LHIR4840-PF 05 - jul. a doc. no : qw0905- rev. : date : - 2006 data sheet LHIR4840-PF infrared emitting diodes ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
the series are super-high efficiency gallium aluminum arsenide infrared emitting diodes encapsulated in blue diffused plastic t-1 3/4 package individually LHIR4840-PF descriptions: features: 3. low average degradation. 2. suitable for pulse applications. 1. high radiant intensity. device selection guide: note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. material LHIR4840-PF part no blue diffused lens color ligitek electronics co.,ltd. property of ligitek only LHIR4840-PF package dimensions part no. 1/7 page 3.8 3.0 3.8 0.5 typ 1.0min 25.0min 1.5max + - gaaias/gaas 1.0 2.54typ
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the radiant intensity data did not including 15% testing tolerance. symbol ee peak le vf ir 2 1/2 electrical optical characteristics (aa=25) spectral line half width forward voltage reverse current viewing angle peak wavelength parameter aperture radiant incidence radiant intensity if=20ma 50 142 --- 100 deg 1.6 v a nm vr=5v if=20ma unit mw/cm mw/sr 0.42 3 typ. 850 0.14 1 min. nm max. test condition 2 if=20ma if=20ma if=20ma absolute maximum ratings at ta=25 LHIR4840-PF part no. peak forward current (300pps,10 s pulse) reverse voltagev operating temperature storage temperature power dissipation forward current parameter 2/7 page vr t opr tstg pd i fp 5 100 1 i f symbol hir 50 ratings mw v a unit ma ligitek electronics co.,ltd. property of ligitek only 1.2 electrostatic discharge esd2000 v -40 ~ +85 -40 ~ +85
fig.3 relative radiant power vs. forward dc current fig.5 forward dc voltage vs. temperature i fdc [ma] f o r w a r d d c v o l t a g e n o r m a l i z e @ 2 0 m a , 2 5 ambient temperature [ ] r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a fig.4 relative radiant power i fpk [ma] r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 1 0 0 m a typical electro-optical characteristics curve forward voltage[v] fig.1 forward current vs. rorward voltage f o r w a r d c u r r e n t [ m a ] wavelength[nm] fig.2 relative radiant power vs. wavelength r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only hir chip 0.01.02.03.04.0 0.1 1 10 100 1000 10 0.1 1 0.1 -40 0.8 -40 0.0 r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a , 2 5 ambient temperature[ ] fig.6 relative radiant power vs. temperature vs. forward peak current 1.0 10.0 10100 1001000 1.0 10.0 0.9 1.0 1.1 1.2 -20020406080100-20040 2060100 80 0.5 1.0 1.5 2.0 2.5 3.0 page3/7 0.5 0.0 800 1.0 850 900 950 part no. LHIR4840-PF
ligitek electronics co.,ltd. property of ligitek only (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. drive method: led is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. storage time: 1.the operation of temperatures and rh are : 5 ~35 ,rh<60%. 2.once the package is opened, the products should be used within a week. otherwise, they should be kept in a damp proof box with descanting agent. considering the tape life, we suggest our customers to use our products within a year(from production date). 3.if opened more than one week in an atmosphere 5 ~ 35 ,rh<60%, they should be treated at 60 5 fo r 15hrs. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. led circuit model a led circuit model b page 4/7 part no. LHIR4840-PF
15 45 2. the led lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . anode side(cathode side on gaalas chips) ligitek electronics co.,ltd. property of ligitek only mounting: 1. if the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. for this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (o) (o) (x) page 5/7 part no. LHIR4840-PF
260 c3sec max ligitek electronics co.,ltd. property of ligitek only temp( c) 260 120 25 2 /sec max 60 seconds max 0 preheat 0 50 5 /sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile time(sec) 150 100 page 6/7 part no. LHIR4840-PF
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature storage test operating life test test item 1.ta=85 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition reliability test: reference standard the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. description mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 7/7 ligitek electronics co.,ltd. property of ligitek only page part no. LHIR4840-PF
|
