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quality and continuous improvement qualification of nuf2221w1t2 series of devices designed for applications requiring line termination, emi filtering and esd protection.these are intented for use in upstream usb ports, cellular phones, wireless equipment and computer applications. offering an integrated solution, offering better esd protection than available from a discete implemetation because of reduced parasitic inductances, in a small package (sc88/sot363) reducing pcb space and cost. 10/16/2002 date: scott savage reliability manager 602 244 4848 602 244 5474 laura rivers reliability engineer reliability qualification report device qualification 1) introduction: 2) device description: esd ratings: jedec mm class c, jedec hbm 3b. compliant with iec61000-4-2 (level 4) 8kv (contact) 15kv (air) this series of devices is qualified by similarity based upon the nzmm7v04t4, rel report # 0450 , for die technology and the nl27wzu04dft2, rel report# 1242, for package technology. full characterization of the nuf2221w1t2 has also been completed. related qualification report(s): pcn: nuf2221w1t2 device zlu22n line source zener parent tech zener technology sbn assembly site seremban, malaysia ismf wafer fab site seremban, malaysia ait batam, idn batam, indonesia final test site sbn reliability lab seremban, malaysia sc88/sot363 package pn polarity die size 670 x 500 1.1mm x 0.625mm flag size max. current max. voltage 100ma 7v qual id 1564 product reliability engineering services nuf2221w1t2_1564_2002.pdf 1
quality and continuous improvement 3) qualification results analysis: no anomalies were observed. 4) conclusion: the nuf2221w1t2 and nuf2xx1w1t2 series of devices have been found to meet or exceed all qualification requirements, by similarity, according to on semiconductor product qualification process, 12mrb17722c. these devices are fully qualified. product reliability engineering services nuf2221w1t2_1564_2002.pdf 2
quality and continuous improvement package qualification reliability customer report 02/19/01 date: thomas grzybowski reliability manager 602-244-4331 602 244 5474 chuck reed/laura rivers reliability engineer 1) introduction: this product is being developed for a motorola cellular phone application. the device has 21 zener diodes and 9 resistors. the fab facility is ismf and assembly is amkor. 2) device descriptions: n/a pcn: nzmm7v0t4 device zldmc7v0 line source zener parent tech zener technology amkor (atp4) assembly site ismf wafer fab site amkor (atk1) final test site fet tester reliability lab 52nd st., phoenix, az 24 mlp2 package pn polarity die size 53 mils x 53 mils flag size max. current max. voltage 0477 qual id nzmm7v0t4 device zldmc7v0 line source zener parent tech zener technology amkor (atp4) assembly site ismf wafer fab site amkor (atk1) final test site fet tester reliability lab 52nd st., phoenix, az 24 mlp2 package pn polarity die size 53 mils x 53 mils flag size max. current max. voltage qual id 0450 product reliability engineering services nzmm7v0t4_0450f_2001.pdf 1
quality and continuous improvement 2) device descriptions continued: nzmm7v0t4 device zldmc7v0 line source zener parent tech zener technology amkor (atp4) assembly site ismf wafer fab site amkor (atk1) final test site fet tester reliability lab 52nd st., phoenix, az 24 mlp2 package pn polarity die size 53 mils x 53 mils flag size max. current max. voltage 0669 qual id device line source parent tech technology assembly site wafer fab site final test site reliability lab package polarity die size flag size max. current max. voltage n/a qual id nzmm7v0t4 device zldmc7v0 line source zener parent tech zener technology amkor (atp4) assembly site ismf wafer fab site amkor (atk1) final test site fet tester reliability lab 52nd st., phoenix, az 24 mlp2 package pn polarity die size 53 mils x 53 mils flag size max. current max. voltage 0668 qual id device line source parent tech technology assembly site wafer fab site final test site reliability lab package polarity die size flag size max. current max. voltage n/a qual id device line source parent tech technology assembly site wafer fab site final test site reliability lab package polarity die size flag size max. current max. voltage n/a qual id product reliability engineering services nzmm7v0t4_0450f_2001.pdf 2
quality and continuous improvement 3) qualification results analysis: life and environmental tests passed with zero qualification related failures. 4) conclusion: the 24 pin emi filter qualification of the nzmm7v0t4 product meets or exceeds reliability qualification test requirements per 12msb17722c issue b. zero devices in any subgroup experienced failure due to the standard testing. this qualifies other dice in the family such as: nzf220dft1 and nzf220tt1. product reliability engineering services nzmm7v0t4_0450f_2001.pdf 4
quality and continuous improvement 5) test description & condition: autoclave autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing autoclave auto autoclave + moisture level preconditioning autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. typical test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing autoclave - pc auto-pc bond pull strength the purpose of this test is to determine bond pull strength of wire to die, substrate, or package header connections. the wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. test conditions: ta = 25c common failure modes: parametric shifts, open, and/or intermittent common failure mechanisms: corrosion or contaminants from foreign material within the package. silicon or metalization defects. bond pull strength bond pull bond shear the purpose of this test is to determine bond shear strength of wire to die, substrate, or package header connections. the wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. test conditions: ta = 25c common failure modes: parametric shifts, open, and/or intermittent common failure mechanisms: corrosion or contaminants from foreign material within the package. silicon or metalization defects. bond shear bond shear destructive physical analysis the purpose of this test is to determine conformance with applicable design and process requirements. test conditions: ta = 25c common failure modes: electrical, mechanical and physical failures common failure mechanisms: various material and manufacturing defects. destructive physical analysis dpa destructive physical analysis the purpose of this test is to determine conformance with applicable design and process requirements. test conditions: ta = 25c common failure modes: electrical, mechanical and physical failures common failure mechanisms: various material and manufacturing defects. destructive physical analysis h3trb dpa-h3trb product reliability engineering services nzmm7v0t4_0450f_2001.pdf 5
quality and continuous improvement destructive physical analysis the purpose of this test is to determine conformance with applicable design and process requirements. test conditions: ta = 25c common failure modes: electrical, mechanical and physical failures common failure mechanisms: various material and manufacturing defects. destructive physical analysis h3trb-pc dpa-h3trb -pc destructive physical analysis the purpose of this test is to determine conformance with applicable design and process requirements. test conditions: ta = 25c common failure modes: electrical, mechanical and physical failures common failure mechanisms: various material and manufacturing defects. destructive physical analysis tc-pc dpa-tc-pc destructive physical analysis the purpose of this test is to determine conformance with applicable design and process requirements. test conditions: ta = 25c common failure modes: electrical, mechanical and physical failures common failure mechanisms: various material and manufacturing defects. destructive physical analysis tc dpatc electrostatic discharge the purpose of this test is to measure the relative ability of the part to withstand accidental electrostatic discharge. both the human body model and the machine model are used in testing. devices are divided into groups and tested at specified increments across the esd test range (per jedec). data is recorded and devices are rated at the highest level at which they passed. if devices show no failures at the max increment, they are rated as being greater than (>) that voltage. if devices fail at some lower increment, they are rated as being equal (=) to that voltage. electrostatic discharge esd high humidity high temperature bias this test designed to measure the moisture resistance of plastic encapsulated devices. a bias is applied to create an electrolytic cell necessary to accelerate corrosion of the die metallization. with time, this is a catastrophically destructive test. test conditions: ta = 85c, rh = 85% common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing high humidity high temperature reverse bias h3trb high humidity high temperature bias + moisture level preconditioning this test designed to measure the moisture resistance of plastic encapsulated devices. a bias is applied to create an electrolytic cell necessary to accelerate corrosion of the die metallization. with time, this is a catastrophically destructive test. test conditions: ta = 85c, rh = 85% common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing high humidity high temperature reverse bias-pc h3trb-pc 5) test description & condition continued: product reliability engineering services nzmm7v0t4_0450f_2001.pdf 6
