trademarks or registered trademarks of their respective companies. all other trademarks or registered trademarks mentioned herein are the property of their respective holders.
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