quality and continuous improvement high temperature reverse bias the purpose of this test is to align mobile ions by means of temperature and voltage stress to form a high-current leakage path between two or more junctions. test conditions: ta = 150c common failure modes: parametric shifts in leakage and gain common failure mechanisms: ionic contamination on the surface or under the metallization of the die high temperature reverse bias htrb intermittent operational life the purpose of this test is the same as operating life in addition to checking the integrity of both wire and die bonds by means of thermal stressing. test conditions: ta = 25c, ton = toff = 2 minutes, delta tj => 100c common failure modes: parametric shifts and catastrophic common failure mechanisms: foreign material, crack and bulk die defects, metallization, wire and die bond defects intermittent operational life iol intermittent operational life + moisture level preconditioning the purpose of this test is the same as operating life in addition to checking the integrity of both wire and die bonds by means of thermal stressing. test conditions: ta = 25c, ton = toff = 2 minutes, delta tj => 100c common failure modes: parametric shifts and catastrophic common failure mechanisms: foreign material, crack and bulk die defects, metallization, wire and die bond defects intermittent operational life - pc iol-pc 5) test description & condition continued: moisture level preconditioning these tests are performed to simulate the board mounting process where parts are subjected to a high temperature for a short duration. these tests detect mold compound delamination from the die and leadframe. the failure mechanisms are corrosion, fractured wirebonds and passivation cracks. 10tc + 24hr bake@125c + 168hr 85/85 + 3 ir@220c + 1x flux immersion + di rinse moisture level 1 msl 1 temperature cycling the purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. this testing will also expose excessive thermal mismatch between materials. test conditions: ta = -65c to 150c, air to air common failure modes: parametric shifts and catastrophic common failure mechanisms: wire bond, cracked or lifted die and package failure temperature cycle tc temperature cycling + moisture level preconditioning the purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. this testing will also expose excessive thermal mismatch between materials. test conditions: ta = -65c to 150c, air to air common failure modes: parametric shifts and catastrophic common failure mechanisms: wire bond, cracked or lifted die and package failure temperature cycle - pc tc-pc product reliability engineering services nzmm7v0t4_0450f_2001.pdf 7
test summary lot id rej test name ss test conditions & bias interval comment auto 0450a 0 30 ta = +121c, rh = 100%, psig = 15, n/a 0 hr. 0450a 0 30 96 hr. 0477b 0 77 0 hr. 0477b 0 77 96 hr. 0668a 0 77 0 hr. 0668a 0 77 96 hr. 0669a 0 77 0 hr. 0669a 0 77 96 hr. auto-pc 0477a 0 76 after msl-1 pre-conditioning: ta = +121c, rh = 100%, psig = 15, n/a 0 hr. 0477a 0 76 96 hr. 0668a 0 77 0 hr. 0668a 0 77 96 hr. 0669a 0 68 0 hr. 0669a 0 68 96 hr. bond pull 0477a 0 5 cond. c or d; pre- or post mold, n/a results bond shear 0477a 0 5 cond. c or d; pre- or post mold, n/a results dpa-h3trb- pc 0477a 0 2 random sample of good h3trb devices per cdf-aec-q101-004 section 4, n/a results product reliability engineering services 1 appendix a nzmm7v0t4_0669f_2000.pdf 0668a results 2 0 0669a results 2 0
test summary lot id rej test name ss test conditions & bias interval comment dpa-tc 0450a 0 2 random sample of good temp cycle devices per cdf-aec-q101-004 section 4, n/a results 0477a 0 2 results dpa-tc-pc 0477a 0 2 random sample of good temp cycle devices per cdf-aec-q101-004 section 4, n/a results elect dis 0477a 0 20 as specified, n/a results esd 0477a 0 5 mm, n/a results h3trb 0450a 0 29 ta = +85c, rh = 85%, +4.8 volts to pins 1-24 in parallel, to ground connection. note: pin 1 = pin 24 and pin 3 = pin 22. 0 hr. 0450a 0 29 504 hr. 0450a 0 29 1008 hr. 0477a 0 71 0 hr. 0477a 0 71 504 hr. 0477a 0 71 1008 hr. 0668a 0 77 0 hr. 0668a 0 77 504 hr. 0668a 0 77 1008 hr. 0669a 0 77 0 hr. 0669a 0 77 504 hr. 0669a 0 77 1008 hr. product reliability engineering services 2 appendix a nzmm7v0t4_0669f_2000.pdf
test summary lot id rej test name ss test conditions & bias interval comment h3trb-pc 0477a 0 59 after msl-1 pre-conditioning: ta = +85c; rh = 85%, +4.8 volts to pins 1-24 in parallel, to ground connection. 0 hr. 0477a 0 59 504 hr. 0477a 0 59 1008 hr. 0668a 0 77 0 hr. 0668a 0 77 1008 hr. 0669a 0 77 0 hr. 0669a 0 77 504 hr. htrb 0450a 0 28 ta = +150c, +4.8 volts to pins 1-24 in parallel, to ground connection. 0 hr. 0450a 0 28 504 hr. 0450a 0 28 1008 hr. 0477a 0 77 0 hr. 0477a 0 77 504 hr. 0477a 0 77 1008 hr. 0668a 0 77 0 hr. 0668a 0 77 504 hr. 0668a 0 77 1008 hr. 0669a 0 77 0 hr. product reliability engineering services 3 appendix a nzmm7v0t4_0669f_2000.pdf
test summary lot id rej test name ss test conditions & bias interval comment 0669a 0 77 504 hr. 0669a 0 77 1008 hr. iol 0450a 0 29 ta = +25c, delta tj => 100c, 2 minutes on/off, delta tj of 100c 0 cyc. 0450a 0 29 7500 cyc. 0450a 0 20 15000 cyc. 0477b 0 72 0 cyc. 0477b 0 72 7500 cyc. 0477b 0 72 15000 cyc. 0 249 by similarity with mmun1001lt1, 3 lots. 0 cyc. 0 249 by similarity with mmun1001lt1, 3 lots. 10000 cyc. iol-pc 0477a 0 75 after msl-1 pre-conditioning: ta = +25c, delta tj => 100c, 2 minutes on/off, 0 cyc. 0477a 0 75 7500 cyc. 0477a 0 75 15000 cyc. msl 1 0477a 0 307 10tc + 24hr bake@125c + 168hr 85/85 + 3 ir@220c + 1x flux immersion + di rinse, n/a 0 hr. 0477a 0 307 readout 0668a 0 320 0 hr. 0668a 0 320 readout product reliability engineering services 4 appendix a nzmm7v0t4_0669f_2000.pdf
test summary lot id rej test name ss test conditions & bias interval comment 0669a 0 320 0 hr. 0669a 0 320 readout tc 0450a 0 30 air to air; -65c to +150c, n/a 0 cyc. 0450a 0 30 500 cyc. 0450a 0 30 1000 cyc. 0477a 0 77 0 cyc. 0477a 0 77 500 cyc. 0477a 0 77 1000 cyc. 0668a 0 77 0 cyc. 0668a 0 77 500 cyc. 0668a 0 77 1000 cyc. 0669a 0 77 0 cyc. 0669a 0 77 500 cyc. 0669a 0 77 1000 cyc. tc-pc 0477a 0 77 after msl-1 pre-conditioning: air to air; -65c to +150c, n/a 0 cyc. 0477a 0 77 500 cyc. 0477a 0 77 1000 cyc. product reliability engineering services 5 appendix a nzmm7v0t4_0669f_2000.pdf
test summary lot id rej test name ss test conditions & bias interval comment 0668a 0 76 0 cyc. 0668a 0 76 500 cyc. 0668a 0 76 1000 cyc. 0669a 77 0 0 cyc. product reliability engineering services 6 appendix a nzmm7v0t4_0669f_2000.pdf tc-pc continued 0669a 500 cyc. 77 0 0669a 1000 cyc. 77 0
electrical characterization *note: no parametric limits have been negotiated for low/high (-55c/+150c) temperatures. parameter 25 degrees c initial vz @ 1ma, (volts) ir @ 3v, (amperes) 25 degrees c final high spec temp extreme +150c vz @ 1ma, (volts) ir @ 3v, (amperes) vz @ 1ma ir @ 3v spec min max 6 v 8 v reading min max 6.68 6.78 x bar 6.74 sigma 0.0163 cp cpk 82 15.1 n/a 1 ua -1.45e-10 1.59e-09 3.61e-10 1.15e-10 2909 2907 6 v 8 v 6.69 6.78 - - - - 1.92e-10 4.68e-08 n/a 1 ua - - - - 6.74 1.14e-09 - - 0.0152 2.70e-09 - - - - - - 88 123 16.4 123 8x20 surge to destruction study with all diodes in parallel. the highest peak power survived [by all units] was 251w. the highest current survived [by all units] was 18.3a. 1. 290.70 w 2. 251.37 w 3. 262.60 w 4. 260.24 w 5. 254.33 w wire bond tests C visual 45 pcs pass C wire pull 45 wires 1.72 cpk C ball shear 45 balls 1.69 cpk reliability summary pth 121c @ 2 atmospheres, saturated (100% rh), t = 96 hours. 231/0 pth-pc ditto pth after msl-1 preconditioning. 221/0 h3trb ta=85c; rh=85%; +4.8 volts to pins 1-24 in parallel to ground; t=500 hours. 231/0 h3trb-pc ditto h3trb after msl-1 preconditioning. 219/0 h3trb-pc-dpa h3trb-pc survivors. 6/0 htrb ta=150c; +4.8 volts to pins 1-24 in parallel to ground, t=500 hours. 231/0 tc air to air; -65c to +150c, 500 cycles 231/0 tc-pc ditto tc after msl-1 preconditioning. 231/0 tc-pc-dpa tc-pc survivors 6/0 iol delta tj>=100c, 7500 cycles, ton=toff=2 minutes. 231/0 esd machine model, >2kv (units passed >30kv) 5/0 surge >50w (units passed >250w) 5/0 bond shear 10 bonds from at least 5 units. (45 bonds were sheared.) 5/0 wire pull 10 wires from at least 5 units. (45 wires were pulled.) 5/0 test conditions samples/fail date: 11/15/2000 motorola part # nzmm7v0t4 supplier: on semiconductor product reliability engineering services 7 appendix a nzmm7v0t4_0669f_2000.pdf
450 a ac test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 9.24 9.33 9.302 0.020069 -154.5015 9.23 9.32 9.296 0.021909 -141.4341 12 vz(pin 12) 9.25 9.33 9.304333 0.01888 -164.2755 9.24 9.32 9.297333 0.020998 -147.5902 13 vz(pin 13) 9.25 9.33 9.306667 0.020229 -153.3584 9.25 9.33 9.3 0.020172 -153.6808 22 delta vz(t4-t13) -0.0128 0.004 -0.003773 0.00417 0.301638 -0.0124 0.0028 -0.00368 0.004141 0.296189 33 ir(pin 4) 1.02e-11 4.35e-11 2.43e-11 8.8e-12 -0.920435 -3.29e-10 4.86e-11 -1.02e-10 8.82e-11 0.38447 41 ir(pin 12) 1.54e-11 5.11e-11 3.48e-11 8.21e-12 -1.410966 -3.58e-11 6.52e-11 2.53e-11 2.59e-11 -0.325931 45 vf(pin 4) 2.1764 2.4092 2.294667 0.068845 -11.11025 2.1744 2.4188 2.295053 0.071759 -10.66094 53 vf(pin 12) 2.1652 2.4208 2.29708 0.075097 -10.19601 2.1572 2.4244 2.29784 0.078145 -9.801632 63 vres(pins 12-13) 0.99344 1.048 1.012629 0.012391 -27.24093 0.99096 1.0472 1.011417 0.012507 -26.95707 test number test name 4 vz(pin 4) -0.01 -0.01 -0.006 -0.108225 -0.107181 -0.064502 12 vz(pin 12) -0.01 -0.01 -0.007 -0.108108 -0.107181 -0.075234 13 vz(pin 13) 0 0 -0.006667 0 0 -0.071633 22 delta vz(t4-t13) 0.0004 -0.0012 9.33e-05 -3.125 -30 -2.472637 33 ir(pin 4) -3.39e-10 5.12e-12 -1.26e-10 -3315.234 11.76471 -518.5159 41 ir(pin 12) -5.12e-11 1.41e-11 -9.44e-12 -333.3333 27.5646 -27.16741 45 vf(pin 4) -0.002 0.0096 0.000387 -0.091895 0.398473 0.016851 53 vf(pin 12) -0.008 0.0036 0.00076 -0.369481 0.148711 0.033085 63 vres(pins 12-13) -0.00248 -0.0008 -0.001212 -0.249638 -0.076336 -0.119688 qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean rel id:= lot id:= rel test:= initial
450 a h 3trb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 9.21 9.31 9.276333 0.025795 -119.8707 9.21 9.31 9.273793 0.025272 -122.3201 12 vz(pin 12) 9.23 9.31 9.279667 0.022967 -134.6827 9.23 9.31 9.277586 0.022465 -137.6594 13 vz(pin 13) 9.23 9.31 9.281667 0.022296 -138.7622 9.23 9.3 9.27931 0.023289 -132.8155 22 delta vz(t4-t13) -0.0224 0.0084 -0.004467 0.006739 0.220954 -0.0228 0.0084 -0.004648 0.006853 0.226092 33 ir(pin 4) -6.4e-12 4.99e-11 2.14e-11 1.24e-11 -0.575756 -6.66e-11 1.98e-11 -1.11e-11 2e-11 0.185157 41 ir(pin 12) 2.56e-12 5.12e-11 2.49e-11 1.05e-11 -0.791943 0 9.47e-11 1.63e-11 1.82e-11 -0.298078 45 vf(pin 4) 2.0788 2.4008 2.277827 0.07161 -10.60286 2.0696 2.3644 2.260587 0.072301 -10.42209 53 vf(pin 12) 2.1088 2.4172 2.279627 0.069401 -10.94899 2.0992 2.3692 2.262747 0.067454 -11.18169 63 vres(pins 12-13) 1.0036 1.0488 1.028547 0.012898 -26.58221 1.0028 1.0476 1.027347 0.012714 -26.93449 test number test name 4 vz(pin 4) 0 0 -0.00254 0 0 -0.027384 12 vz(pin 12) 0 0 -0.00208 0 0 -0.02242 13 vz(pin 13) 0 -0.01 -0.002356 0 -0.107411 -0.025387 22 delta vz(t4-t13) -0.0004 0 -0.000182 1.785714 0 4.065101 33 ir(pin 4) -6.02e-11 -3.01e-11 -3.25e-11 940.625 -60.25641 -151.8821 41 ir(pin 12) -2.56e-12 4.35e-11 -8.63e-12 -100 85 -34.58783 45 vf(pin 4) -0.0092 -0.0364 -0.01724 -0.442563 -1.516161 -0.756863 53 vf(pin 12) -0.0096 -0.048 -0.01688 -0.455235 -1.985769 -0.740474 63 vres(pins 12-13) -0.0008 -0.0012 -0.0012 -0.079713 -0.114416 -0.116666 qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean rel id:= lot id:= rel test:= initial
450 a htrb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 9.23 9.31 9.283667 0.018473 -167.5147 9.23 9.72 9.323793 0.113528 -27.37583 12 vz(pin 12) 9.23 9.31 9.285 0.019783 -156.445 9.23 9.73 9.325517 0.109564 -28.3717 13 vz(pin 13) 9.24 9.31 9.286333 0.018659 -165.8949 9.24 9.73 9.327931 0.10887 -28.55981 22 delta vz(t4-t13) -0.0116 0.012 -0.00384 0.005467 0.234132 -0.0152 0.0416 -0.002855 0.01011 0.094135 33 ir(pin 4) 6e-13 5.63e-11 2.39e-11 1.26e-11 -0.632669 6e-13 5.63e-11 2.39e-11 1.26e-11 -0.632669 41 ir(pin 12) 1.28e-12 5.38e-11 2.76e-11 1.24e-11 -0.742245 1.28e-12 5.38e-11 2.76e-11 1.24e-11 -0.742245 45 vf(pin 4) 2.124 2.3784 2.281067 0.069591 -10.92604 2.124 2.3784 2.281067 0.069591 -10.92604 53 vf(pin 12) 2.1016 2.4048 2.291387 0.073276 -10.42357 2.1016 2.4048 2.291387 0.073276 -10.42357 63 vres(pins 12-13) 1.0012 1.0456 1.021973 0.014083 -24.1899 1.0012 1.0456 1.021973 0.014083 -24.1899 test number test name 4 vz(pin 4) 0 0.41 0.040126 0 4.403867 0.432226 12 vz(pin 12) 0 0.42 0.040517 0 4.511278 0.436373 13 vz(pin 13) 0 0.42 0.041598 0 4.511278 0.447945 22 delta vz(t4-t13) -0.0036 0.0296 0.000985 31.03448 246.6667 -25.64745 33 ir(pin 4) 000000 41 ir(pin 12) 000000 45 vf(pin 4) 000000 53 vf(pin 12) 000000 63 vres(pins 12-13) 000000 qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean rel id:= lot id:= rel test:= initial
477 a ac_pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.8 6.88 6.848571 0.019447 -117.3872 6.8 6.88 6.848158 0.019981 -114.2463 12 vz(pin 12) 6.8 6.88 6.851299 0.017041 -134.0158 6.8 6.89 6.850789 0.017871 -127.7831 13 vz(pin 13) 6.8 6.89 6.852468 0.018221 -125.3614 6.8 6.89 6.852632 0.018502 -123.459 22 delta vz(t4-t13) -0.0492 0.0464 -0.00439 0.018799 0.077836 -0.0492 0.0464 -0.004653 0.019005 0.081602 33 ir(pin 4) 1.48e-10 5.58e-10 2.44e-10 9.14e-11 -0.889065 6.56e-11 2.99e-08 6.37e-10 3.41e-09 -0.062288 41 ir(pin 12) -3.07e-11 7.16e-10 2.6e-10 1.1e-10 -0.787276 1.43e-10 3.05e-08 1.04e-09 3.85e-09 -0.090468 45 vf(pin 4) 1.0288 1.174 1.080836 0.034189 -10.53773 1.0252 1.1828 1.080626 0.03778 -9.534486 53 vf(pin 12) 1.028 1.1912 1.085631 0.039899 -9.069914 1.0252 1.197199 1.088095 0.04275 -8.484259 63 vres(pins 12-13) 0.92316 1.0304 0.960121 0.023109 -13.84929 0.9222 1.0308 0.960104 0.023168 -13.81377 test number test name 4 vz(pin 4) 0 0 -0.000414 0 0 -0.006038 12 vz(pin 12) 0 0.01 -0.000509 0 0.145349 -0.007433 13 vz(pin 13) 0 0 0.000164 0 0 0.002394 22 delta vz(t4-t13) 0 0 -0.000263 0 0 5.991903 33 ir(pin 4) -8.28e-11 2.94e-08 3.93e-10 -55.79203 5265.207 161.0864 41 ir(pin 12) 1.74e-10 2.97e-08 7.84e-10 -566.5365 4155.688 302.1515 45 vf(pin 4) -0.0036 0.0088 -0.00021 -0.349922 0.749574 -0.019439 53 vf(pin 12) -0.0028 0.005999 0.002464 -0.272374 0.50361 0.22692 63 vres(pins 12-13) -0.00096 0.0004 -1.68e-05 -0.103991 0.03882 -0.001753 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
477 a h3trb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.79 6.89 6.844935 0.020237 -112.7463417 6.79 6.88 6.841948 0.019402 -117.5501 12 vz(pin 12) 6.78 6.9 6.845584 0.019091 -119.527096 5.8 6.89 6.828701 0.12031 -18.91967 13 vz(pin 13) 6.79 6.9 6.847143 0.019253 -118.5469801 5.67 6.9 6.829351 0.135388 -16.8143 22 delta vz(t4-t13) -0.0588 0.0424 -0.002197 0.018272 0.040086516 -0.0592 1.18 0.013132 0.135971 -0.032194 33 ir(pin 4) 1.2e-10 4.02e-10 2.13e-10 5.7e-11 -1.242642362 -1.29e-10 3.51e-07 7.48e-09 4.63e-08 -0.05386 41 ir(pin 12) -3.33e-11 4.86e-10 2.34e-10 6.76e-11 -1.155301238 4.86e-11 4.41e-07 1.04e-08 6.27e-08 -0.055224 45 vf(pin 4) 1.0424 1.2108 1.089667 0.035242 -10.30640601 1.0424 1.2148 1.090847 0.036195 -10.04589 53 vf(pin 12) 1.039199 1.225999 1.087626 0.036306 -9.985752589 1.039199 1.23 1.089236 0.037067 -9.795209 63 vres(pins 12-13) 0.9354 1.035599 0.987463 0.026466 -12.43670901 0.93484 1.0352 0.987165 0.026228 -12.54579 test number test name 4 vz(pin 4) 0 -0.01 -0.002987 0 -0.145137881 -0.043638 12 vz(pin 12) -0.98 -0.01 -0.016883 -14.45428 -0.144927536 -0.246628 13 vz(pin 13) -1.12 0 -0.017792 -16.49485 0 -0.259849 22 delta vz(t4-t13) -0.0004 1.1376 0.01533 0.680272 2683.018868 -697.6359 33 ir(pin 4) -2.49e-10 3.51e-07 7.27e-09 -206.9884 87311.61239 3418.209 41 ir(pin 12) 8.19e-11 4.41e-07 1.02e-08 -245.8583 90664.80263 4332.455 45 vf(pin 4) 0 0.004 0.001179 0 0.330360093 0.108221 53 vf(pin 12) 0 0.004001 0.00161 0 0.326346106 0.148062 63 vres(pins 12-13) -0.00056 -0.000399 -0.000298 -0.059867 -0.038528427 -0.030197 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
477 a htrb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.8 6.88 6.845065 0.017519 -130.2433 6.8 6.89 6.846234 0.017399 -131.1595 12 vz(pin 12) 6.8 6.89 6.843117 0.016957 -134.5223 6.8 6.89 6.844286 0.017504 -130.3374 13 vz(pin 13) 6.79 6.88 6.845455 0.018104 -126.0401 6.79 6.89 6.846234 0.018781 -121.5085 22 delta vz(t4-t13) -0.0428 0.044 -0.000192 0.018241 0.003512 -0.0428 0.0428 -0.000405 0.018244 0.007403 33 ir(pin 4) 1.3e-10 3.98e-10 2.14e-10 5.71e-11 -1.2469 1.63e-10 3.12e-09 3.52e-10 4.33e-10 -0.270652 41 ir(pin 12) 1.28e-11 1.02e-09 2.45e-10 1.24e-10 -0.660285 5.42e-11 2.81e-09 3.43e-10 3.22e-10 -0.354583 45 vf(pin 4) 1.0324 1.1628 1.082 0.027192 -13.26372 1.0336 1.184 1.093792 0.034187 -10.66489 53 vf(pin 12) 1.0108 1.154 1.079766 0.026294 -13.68842 1.0172 1.172 1.090519 0.03221 -11.2855 63 vres(pins 12-13) 0.947 1.035599 0.988604 0.022346 -14.74688 0.95584 1.0436 0.997156 0.022172 -14.99104 test number test name 4 vz(pin 4) 0 0.01 0.001169 0 0.145349 0.017076 12 vz(pin 12) 0 0 0.001169 0 0 0.01708 13 vz(pin 13) 0 0.01 0.000779 0 0.145349 0.011383 22 delta vz(t4-t13) 0 -0.0012 -0.000213 0 -2.727273 110.8108 33 ir(pin 4) 3.21e-11 2.72e-09 1.38e-10 24.62435 682.98 64.7697 41 ir(pin 12) 4.14e-11 1.79e-09 9.72e-11 323.75 176.1071 39.57765 45 vf(pin 4) 0.0012 0.0212 0.011792 0.116234 1.823185 1.089853 53 vf(pin 12) 0.0064 0.018 0.010753 0.633162 1.559792 0.995888 63 vres(pins 12-13) 0.00884 0.008001 0.008552 0.933474 0.772596 0.865031 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
477 a tc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.8 6.87 6.843636 0.015467 -147.487 6.79 6.87 6.841429 0.017525 -130.1234 12 vz(pin 12) 6.79 6.87 6.841429 0.018261 -124.8834 6.78 6.87 6.84039 0.018669 -122.1347 13 vz(pin 13) 6.79 6.88 6.838831 0.020454 -111.4524 6.79 6.88 6.837662 0.020384 -111.813 22 delta vz(t4-t13) -0.0356 0.0432 0.004244 0.01852 -0.076389 -0.0352 0.0436 0.004281 0.018702 -0.076294 33 ir(pin 4) 1.36e-10 4.56e-10 2.03e-10 5.98e-11 -1.131223 -1.03e-09 4.71e-10 1.82e-10 1.57e-10 -0.386148 41 ir(pin 12) 2.81e-11 6.24e-10 2.23e-10 7.84e-11 -0.94718 1.56e-10 6.44e-10 2.3e-10 7.53e-11 -1.018398 45 vf(pin 4) 1.0384 1.1192 1.076026 0.019544 -18.35251 1.0568 1.146 1.098415 0.022575 -16.21855 53 vf(pin 12) 1.0324 1.126 1.076473 0.020987 -17.09762 1.0496 1.1508 1.098483 0.026699 -13.7143 63 vres(pins 12-13) 0.951 1.0352 0.990563 0.021335 -15.4766 0.95328 1.0364 0.99219 0.021391 -15.46139 test number test name 4 vz(pin 4) -0.01 0 -0.002208 -0.147059 0 -0.032261 12 vz(pin 12) -0.01 0 -0.001039 -0.147275 0 -0.015186 13 vz(pin 13) 0 0 -0.001169 0 0 -0.017091 22 delta vz(t4-t13) 0.0004 0.0004 3.64e-05 -1.123596 0.925926 0.856793 33 ir(pin 4) -1.17e-09 1.55e-11 -2.12e-11 -859.434 3.398016 -10.46064 41 ir(pin 12) 1.27e-10 1.94e-11 7.16e-12 453.2006 3.100775 3.210569 45 vf(pin 4) 0.0184 0.0268 0.022389 1.771957 2.394568 2.080754 53 vf(pin 12) 0.0172 0.0248 0.02201 1.666021 2.202487 2.044678 63 vres(pins 12-13) 0.00228 0.0012 0.001627 0.239748 0.11592 0.164251 qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean rel id:= lot id:= rel test:= initial
477 a t c_pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.81 6.89 6.856104 0.018364 -124.4454 6.81 6.89 6.857273 0.018399 -124.2339 12 vz(pin 12) 6.82 6.9 6.860649 0.015839 -144.3788 6.82 6.9 6.861818 0.01502 -152.2826 13 vz(pin 13) 6.82 6.89 6.861039 0.016826 -135.9207 6.82 6.89 6.861818 0.01668 -137.1249 22 delta vz(t4-t13) -0.0484 0.0448 -0.004421 0.015996 0.092122 -0.046 0.0444 -0.004223 0.016112 0.087374 33 ir(pin 4) 7.67e-11 4.94e-10 2.42e-10 7.37e-11 -1.093926 -1.51e-09 1.46e-09 2.47e-10 2.59e-10 -0.317362 41 ir(pin 12) 3.6e-13 6.88e-10 2.58e-10 8.94e-11 -0.963143 -1.04e-10 9.4e-10 2.62e-10 1.18e-10 -0.737936 45 vf(pin 4) 1.0412 1.2104 1.106099 0.041869 -8.805941 1.0516 1.22 1.122592 0.038166 -9.804461 53 vf(pin 12) 1.03 1.23 1.113839 0.044017 -8.434987 1.0376 1.2316 1.132208 0.044275 -8.523996 63 vres(pins 12-13) 0.92528 1.031999 0.96239 0.021807 -14.71091 0.92612 1.034 0.963589 0.021929 -14.64689 test number test name 4 vz(pin 4) 0 0 0.001169 0 0 0.017048 12 vz(pin 12) 0 0 0.001169 0 0 0.017037 13 vz(pin 13) 0 0 0.000779 0 0 0.011357 22 delta vz(t4-t13) 0.0024 -0.0004 0.000197 -4.958678 -0.892857 -4.465335 33 ir(pin 4) -1.59e-09 9.65e-10 4.9e-12 -2069.744 195.4085 2.024822 41 ir(pin 12) -1.04e-10 2.51e-10 3.73e-12 -28877.78 36.5502 1.444238 45 vf(pin 4) 0.0104 0.0096 0.016494 0.998847 0.793126 1.491147 53 vf(pin 12) 0.0076 0.0016 0.018369 0.737864 0.130081 1.649151 63 vres(pins 12-13) 0.00084 0.002001 0.0012 0.090783 0.193896 0.124638 qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean rel id:= lot id:= rel test:= initial
477 b auto test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.78 6.88 6.844935 0.017368 -131.3721 6.78 6.88 6.846494 0.017974 -126.9695 12 vz(pin 12) 6.78 6.88 6.846494 0.016604 -137.4447 6.78 6.88 6.847403 0.016336 -139.7243 13 vz(pin 13) 6.79 6.87 6.847143 0.014406 -158.438 6.79 6.87 6.848571 0.014022 -162.8054 22 delta vz(t4-t13) -0.068 0.0448 -0.00241 0.014075 0.057086 -0.0688 0.0452 -0.002192 0.013951 0.05238 33 ir(pin 4) 1.33e-10 4.58e-10 2.05e-10 6.78e-11 -1.004847 1.52e-10 1.62e-07 1.02e-08 2.64e-08 -0.129376 41 ir(pin 12) 1.6e-10 6.28e-10 2.24e-10 7.83e-11 -0.953507 1.75e-10 1.91e-06 1.95e-07 3.55e-07 -0.182605 45 vf(pin 4) 1.0348 1.1984 1.077823 0.030987 -11.59433 1.0328 1.2012 1.078176 0.030025 -11.96978 53 vf(pin 12) 1.0348 1.1496 1.076961 0.025729 -13.95269 1.0332 1.1708 1.078815 0.028103 -12.79578 63 vres(pins 12-13) 0.95124 1.024799 0.982684 0.021911 -14.9495 0.95184 1.024799 0.982702 0.021837 -15.00088 test number test name 4 vz(pin 4) 0 0 0.001558 0 0 0.022768 12 vz(pin 12) 0 0 0.000909 0 0 0.013278 13 vz(pin 13) 0 0 0.001429 0 0 0.020864 22 delta vz(t4-t13) -0.0008 0.0004 0.000218 1.176471 0.892857 -9.051724 33 ir(pin 4) 1.98e-11 1.62e-07 1e-08 14.91096 35335.41 4908.524 41 ir(pin 12) 1.57e-11 1.91e-06 1.94e-07 9.842224 303489.6 86749.98 45 vf(pin 4) -0.002 0.0028 0.000353 -0.193274 0.233645 0.032767 53 vf(pin 12) -0.0016 0.0212 0.001855 -0.154619 1.84412 0.172201 63 vres(pins 12-13) 0.0006 0 1.82e-05 0.063076 0 0.001857 qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean rel id:= lot id:= rel test:= initial
477 b iol test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.79 6.88 6.844416 0.017282 -132.0144 6.79 15 7.052987 1.306374 -1.799634 12 vz(pin 12) 6.78 6.88 6.846104 0.016635 -137.1821 6.78 15 7.053766 1.306226 -1.800037 13 vz(pin 13) 6.8 6.88 6.843506 0.017454 -130.6948 6.8 15 7.052078 1.306539 -1.799176 22 delta vz(t4-t13) -0.0636 0.0428 0.00093 0.018618 -0.016648 -0.0632 0.0408 0.000358 0.018468 -0.00647 33 ir(pin 4) 1.18e-10 3.78e-10 2.42e-10 5.15e-11 -1.564351 2.28e-12 1.73e-09 4.19e-10 3.5e-10 -0.399531 41 ir(pin 12) 1.58e-10 4.1e-10 2.62e-10 5.6e-11 -1.560668 -1.4e-12 3.73e-09 5.32e-10 7.05e-10 -0.25157 45 vf(pin 4) 1.042 1.2256 1.091745 0.026822 -13.56778 0.9804 5.0008 1.335521 0.972988 -0.457533 53 vf(pin 12) 1.0516 1.198 1.091075 0.022968 -15.83442 0.97936 5.0016 1.288207 0.875381 -0.490532 63 vres(pins 12-13) 0.94888 1.021199 0.978807 0.017955 -18.17141 0.94912 2.5016 1.019571 0.244248 -1.391443 test number test name 4 vz(pin 4) 0 8.12 0.208571 0 118.0233 3.047323 12 vz(pin 12) 0 8.12 0.207662 0 118.0233 3.033292 13 vz(pin 13) 0 8.12 0.208571 0 118.0233 3.047727 22 delta vz(t4-t13) 0.0004 -0.002 -0.000571 -0.628931 -4.672897 -61.45251 33 ir(pin 4) -1.15e-10 1.35e-09 1.77e-10 -98.06386 356.4504 73.36256 41 ir(pin 12) -1.6e-10 3.32e-09 2.69e-10 -100.8836 809.4727 102.6866 45 vf(pin 4) -0.0616 3.7752 0.243776 -5.911708 308.0287 22.32902 53 vf(pin 12) -0.07224 3.8036 0.197131 -6.869532 317.4958 18.06764 63 vres(pins 12-13) 0.00024 1.480401 0.040764 0.025293 144.9669 4.164625 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
668 a ac test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.74 6.82 6.778875 0.018623 -121.3346 6.74 6.82 6.78 0.018759 -120.4757 12 vz(pin 12) 6.74 6.82 6.77925 0.017413 -129.7705 6.73 6.82 6.779875 0.018106 -124.8172 13 vz(pin 13) 6.74 6.81 6.77825 0.018878 -119.6829 6.74 6.81 6.779375 0.019509 -115.8309 22 delta vz(t4-t13) -0.034 0.0412 0.000415 0.015505 -0.008922 -0.034 0.0476 0.000585 0.015782 -0.012356 33 ir(pin 4) 1.38e-10 6.57e-10 3.02e-10 9.42e-11 -1.069431 3.83e-11 1.27e-07 2.07e-09 1.42e-08 -0.048614 41 ir(pin 12) 1.68e-10 6.55e-10 3.27e-10 1.09e-10 -1.003264 1.59e-10 0.000102 1.27e-06 1.14e-05 -0.037305 45 vf(pin 4) 1.0684 1.178 1.118755 0.019124 -19.49977 1.0676 1.1804 1.11806 0.019711 -18.90734 53 vf(pin 12) 1.0748 1.1628 1.11657 0.016028 -23.22135 1.0748 1.1624 1.115845 0.016539 -22.48904 63 vres(pins 12-13) 0.93336 1.0156 0.968793 0.019054 -16.94778 0.93312 1.0156 0.968843 0.018935 -17.05579 test number test name 4 vz(pin 4) 0 0 0.001125 0 0 0.016596 12 vz(pin 12) -0.01 0 0.000625 -0.148368 0 0.009219 13 vz(pin 13) 0 0 0.001125 0 0 0.016597 22 delta vz(t4-t13) 0 0.0064 0.00017 0 15.53398 40.96386 33 ir(pin 4) -1e-10 1.26e-07 1.76e-09 -72.30903 19207.87 583.1368 41 ir(pin 12) -8.96e-12 0.000102 1.27e-06 -5.343511 15518425 388997.3 45 vf(pin 4) -0.0008 0.0024 -0.000695 -0.074878 0.203735 -0.062119 53 vf(pin 12) 0 -0.0004 -0.000725 0 -0.0344 -0.064925 63 vres(pins 12-13) -0.00024 0 5.1e-05 -0.025714 0 0.005263 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
668 a ac-pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.76 6.81 6.79025 0.009933 -227.861 6.76 6.82 6.791625 0.010607 -213.4252 12 vz(pin 12) 6.77 6.82 6.7925 0.009209 -245.8581 6.77 6.85 6.793625 0.01139 -198.8192 13 vz(pin 13) 6.77 6.81 6.791125 0.009139 -247.687 6.76 6.83 6.791375 0.01188 -190.5623 22 delta vz(t4-t13) -0.0316 0.0352 -0.000145 0.013781 0.003507 -0.0312 0.0352 4.5e-05 0.013841 -0.001084 33 ir(pin 4) 1.83e-10 6.23e-10 3.09e-10 9.41e-11 -1.093937 -4.84e-09 0.002266 2.83e-05 0.000253 -0.037279 41 ir(pin 12) 1.77e-10 7.85e-10 3.35e-10 1.08e-10 -1.031747 2.09e-10 0.005155 6.45e-05 0.000576 -0.037327 45 vf(pin 4) 1.1 1.183599 1.124765 0.016396 -22.8663 1.1028 1.5444 1.181585 0.098522 -3.997692 53 vf(pin 12) 1.088799 1.1672 1.124215 0.015543 -24.11016 1.0948 1.5452 1.18137 0.101048 -3.897051 63 vres(pins 12-13) 0.93416 1.008 0.973483 0.017875 -18.1532 0.93332 1.0068 0.972797 0.017847 -18.16895 test number test name 4 vz(pin 4) 0 0.01 0.001375 0 0.146843 0.02025 12 vz(pin 12) 0 0.03 0.001125 0 0.439883 0.016562 13 vz(pin 13) -0.01 0.02 0.00025 -0.14771 0.293686 0.003681 22 delta vz(t4-t13) 0.0004 0 0.00019 -1.265823 0 -131.0345 33 ir(pin 4) -5.02e-09 0.002266 2.83e-05 -2744.872 3.64e+08 9174734 41 ir(pin 12) 3.24e-11 0.005155 6.45e-05 18.34239 6.57e+08 19287794 45 vf(pin 4) 0.0028 0.360801 0.05682 0.254545 30.48338 5.05172 53 vf(pin 12) 0.006001 0.378 0.057155 0.551158 32.3852 5.083995 63 vres(pins 12-13) -0.00084 -0.0012 -0.000686 -0.08992 -0.119048 -0.07052 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
668 a h3trb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.75 6.81 6.7875 0.012579 -179.8652 6.75 6.81 6.787875 0.013187 -171.5744 12 vz(pin 12) 6.75 6.82 6.7875 0.012779 -177.0546 6.75 6.82 6.787375 0.012703 -178.0985 13 vz(pin 13) 6.75 6.81 6.786375 0.01139 -198.6071 6.75 6.81 6.78625 0.011515 -196.4469 22 delta vz(t4-t13) -0.0348 0.0268 0.00101 0.011813 -0.028499 -0.0348 0.0264 0.001185 0.011902 -0.033186 33 ir(pin 4) 1.72e-10 9.29e-10 3.21e-10 1.09e-10 -0.981853 -6.68e-08 2.55e-07 -1.14e-08 3.72e-08 0.101837 41 ir(pin 12) 2.03e-10 7.74e-10 3.39e-10 1.02e-10 -1.112583 -5.99e-08 2.71e-07 6.56e-09 4.47e-08 -0.048942 45 vf(pin 4) 1.0836 1.174 1.120415 0.019008 -19.64817 1.0836 1.1744 1.119745 0.019755 -18.89408 53 vf(pin 12) 1.076 1.1784 1.1174 0.02044 -18.22215 1.074 1.1952 1.11695 0.021846 -17.04257 63 vres(pins 12-13) 0.93716 1.0024 0.973321 0.014222 -22.8128 0.93536 0.99744 0.971776 0.014114 -22.94998 test number test name 4 vz(pin 4) 0 0 0.000375 0 0 0.005525 12 vz(pin 12) 0 0 -0.000125 0 0 -0.001842 13 vz(pin 13) 0 0 -0.000125 0 0 -0.001842 22 delta vz(t4-t13) 0 -0.0004 0.000175 0 -1.492537 17.32673 33 ir(pin 4) -6.7e-08 2.54e-07 -1.17e-08 -39052.89 27326.58 -3637.962 41 ir(pin 12) -6.01e-08 2.71e-07 6.22e-09 -29568.71 34936.16 1832.248 45 vf(pin 4) 0 0.0004 -0.00067 0 0.034072 -0.059799 53 vf(pin 12) -0.002 0.0168 -0.00045 -0.185874 1.425662 -0.040263 63 vres(pins 12-13) -0.0018 -0.00496 -0.001545 -0.19207 -0.494812 -0.158735 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
668 a h 3trb_pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.76 6.81 6.78925 0.010527 -214.974 6.76 6.81 6.789625 0.010487 -215.804 12 vz(pin 12) 6.76 6.81 6.788625 0.010156 -222.8069 6.76 6.81 6.789375 0.010354 -218.581 13 vz(pin 13) 6.77 6.81 6.78825 0.008827 -256.3516 6.77 6.81 6.788875 0.009 -251.4447 22 delta vz(t4-t13) -0.0244 0.0248 -0.000145 0.011539 0.004189 -0.0248 0.0272 0.00029 0.012036 -0.008031 33 ir(pin 4) 8.19e-11 6.75e-10 2.99e-10 1.01e-10 -0.983935 1.95e-10 4.47e-07 5.98e-09 5e-08 -0.039868 41 ir(pin 12) 1.52e-10 7.17e-10 3.28e-10 1.11e-10 -0.987966 2.33e-10 4.22e-07 9.91e-09 5.93e-08 -0.055683 45 vf(pin 4) 1.0748 1.1768 1.12252 0.020148 -18.57146 1.0736 1.1884 1.12275 0.021873 -17.11032 53 vf(pin 12) 1.074 1.1624 1.114545 0.017158 -21.6531 1.072 1.1632 1.11462 0.018195 -20.41985 63 vres(pins 12-13) 0.94952 1.0092 0.98607 0.014711 -22.34333 0.9488 1.007599 0.985216 0.014574 -22.53382 test number test name 4 vz(pin 4) 0 0 0.000375 0 0 0.005523 12 vz(pin 12) 0 0 0.00075 0 0 0.011048 13 vz(pin 13) 0 0 0.000625 0 0 0.009207 22 delta vz(t4-t13) -0.0004 0.0024 0.000435 1.639344 9.677419 -300 33 ir(pin 4) 1.13e-10 4.47e-07 5.68e-09 137.5 66149.93 1899.515 41 ir(pin 12) 8.08e-11 4.21e-07 9.58e-09 53.06176 58770.47 2920.678 45 vf(pin 4) -0.0012 0.0116 0.00023 -0.111649 0.985724 0.020491 53 vf(pin 12) -0.002 0.0008 7.51e-05 -0.18622 0.068823 0.006735 63 vres(pins 12-13) -0.00072 -0.001601 -0.000854 -0.075828 -0.158641 -0.086557 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
668 a htrb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.74 6.81 6.77275 0.017573 -128.4715 6.74 6.81 6.772625 0.017983 -125.5349 12 vz(pin 12) 6.73 6.81 6.768625 0.0177 -127.4724 6.73 6.81 6.768875 0.017062 -132.2381 13 vz(pin 13) 6.74 6.82 6.769875 0.018315 -123.2141 6.74 6.82 6.77025 0.018279 -123.4628 22 delta vz(t4-t13) -0.0344 0.0508 0.003075 0.015854 -0.064654 -0.0344 0.05 0.002865 0.015882 -0.060129 33 ir(pin 4) 3.57e-11 4.55e-09 2.93e-10 4.97e-10 -0.196674 1.65e-10 4.45e-09 7.36e-10 8.16e-10 -0.300719 41 ir(pin 12) 1.2e-10 2.06e-09 2.79e-10 2.19e-10 -0.425061 2.33e-10 4.02e-09 7.79e-10 7.49e-10 -0.346691 45 vf(pin 4) 1.064 1.168 1.114555 0.020069 -18.51233 1.0548 1.1724 1.10612 0.021897 -16.83807 53 vf(pin 12) 1.0628 1.1788 1.11491 0.021085 -17.62599 1.056 1.1896 1.108495 0.024772 -14.91571 63 vres(pins 12-13) 0.93228 0.99188 0.968517 0.01351 -23.89552 0.93876 1.0008 0.975996 0.01397 -23.28827 test number test name 4 vz(pin 4) 0 0 -0.000125 0 0 -0.001846 12 vz(pin 12) 0 0 0.00025 0 0 0.003694 13 vz(pin 13) 0 0 0.000375 0 0 0.005539 22 delta vz(t4-t13) 0 -0.0008 -0.00021 0 -1.574803 -6.829268 33 ir(pin 4) 1.3e-10 -1.02e-10 4.42e-10 363.7892 -2.250945 150.731 41 ir(pin 12) 1.13e-10 1.96e-09 5e-10 93.61702 94.85736 179.2179 45 vf(pin 4) -0.0092 0.0044 -0.008435 -0.864662 0.376712 -0.75681 53 vf(pin 12) -0.0068 0.0108 -0.006415 -0.639819 0.916186 -0.575383 63 vres(pins 12-13) 0.00648 0.00892 0.007479 0.69507 0.899302 0.772262 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
668 a tc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.73 6.81 6.765625 0.020429 -110.3949 6.73 6.82 6.769125 0.020635 -109.3465 12 vz(pin 12) 6.73 6.84 6.765375 0.01728 -130.5064 6.73 6.84 6.766625 0.01757 -128.3718 13 vz(pin 13) 6.74 6.82 6.765 0.015508 -145.4063 6.74 6.82 6.7665 0.015598 -144.6038 22 delta vz(t4-t13) -0.0516 0.0452 0.00124 0.018192 -0.022721 -0.0528 0.0496 0.003 0.018486 -0.054094 33 ir(pin 4) 1.35e-11 4.71e-10 2.22e-10 8.02e-11 -0.922248 3.33e-11 1.08e-08 3.92e-10 1.19e-09 -0.109596 41 ir(pin 12) 1.15e-10 7.92e-10 2.61e-10 1.05e-10 -0.825086 1.21e-10 7.94e-10 2.78e-10 1.13e-10 -0.816229 45 vf(pin 4) 1.0644 1.16 1.11698 0.018991 -19.60557 1.0748 1.4456 1.1418 0.058428 -6.514034 53 vf(pin 12) 1.0792 1.1848 1.119775 0.021966 -16.99245 1.0812 1.1952 1.12423 0.02652 -14.13056 63 vres(pins 12-13) 0.91952 0.9846 0.957155 0.017681 -18.04443 0.92036 0.9854 0.959148 0.017087 -18.71122 test number test name 4 vz(pin 4) 0 0.01 0.0035 0 0.146843 0.051732 12 vz(pin 12) 0 0 0.00125 0 0 0.018476 13 vz(pin 13) 0 0 0.0015 0 0 0.022173 22 delta vz(t4-t13) -0.0012 0.0044 0.00176 2.325581 9.734513 141.9355 33 ir(pin 4) 1.98e-11 1.03e-08 1.7e-10 146.8843 2197.045 76.76788 41 ir(pin 12) 5.84e-12 1.92e-12 1.7e-11 5.071205 0.242522 6.525481 45 vf(pin 4) 0.0104 0.2856 0.02482 0.977076 24.62069 2.222068 53 vf(pin 12) 0.002 0.0104 0.004455 0.185322 0.877785 0.397842 63 vres(pins 12-13) 0.00084 0.0008 0.001993 0.091352 0.081251 0.208221 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
668 a t c_pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.77 6.81 6.788875 0.009678 -233.8358 6.77 6.83 6.799125 0.011821 -191.7279 12 vz(pin 12) 6.77 6.8 6.789 0.00773 -292.7704 6.77 6.84 6.79625 0.01226 -184.7757 13 vz(pin 13) 6.76 6.81 6.788625 0.009513 -237.8806 6.76 6.84 6.795875 0.013187 -171.7766 22 delta vz(t4-t13) -0.028 0.032 0.00011 0.01221 -0.003003 -0.024 0.0352 0.00279 0.011925 -0.077989 33 ir(pin 4) 1.64e-10 9.13e-10 3.09e-10 1.12e-10 -0.91428 1.95e-10 1.99e-07 7.58e-09 2.92e-08 -0.086544 41 ir(pin 12) 2.05e-10 7.58e-10 3.22e-10 1.04e-10 -1.03603 -6.86e-08 2.91e-08 -5.23e-10 1.08e-08 0.016101 45 vf(pin 4) 1.0924 1.1816 1.12113 0.016216 -23.04541 1.1136 1.5332 1.22038 0.107541 -3.782691 53 vf(pin 12) 1.0848 1.1608 1.11578 0.016298 -22.82078 1.0976 1.494 1.19764 0.102401 -3.898525 63 vres(pins 12-13) 0.94028 1.0136 0.976649 0.016666 -19.53377 0.94208 1.0144 0.978392 0.016507 -19.75652 test number test name 4 vz(pin 4) 0 0.02 0.01025 0 0.293686 0.150982 12 vz(pin 12) 0 0.04 0.00725 0 0.588235 0.10679 13 vz(pin 13) 0 0.03 0.00725 0 0.440529 0.106796 22 delta vz(t4-t13) 0.004 0.0032 0.00268 -14.28571 10 2436.364 33 ir(pin 4) 3.07e-11 1.98e-07 7.27e-09 18.72559 21689.2 2357.426 41 ir(pin 12) -6.88e-08 2.83e-08 -8.45e-10 -33600 3734.987 -262.6112 45 vf(pin 4) 0.0212 0.3516 0.09925 1.940681 29.75626 8.852679 53 vf(pin 12) 0.0128 0.3332 0.08186 1.179941 28.70434 7.336574 63 vres(pins 12-13) 0.0018 0.0008 0.001742 0.191432 0.078927 0.178416 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
669 a ac test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.71 6.76 6.742875 0.011605 -193.6833 6.71 6.76 6.743375 0.011577 -194.1544 12 vz(pin 12) 6.72 6.77 6.7425 0.01085 -207.1437 6.72 6.77 6.744 0.010978 -204.7818 13 vz(pin 13) 6.72 6.77 6.742875 0.011046 -203.4825 6.72 6.77 6.74375 0.010952 -205.2599 22 delta vz(t4-t13) -0.038 0.0296 -0.00012 0.013637 0.002933 -0.0372 0.0296 -0.00061 0.013978 0.014547 33 ir(pin 4) 1.94e-10 1.08e-09 3.77e-10 1.45e-10 -0.865921 1.22e-10 1.74e-08 8.5e-10 2.29e-09 -0.124024 41 ir(pin 12) 2.39e-10 8.86e-10 3.84e-10 1.25e-10 -1.025702 2.05e-10 1.24e-07 8.1e-09 2.06e-08 -0.131319 45 vf(pin 4) 1.0528 1.1496 1.08193 0.019775 -18.23732 1.052 1.602 1.089245 0.061636 -5.890751 53 vf(pin 12) 1.0532 1.1844 1.084235 0.025808 -14.00403 1.0528 1.6212 1.09201 0.065776 -5.534017 63 vres(pins 12-13) 0.95388 1.0168 0.986099 0.017154 -19.16204 0.9534 1.0168 0.986073 0.017236 -19.07025 test number test name 4 vz(pin 4) 0 0 0.0005 0 0 0.007415 12 vz(pin 12) 0 0 0.0015 0 0 0.022247 13 vz(pin 13) 0 0 0.000875 0 0 0.012977 22 delta vz(t4-t13) 0.0008 0 -0.00049 -2.105263 0 408.3333 33 ir(pin 4) -7.17e-11 1.63e-08 4.73e-10 -36.95607 1519.048 125.4237 41 ir(pin 12) -3.43e-11 1.23e-07 7.72e-09 -14.3383 13937.31 2013.002 45 vf(pin 4) -0.0008 0.4524 0.007315 -0.075988 39.35282 0.676109 53 vf(pin 12) -0.0004 0.4368 0.007775 -0.037979 36.87943 0.717092 63 vres(pins 12-13) -0.00048 0 -2.65e-05 -0.050321 0 -0.00269 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
669 a ac_pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.7 6.77 6.739875 0.014275 -157.3795 6.7 15 7.168734 1.820281 -1.312752 12 vz(pin 12) 6.7 6.77 6.738625 0.014473 -155.1962 6.7 15 7.477975 2.36048 -1.055996 13 vz(pin 13) 6.7 6.78 6.73825 0.015733 -142.7613 6.7 15 7.164177 1.821307 -1.311179 22 delta vz(t4-t13) -0.04 0.0348 0.001815 0.016889 -0.035823 -0.0316 0.0592 0.004294 0.018002 -0.079501 33 ir(pin 4) 1.84e-10 2.71e-09 3.54e-10 2.81e-10 -0.419642 -1.16e-09 1.98e-07 4.69e-09 2.49e-08 -0.062809 41 ir(pin 12) 2.2e-10 1.15e-09 3.91e-10 1.49e-10 -0.873124 -1.14e-10 5.16e-07 1.32e-08 6.28e-08 -0.070159 45 vf(pin 4) 1.0452 1.1508 1.08689 0.025625 -14.13864 1.048 5.0012 1.767555 1.435462 -0.41045 53 vf(pin 12) 1.0496 1.1496 1.09448 0.023324 -15.64144 1.0616 5.0016 1.877095 1.513495 -0.413413 63 vres(pins 12-13) 0.9528 1.0164 0.983239 0.01648 -19.88796 0.957 2.5016 1.125558 0.433597 -0.865287 test number test name 4 vz(pin 4) 0 8.23 0.428859 0 121.5657 6.363014 12 vz(pin 12) 0 8.23 0.73935 0 121.5657 10.97182 13 vz(pin 13) 0 8.22 0.425927 0 121.2389 6.321036 22 delta vz(t4-t13) 0.0084 0.0244 0.002479 -21 70.11494 136.5659 33 ir(pin 4) -1.35e-09 1.95e-07 4.34e-09 -731.0547 7190.285 1224.681 41 ir(pin 12) -3.33e-10 5.15e-07 1.28e-08 -151.6464 44814.72 3284.183 45 vf(pin 4) 0.0028 3.8504 0.680665 0.267891 334.5846 62.62503 53 vf(pin 12) 0.012 3.852 0.782615 1.143293 335.0731 71.50567 63 vres(pins 12-13) 0.0042 1.4852 0.142319 0.440806 146.1236 14.4745 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
669 a h3trb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.69 6.78 6.74475 0.013499 -166.5529 6.7 6.78 6.745875 0.012798 -175.7051 12 vz(pin 12) 6.71 6.78 6.742875 0.010814 -207.8408 6.71 6.78 6.743625 0.011052 -203.3996 13 vz(pin 13) 6.71 6.78 6.744 0.011092 -202.6641 6.71 6.78 6.74475 0.010905 -206.1625 22 delta vz(t4-t13) -0.026 0.0416 0.0016 0.014501 -0.036778 -0.0264 0.0412 0.00158 0.014529 -0.03625 33 ir(pin 4) -5.63e-11 7.85e-10 3.29e-10 1.1e-10 -0.991364 -1.78e-10 9.51e-10 3.36e-10 1.43e-10 -0.784415 41 ir(pin 12) 2.23e-10 7.12e-10 3.56e-10 1.13e-10 -1.053806 2.25e-10 3.43e-09 4.29e-10 3.87e-10 -0.369426 45 vf(pin 4) 1.0472 1.1312 1.077286 0.019451 -18.46156 1.0444 1.13 1.07608 0.020226 -17.73454 53 vf(pin 12) 1.0412 1.1528 1.081772 0.025143 -14.34165 1.0384 1.1532 1.08091 0.025901 -13.91072 63 vres(pins 12-13) 0.94732 1.0108 0.980615 0.015704 -20.81513 0.94592 1.0092 0.979238 0.015559 -20.97971 test number test name 4 vz(pin 4) 0.01 0 0.001125 0.149477 0 0.01668 12 vz(pin 12) 0 0 0.00075 0 0 0.011123 13 vz(pin 13) 0 0 0.00075 0 0 0.011121 22 delta vz(t4-t13) -0.0004 -0.0004 -2e-05 1.538462 -0.961538 -1.25 33 ir(pin 4) -1.21e-10 1.66e-10 7.21e-12 215.2699 21.16532 2.193106 41 ir(pin 12) 1.88e-12 2.72e-09 7.32e-11 0.84154 382.0415 20.56914 45 vf(pin 4) -0.0028 -0.0012 -0.001206 -0.26738 -0.106082 -0.111948 53 vf(pin 12) -0.0028 0.0004 -0.000862 -0.26892 0.034698 -0.079697 63 vres(pins 12-13) -0.0014 -0.0016 -0.001376 -0.147785 -0.15829 -0.14034 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
669 a h 3trb_pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.72 6.77 6.74175 0.010765 -208.7545 6.72 6.79 6.744 0.012788 -175.7837 12 vz(pin 12) 6.72 6.77 6.742875 0.009704 -231.6261 6.72 6.79 6.744625 0.011577 -194.1904 13 vz(pin 13) 6.72 6.76 6.742625 0.010403 -216.0578 6.72 6.79 6.745 0.012013 -187.1638 22 delta vz(t4-t13) -0.0276 0.0268 -0.00086 0.012697 0.022578 -0.0276 0.0272 -0.00062 0.012581 0.016427 33 ir(pin 4) 2.01e-10 7.78e-10 3.59e-10 1.15e-10 -1.043961 -1.54e-10 1.5e-08 6.3e-10 1.67e-09 -0.125896 41 ir(pin 12) 1.77e-10 1.45e-09 3.86e-10 1.69e-10 -0.762313 -3.58e-11 4.14e-09 6.03e-10 6.18e-10 -0.324959 45 vf(pin 4) 1.0456 1.123999 1.07629 0.017109 -20.96963 1.0444 1.3024 1.076705 0.0311 -11.5403 53 vf(pin 12) 1.049999 1.1348 1.082115 0.018055 -19.97845 1.0476 1.3296 1.082765 0.03391 -10.64358 63 vres(pins 12-13) 0.95308 1.008 0.98566 0.016036 -20.48868 0.95184 1.0072 0.98504 0.016109 -20.38271 test number test name 4 vz(pin 4) 0 0.02 0.00225 0 0.295421 0.033374 12 vz(pin 12) 0 0.02 0.00175 0 0.295421 0.025953 13 vz(pin 13) 0 0.03 0.002375 0 0.443787 0.035224 22 delta vz(t4-t13) 0 0.0004 0.00024 0 1.492537 -27.90698 33 ir(pin 4) -3.55e-10 1.42e-08 2.71e-10 -176.5572 1824.342 75.50342 41 ir(pin 12) -2.13e-10 2.69e-09 2.17e-10 -120.212 185.0496 56.04542 45 vf(pin 4) -0.0012 0.178401 0.000415 -0.114767 15.87199 0.038563 53 vf(pin 12) -0.002399 0.1948 0.00065 -0.228476 17.16602 0.060071 63 vres(pins 12-13) -0.00124 -0.0008 -0.00062 -0.130105 -0.079365 -0.062949 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
669 a htrb test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.68 6.77 6.737875 0.015483 -145.0573 6.7 6.77 6.7385 0.014504 -154.8603 12 vz(pin 12) 6.68 6.77 6.74025 0.017573 -127.855 6.7 6.77 6.74075 0.016209 -138.6242 13 vz(pin 13) 6.68 6.77 6.739375 0.016939 -132.6167 6.7 6.77 6.74025 0.015909 -141.2237 22 delta vz(t4-t13) -0.0392 0.0224 -0.00159 0.011923 0.044453 -0.0392 0.0208 -0.00184 0.011915 0.051478 33 ir(pin 4) 2.29e-10 5.53e-10 3.4e-10 7.42e-11 -1.526148 2.15e-10 4.68e-08 1.53e-09 5.38e-09 -0.09496 41 ir(pin 12) 2.32e-10 7.17e-10 3.81e-10 1.04e-10 -1.220833 2.76e-10 6.32e-09 1.01e-09 1.18e-09 -0.284882 45 vf(pin 4) 1.0512 1.1456 1.086795 0.021038 -17.21977 1.0488 1.1476 1.086095 0.022405 -16.15848 53 vf(pin 12) 1.0512 1.1696 1.087225 0.024419 -14.84121 1.0492 1.1828 1.0871 0.026753 -13.54495 63 vres(pins 12-13) 0.95144 1.007599 0.980061 0.012795 -25.53203 0.95944 1.0156 0.988561 0.013319 -24.74067 test number test name 4 vz(pin 4) 0.02 0 0.000625 0.299401 0 0.009276 12 vz(pin 12) 0.02 0 0.0005 0.299401 0 0.007418 13 vz(pin 13) 0.02 0 0.000875 0.299401 0 0.012983 22 delta vz(t4-t13) 0 -0.0016 -0.00025 0 -7.142857 15.72327 33 ir(pin 4) -1.39e-11 4.62e-08 1.19e-09 -6.079665 8361.372 351.2007 41 ir(pin 12) 4.43e-11 5.61e-09 6.32e-10 19.10016 782.1231 165.922 45 vf(pin 4) -0.0024 0.002 -0.0007 -0.228311 0.174581 -0.064407 53 vf(pin 12) -0.002 0.0132 -0.000125 -0.190259 1.128591 -0.011491 63 vres(pins 12-13) 0.008 0.008001 0.0085 0.840831 0.794066 0.867292 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
669 a tc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.7 6.77 6.729625 0.016493 -136.0121 6.7 6.78 6.732 0.017459 -128.5311 12 vz(pin 12) 6.7 6.76 6.727875 0.016512 -135.8188 6.7 6.76 6.729375 0.017455 -128.511 13 vz(pin 13) 6.7 6.75 6.72825 0.014476 -154.928 6.7 6.77 6.72925 0.015076 -148.7874 22 delta vz(t4-t13) -0.0232 0.0284 0.001075 0.011861 -0.030211 -0.022 0.0308 0.002585 0.011683 -0.073755 33 ir(pin 4) 2.27e-10 8.78e-10 3.79e-10 1.24e-10 -1.018684 2.17e-10 8.72e-10 3.79e-10 1.28e-10 -0.986782 41 ir(pin 12) 2.46e-10 1.15e-09 4.11e-10 1.47e-10 -0.930786 2.05e-11 1.63e-09 4.24e-10 2.04e-10 -0.693545 45 vf(pin 4) 1.049999 1.158 1.101345 0.027077 -13.55797 1.0556 1.388 1.12994 0.052922 -7.117051 53 vf(pin 12) 1.0488 1.1452 1.098505 0.025394 -14.41927 1.0524 1.4464 1.11386 0.04997 -7.430143 63 vres(pins 12-13) 0.95696 1.0144 0.989678 0.011996 -27.50083 0.95876 1.0424 0.992059 0.013497 -24.50026 test number test name 4 vz(pin 4) 0 0.01 0.002375 0 0.14771 0.035292 12 vz(pin 12) 0 0 0.0015 0 0 0.022295 13 vz(pin 13) 0 0.02 0.001 0 0.296296 0.014863 22 delta vz(t4-t13) 0.0012 0.0024 0.00151 -5.172414 8.450704 140.4651 33 ir(pin 4) -9.64e-12 -6.4e-12 2.7e-13 -4.247444 -0.728863 0.071208 41 ir(pin 12) -2.25e-10 4.77e-10 1.3e-11 -91.66667 41.42361 3.152952 45 vf(pin 4) 0.005601 0.23 0.028595 0.533429 19.86183 2.596375 53 vf(pin 12) 0.0036 0.3012 0.015355 0.343249 26.30108 1.397803 63 vres(pins 12-13) 0.0018 0.028 0.002381 0.188096 2.760252 0.240582 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
669 a t c_pc test number test name min max mean stdev cpk min max mean stdev cpk 4 vz(pin 4) 6.69 6.75 6.719875 0.014007 -159.9209 6.69 6.75 6.72175 0.01385 -161.7695 12 vz(pin 12) 6.69 6.76 6.718375 0.015298 -146.3871 6.69 6.76 6.72 0.015261 -146.7752 13 vz(pin 13) 6.7 6.76 6.718 0.013632 -164.2742 6.7 6.76 6.719875 0.013547 -165.3439 22 delta vz(t4-t13) -0.0404 0.0428 0.00196 0.015251 -0.042838 -0.0404 0.0432 0.002625 0.015223 -0.05748 33 ir(pin 4) 2.46e-10 9.32e-10 4.11e-10 1.25e-10 -1.091899 -1.2e-13 1.33e-09 4.48e-10 1.83e-10 -0.815688 41 ir(pin 12) 2.44e-10 1.13e-09 4.38e-10 1.42e-10 -1.026467 8.96e-12 1.23e-09 4.8e-10 1.94e-10 -0.824766 45 vf(pin 4) 1.068 1.1488 1.10646 0.018962 -19.45068 1.0668 1.398399 1.11853 0.045741 -8.151217 53 vf(pin 12) 1.072 1.155599 1.11297 0.019108 -19.41545 1.07 1.4596 1.12083 0.053264 -7.014251 63 vres(pins 12-13) 0.9538 1.007599 0.990317 0.011942 -27.64191 0.95456 1.0084 0.990465 0.011927 -27.68046 test number test name 4 vz(pin 4) 0 0 0.001875 0 0 0.027902 12 vz(pin 12) 0 0 0.001625 0 0 0.024187 13 vz(pin 13) 0 0 0.001875 0 0 0.02791 22 delta vz(t4-t13) 0 0.0004 0.000665 0 0.934579 33.92857 33 ir(pin 4) -2.46e-10 3.97e-10 3.72e-11 -100.0488 42.55666 9.045965 41 ir(pin 12) -2.35e-10 1.02e-10 4.15e-11 -96.32907 9.090909 9.471669 45 vf(pin 4) -0.0012 0.249599 0.01207 -0.11236 21.72693 1.090869 53 vf(pin 12) -0.002 0.304001 0.00786 -0.186567 26.30679 0.706222 63 vres(pins 12-13) 0.00076 0.000801 0.000148 0.079681 0.079496 0.014898 rel id:= lot id:= rel test:= initial qual point delta min delta max delta mean delta(%) min delta(%) max delta(%) mean
quality and continuous improvement this report is a summary of reliability data for the logic two-gate and analog switch devices in the sc88 package. also included is 260 deg c ir preconditioning test results which will allow this package to utilize lead free plating in the future. 10/31/2001 date: mark wasilewski reliability manager 602-244-5114 602-244-7079 ken fergus reliability engineer reliability customer report family qualification 1) introduction: 2) device description: data references: the following standard logic devices are qualified by similarity based on the data in this report: nl27wz04dft2, nl27wz06dft2, nl27wz07dft2, nl27wz14dft2, nl27wz16dft2, nl27wzu04dft2, nlast4599dft2/4, nlas4599dft2/4. related qualification report(s): pcn: nl27wzu04dft2 device n/a line source 0.6 micron cmos parent tech cmos technology sbn assembly site malaysia chartered wafer fab site singapore sbn malaysia final test site t.5 3rd. d bldg. reliability lab phoenix, az sc-88 package n/a polarity die size 451 um x 911 um flag size max. current max. voltage qual id 1242 product reliability engineering services nl27wzu04dft2_1242_2001.pdf 1
quality and continuous improvement 3) qualification results analysis: see attached reliability reports 4) conclusion: full qualification is granted for logic two-gate and analog switches in the sc88 package. product reliability engineering services nl27wzu04dft2_1242_2001.pdf 2
* test results contained herein are for information only. this report does not alter on semiconductor 's standard warranty or product specifications. device: assem. line: mfg. date: purpose: package: requestor: tracking number: case: , style: test performed: test results: date: nl27wzu04dft2 n/a 0130 0537 419b ts teo zq013001a-c august 24, 2001 wafer line: fab site: assy. site: n/a n/a sbn site-1 autoclave temp cycle solder heat hts note: with pre- cond process environmental tests life tests reliability engineer r & qa manager reviewed by: approved by: abdul razak tk yew full reliability testing (without preconditioning) of sc88 package qualification meets or exceeds the the requirement set forth in the on semiconductor's production reliability qualification process process (12msb17722c). this qualification is to quality new product introduction of sc88 logic which transferred from hana to be assembled and tested in sbn. sbn on semiconductor r e l i a b i l i t y r e p o r t 48on04308d reference no. n/a
acceptance criteria parameter measurement conditions failure definition initial-endpoints delta limits min max max base environmental & life test vih vil voh vol vcc=2.3v to 5.5v vcc=2.3v to 5.5v voh=vin=vil, vcc=2.3 , ioh = 100ua voh=vin=vil, vcc=2.7, ioh = 100ua voh=vin=vil ,vcc=3.0, ioh = 100ua voh=vin=vil ,vcc=4.5, ioh = 100ua voh=vin=gnd ,vcc=2.3, ioh= - 8ma voh=vin=gnd, vcc=2.7, ioh= - 12ma voh=vin=gnd ,vcc=3.0, ioh=-16ma voh=vin=gnd, vcc=3.0, ioh= -24ma voh=vin=gnd, vcc=4.5, ioh= -32ma vol=vin=vih, vcc=2.3, iol= 100ua vol=vin=vih ,vcc=2.7, iol= 100ua vol=vin=vih, vcc=3.0 , iol= 100ua vol=vin=vih, vcc=4.5, iol= 100ua vol=vin=vcc , vcc=2.3, iol= 8ma vol=vin=vcc ,vcc=2.7, iol= 12ma vol=vin=vcc, vcc=3.0 , iol= 16ma vol=vin=vcc, vcc=3.0, iol=24ma 0.8vcc 2.1 2.4 2.7 4.0 1.9 2.2 2.4 2.3 3.8 0.2vcc 0.2 0.3 0.3 0.5 0.3 0.4 0.4 0.55 v v v v v v v v v v v v v v v v v v v - - - - - - - - - - - - - - - - - - - initial initial initial initial initial initial initial initial initial initial initial initial initial initial initial initial initial initial initial units nl27wzu04dft2 target device: 48a spec. no: issue _no 48aon04308d a
acceptance criteria parameter measurement conditions failure definition initial-endpoints delta limits min max max base environmental & life test vol iin icc vol=vin=vcc, vcc=4.5, iol = 32ma vin=vcc or gnd, vcc=5.5, vin=vcc or gnd ,vcc=5.5, 0.55 0.1 1 v ua ua - - - initial spec width spec width units nl27wzu04dft2 target device: 48a spec. no: issue _no a 48aon04308d
environmental test summary sample size rejects del. cat. test conditions tests 231 231 231 135 231 231 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 lim. autoclave temp cycle solder heat hts note: without precond process 507 501 504 ta=121c, p=15psig, rh=100% ta= -65/150c, air to air, dwell >10 min ta=260 c ta=150 c interval r e l i a b i l i t y r e p o r t 96hrs 500cyc 1000cyc 1x 500hrs 1000hrs nl27wzu04dft2
environmental: life test: reject summary page r e l i a b i l i t y r e p o r t * no reject found. full reliability testing (without preconditioning ) of sc88 package qualification meets or exceeds the requirement set forth in the on semiconductor?s product reliability qualification process (12msb17722c) conclusion:
quality and continuous improvement qualification of hana sc88 assembly and test process for nlast4599 new product design 02/16/01 date: mark wasilewski reliability manager 602-244-5114602-244-7519 lyle stewart/carolyn anitllon reliability engineer reliability customer report site qualification 1) introduction: 2) device description: note: the ?bold lettering? in the interval column of the test summary indicates the qualification points. the following standard logic devices are qualified by similarity based on the data in this report: nl27wz04dft2, nl27wz06dft2, nl27wz07dft2, nl27wz14dft2, nl27wz16dft2, nl27wzu04dft2 , nl as 45 99 d f t 2 related qualification report(s): n/ a pcn: nlast4599df device ast4599 line source c-mos parent tech 0.6 um cmos technology hana (b) assembly site chartered wafer fab site hana (b) final test site t.5 3rd. b bldg. reliability lab sc-88 package integrated polarity die size 451 um x 911 um 1113 um x 610 um flag size max. current max. voltage 20ma 7v qual id 0831 product reliability engineering services nlast4599df_0831_2001.pdf 1
quality and continuous improvement 3) qualification results analysis: zero qualification related failures were observed during reliabiltiy testing. 4) conclusion: by successfully completing all reliability testing under the terms of on semiconductor reliability document 12msb17722c, hana has been granted full qualification to assemble and test standard logic sc88 product. product reliability engineering services nlast4599df_0831_2001.pdf 2
quality and continuous improvement 5) test description & condition: autoclave autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing autoclave auto highly accelerated stress test hast uses a pressurized environment to produce extremely severe temperature, humidity and bias conditions. hast accelerates the same failure mechanisms as high humidity high temperature bias. test conditions: ta = 130c, rh = 85%, p = 18.8 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing highly accelerated stress test autoclave + moisture level preconditioning autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. typical test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing autoclave - pc auto-pc bond pull strength the purpose of this test is to determine bond pull strength of wire to die, substrate, or package header connections. the wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. test conditions: ta = 25c common failure modes: parametric shifts, open, and/or intermittent common failure mechanisms: corrosion or contaminants from foreign material within the package. silicon or metalization defects. bond pull strength bond pull bond shear the purpose of this test is to determine bond shear strength of wire to die, substrate, or package header connections. the wires may be bonded by soldering, thermocompression, ultrasonic, or related bonding techniques. test conditions: ta = 25c common failure modes: parametric shifts, open, and/or intermittent common failure mechanisms: corrosion or contaminants from foreign material within the package. silicon or metalization defects. bond shear bond shear hast highly accelerated stress test + moisture level preconditioning hast uses a pressurized environment to produce extremely severe temperature, humidity and bias conditions. hast accelerates the same failure mechanisms as high humidity high temperature bias. test conditions: ta = 130c, rh = 85%, p = 18.8 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing highly accelerated stress test - pc hast-pc product reliability engineering services nlast4599df_0831_2001.pdf 3
quality and continuous improvement high temperature bake high temperature storage life testing is performed to accelerate failure mechanisms which are thermally activated through the application of extreme temperatures. test conditions: ta = 150c common failure modes: parametric shifts in leakage and gain common failure mechanisms: bulk die and diffusion defects high temperature bake ht bake high temperature bake high temperature storage life testing is performed to accelerate failure mechanisms which are thermally activated through the application of extreme temperatures. test conditions: ta = 175c common failure modes: parametric shifts in leakage and gain common failure mechanisms: bulk die and diffusion defects high temperature bake htb high temperature operating lif e the purpose of this test is to evaluate the bulk stability of the die and to generate defects resulting from manufacturing aberrations that are manifested as time and stress-dependent failures. test conditions: ta = 145c common failure modes: parametric shifts and catastrophic common failure mechanisms: foreign material, crack die, bulk die, metallization, wire and die bond defects high temperature operating life htol moisture level preconditioning these tests are performed to simulate the board mounting process where parts are subjected to a high temperature for a short duration. these tests detect mold compound delamination from the die and leadframe. the failure mechanisms are corrosion, fractured wirebonds and passivation cracks. 10tc + 24hr bake@125c + 168hr 85/85 + 3 ir@235c + 1x flux immersion + di rinse moisture level 1 msl 1 physical dimensions phys dim solderability the purpose of this test is to measure the ability of device leads/terminals to be soldered after an extended period of storage or shelf life. test conditions: steam aging = 8 hours common failure modes: pin holes, dewetting, non-wetting common failure mechanisms: poor plating, contaminated leads solderability solder 5) test description & condition continued: product reliability engineering services nlast4599df_0831_2001.pdf 4
quality and continuous improvement temperature cycling the purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. this testing will also expose excessive thermal mismatch between materials. test conditions: ta = -65c to 150c, air to air common failure modes: parametric shifts and catastrophic common failure mechanisms: wire bond, cracked or lifted die and package failure temperature cycle tc temperature cycling + moisture level preconditioning the purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. this testing will also expose excessive thermal mismatch between materials. test conditions: ta = -65c to 150c, air to air common failure modes: parametric shifts and catastrophic common failure mechanisms: wire bond, cracked or lifted die and package failure temperature cycle - pc tc-pc 5) test description & condition continued: product reliability engineering services nlast4599df_0831_2001.pdf 5
lot id rej test name ss test conditions & bias interval comment test summary ht bake 0831a 084 ta = +150c, n/a 0 hr. 084168 hr. 084 504 hr. ht bake 0831b 084 ta = +150c, use high temp solder per best lab practice 0 hr. 084168 hr. 084 504 hr. ht bake 0831c 084 ta = +150c, use high temp solder per best lab practice 0 hr. 084168 hr. 084 504 hr. htol 0831a 084 ta = +145c, vcc = 5.0v 0 hr. 084 504 hr. 0831b 0840 hr. 084 504 hr. 0831c 0840 hr. 084504 hr. hast 0831a 084 ta = +130c, rh = 85%, psig = 18.8, vcc = 5.0v 0 hr. 084 96 hr. product reliability engineering services nlast4599_0831_2001.pdf 1 appendix a
lot id rej test name ss test conditions & bias interval comment test summary hast 0831b 0 84 ta = +130c, rh = 85%, psig = 18.8, n/a 0 hr. 0 84 96 hr. 0831c 0 84 0 hr. 0 84 96 hr. hast-pc 0831a 0 84 ta = +130c, rh = 85%, psig = 18.8, vcc = 5.0v 0 hr. 0 73 96 hr. 0831b 0 84 0 hr. 0 84 96 hr. 0831c 0 84 0 hr. 0 84 96 hr. msl 1 0831a 0 252 10tc + 24hr bake@125c + 168hr 85/85 + 3 ir@235c + 1x flux immersion + di rinse + visual, n/a 0 hr. 0 252 readout 0 252 readout 0831b 0 252 0 hr. 0 252 readout 0 252 readout 0831c 0 252 0 hr. product reliability engineering services nlast4599_0831_2001.pdf 2 appendix a
lot id rej test name ss test conditions & bias interval comment test summary 0 252 readout 0 252 readout phys dim 0831a 0 10 case outline, n/a results solder 0831a 0 10 8 hours steam aging prior to testing; 1 hour gold plated leads, n/a results tc 0831a 0 84 air to air; -65c to +150c, n/a 0 cyc. 0 75 500 cyc. 0831b 0 84 0 cyc. 0 84 500 cyc. 0831c 0 84 0 cyc. 0 84 500 cyc. tc-pc 0831a 0 84 air to air; -65c to +150c, n/a 0 cyc. 0 74 500 cyc. 0831b 0 84 0 cyc. 0 84 500 cyc. 0831c 0 84 0 cyc. 0 84 500 cyc . product reliability engineering services nlast4599_0831_2001.pdf 3 appendix a
quality and continuous improvement qualification of pb-free solder for the sc88 and sc88a packages with 100% sn plating. solder used was sn/ag/cu. the data for this report was used to qualify the sc88 because the metal to pkg ratio is at it worst case in the sc88a. therefore the delamination, etc will be less in the sc88. this also qualifies the sc70 packages. this is for all technologies . 10/08/2001 date: mark wasilewski reliability manager 602-244-5114 laura rivers reliability engineer reliability customer report package qualification 1) introduction: 2) device description: packages qualified for pb-free based upon this report are; sc70, sc88, sc88a for all technologies. related qualification report(s): pcn: msqa6v1w5t2 device zk6v1qa line source zener parent tech zener technology sbn assembly site seremban malaysia wafer fab site sbn seremban malaysia final test site fet tester reliability lab phoenix, az, usa sc-88a package pn polarity die size 27 x 26 flag size max. current max. voltage qual id 1008 product reliability engineering services msqa6v1w5t2_1008_2001.pdf 1
quality and continuous improvement 3) qualification results analysis: no anomalies observed. 4) conclusion: all testing was successfully performed in accordance with on semiconductor qualification specification 12msb17722c and a 260 c msl 1 preconditioning profile for pb-free products. sc70, sc88 and sc88a are now considered fully qualified for pb-free processing per the qualification process shown in this report. product reliability engineering services msqa6v1w5t2_1008_2001.pdf 2
quality and continuous improvement 5) test description & condition: moisture level preconditioning these tests are performed to simulate the board mounting process where parts are subjected to a high temperature for a short duration. these tests detect mold compound delamination from the die and leadframe. the failure mechanisms are corrosion, fractured wirebonds and passivation cracks. 10tc + 24hr bake@125c + 168hr 85/85 + 3 ir@260c + 1x flux immersion + di rinse moisture level 1 msl 1 solderability the purpose of this test is to measure the ability of device leads/terminals to be soldered after an extended period of storage or shelf life. test conditions: steam aging = 8 hours common failure modes: pin holes, dewetting, non-wetting common failure mechanisms: poor plating, contaminated leads scanning acoustic tomography (sat) - pc autoclave + moisture level preconditioning autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. typical test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing autoclave - pc auto-pc temperature cycling + moisture level preconditioning the purpose of this test is to evaluate the ability of the device to withstand both exposure to extreme temperatures and transitions between temperature extremes. this testing will also expose excessive thermal mismatch between materials. test conditions: ta = -65c to 150c, air to air common failure modes: parametric shifts and catastrophic common failure mechanisms: wire bond, cracked or lifted die and package failure temperature cycle - pc tc-pc solderability the purpose of this test is to measure the ability of device leads/terminals to be soldered after an extended period of storage or shelf life. test conditions: steam aging = 8 hours common failure modes: pin holes, dewetting, non-wetting common failure mechanisms: poor plating, contaminated leads solderability solder sat-pc autoclave + moisture level preconditioning autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. typical test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing scanning acoustic tomography (sat) - pc sat-pc product reliability engineering services msqa6v1w5t2_1008_2001.pdf 3
quality and continuous improvement autoclave + moisture level preconditioning autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. typical test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing scanning acoustic tomography (sat) - pc sat-pc autoclave + moisture level preconditioning autoclave is an environmental test which measures device resistance to moisture penetration and the resultant effects of galvanic corrosion. autoclave is a highly accelerated and destructive test. typical test conditions: ta = 121c, rh = 100%, p = 15 psig common failure modes: parametric shifts, high leakage and/or catastrophic common failure mechanisms: die corrosion or contaminants such as foreign material on or within the package materials. poor package sealing scanning acoustic tomography (sat) - pc sat-pc 5) test description & condition continued: product reliability engineering services msqa6v1w5t2_1008_2001.pdf 4
lot id rej test name ss test conditions & bias interval comment test summary msl1 1008a,b,c 0 all 10tc + 24hr bake@125c + 168hr 85/85 + 3 ir@260c + 1x flux immersion + di rinse - amount for pre conditioned tests. results auto-pc 1008a,b,c 0 240 ta = +121c, rh = 100%, psig = 15, n/a 0 hr. 0 240 96 hr. sat 1008a,b,c 0 21 sat shall be performed on 7 units from each group at zero hours processing results sat 1008a,b,c 0 21 sat shall be performed on 7 units from each group after 3x ir reflow results sat 1008a,b,c 0 21 sat shall be performed on 7 units fromeach group after 500 cycles temp cycle results sat 1008a,b,c 0 21 sat shall be performed on 7 units from each group after 1000 cycles temp cycle results solder 1008a,b,c 0 30 8 hours steam aging prior to testing; solderability shall be tested at 260 c using sn/ag/cu solder results tc-pc 1008a,b,c 0 324 air to air; -65c to +150c, n/a (ss includes samples for sat) 0 cyc. 0 324 500 cyc. 0 324 1000 cyc. solder heat 1008a,b,c 0 90 all groups, a,b,c shall be tested at 260 c. results product reliability engineering services msqa6v1w5t2_1008_2001.pdf 1 appendix a

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