gp2l09/gp2l24/gp2l26 subminiature, high sensitivity photointerrupter n outline dimensions ( unit : mm ) n features n applications 1. compact and thin gp2l09 : compact dip, long lead type 2. optimum detection distance: 0.6 to 0.8mm 3. high sensitivity ( i c : min. 0.5ma at i f = 4ma ) 4. visible light cut-off type gp2l24 : compact dip type gp2l26 : flat lead type 1. cassette tape recorders, vcrs 2. floppy disk drives 3. various microcomputerized control equip- ment c0.7 gp2l09 0.2 15 ? 1 1.75 2 0.8 q 43 15 ? 0.75 c0.7 1 1.7 1.75 2 4 gp2l24 3 q 0.2 0.75 c0.7 gp2l26 1.7 30 ? 20 ? 1 2 43 1 4 2 3 1.0 0.15 ( 0.2 ) emitter center ( 4.0 ) * ( ) : reference dimensions * the dimensions indicated by h refer to those measured from the lead base. * ( ) : reference dimensions * the dimensions indicated by h refer to those measured from the lead base. ( 0.2 ) emitter center ( 4.0 ) 1 anode 2 emitter 3 collector 4 cathode internal connection diagram ( common to 3 models ) ( 0.2 ) emitter center * ( ) : reference dimensions 1.75 4 - ( 0.6 ) gp2l09/gp2l24 gp2l26 ( 0.4 ) detector center * tolerance : 0.15mm ( 0.4 ) detector center * tolerance : 0.15mm ( 0.4 ) detector center * tolerance : 0.15mm data books, etc. contact sharp in order to obtain the latest version of the device specification sheets before using any sharp 's device. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that occur in equi pment using any of sharp's devices, shown in catalogs, q : 0 to 20 ? q: 0 to 20 ? h 4.0 0.2 1.7 0.15 12.5 1.0 h 4.0 0.2 4 - 0.5 + 0.2 - 0.1 4.0 + 0.2 - 0.1 3.0 + 0.2 - 0.1 4 - 0.2 + 0.3 - 0 4 - 0.4 + 0.2 - 0.1 4 - 0.15 + 0.2 - 0.1 4.0 + 0.2 - 0.1 3.0 + 0.2 - 0.1 3.5 + 1.0 - 0 4.0 + 0.2 - 0.1 0.4 + 0.2 - 0.1 0.15 + 0.2 - 0.1 3.0 + 0.2 - 0.1 13.0 1.0
gp2l09/gp2l24/gp2l26 n absolute maximum ratings ( ta = 25?c ) ( ta = 25?c ) parameter symbol rating unit input forward current i f 50 ma reverse voltage v r 6v p75 output collector-emitter voltage v ceo 35 v emitter-collector voltage v eco 6v collector current i c 50 ma 75 mw total power dissipation p tot 100 mw operating temperature opr - 25 to + 85 ?c storage temperature t stg - 40 to + 100 ?c t sol 260 ?c * 1 soldering temperature * 3 the condition and arrangement of the reflective object are shown in the right drawing. * 4 without reflective object the ranking of collector current shall be power dissipation p c mw n electro-optical characteristics parameter symbol conditions min. typ. max. unit input forward voltage i f i f = 20ma - 1.2 1.4 v reverse current i r v r =6v - - 10 m a output collector dark current i ceo - - 1x 10 -6 a transfer- charac- teristics * 3 collector current i c v ce = 2v, i f = 4ma 0.5 3.0 15.0 ma response time rise time t r - 80 400 fall time t f - 70 400 * 4 leak current i leak i f = 4ma, v ce = 5v - - 5.0 v ce = 2v, i c = 10ma r l m s m s m a gp2l09 , gp2l24 2.0mm 2.0mm soldering area the hatched area more than 1mm * 2 away from the lower edge of package as shown in the drawing below. classified into the following 6 ranks. 1mm * 2 1mm-thick glass * 2 gp2l09 : 4mm gp2l26 soldering area the hatched area more than 2.0mm away from the both edge of package as shown in the drawing below. * 5 gp2l24 and gp2l26 don't ( gp2l09 , gp2l24 , gp2l26 ) rank collector current i c ( ma ) * 5 a 0.5 to 1.9 b 1.45 to 5.4 c 4.0 to 15.0 a or b 0.5 to 5.4 b or c 1.45 to 15.0 a, b or c 0.5 to 15.0 * 1 within 5 seconds ( soldering areas for each model are shown below. ) v ce t collector power dissipation = 10v, i f =0 = 100 w , d = 1mm test condition for collector current al evaporation have a rank.
gp2l09/gp2l24/gp2l26 - 25 0 25 50 75 85 100 0 10 20 30 40 50 60 525 25 duty ratio pulse width <=100 m s 2 0 0.5 1.0 1.5 2.0 2.5 3.0 1 2 5 10 20 50 100 200 500 25?c 0?c - 25?c 50?c 025 -25 0 20 40 60 120 power dissipation p ( mw ) 50 100 75 80 100 85 75 2.5 5.0 7.5 10.0 12.5 0 0 5 10 15 20 25 15.0 246810 0 0 2 4 6 8 10 12 14 16 12 4ma 2ma 7ma 10ma fig. 6 collector current vs. collector-emitter voltage fig. 1 forward current vs. ambient temperature forward current i f ( ma ) ambient temperature t a ( ?c ) ambient temperature t a ( ?c ) peak forward current i fm ( ma ) forward voltage v f ( v ) forward current i f ( ma ) t a = 25?c p tot p, p c t a = 75?c v ce =2v t a = 25?c collector current i c ( ma ) forward current i f ( ma ) collector-emitter voltage v ce ( v ) collector current i c ( ma ) i f = 15ma p c ( max. ) t a = 25?c fig. 2 power dissipation vs. ambient temperature fig. 3 peak forward current vs. duty ratio fig. 4 forward current vs. forward voltage fig. 5 collector current vs. forward current 10 -3 10 -2 10 -1 2000 1000 500 200 100 50 20 1
gp2l09/gp2l24/gp2l26 025 -25 0 25 50 75 150 50 100 75 100 125 -25 0 10 -11 25 100 50 75 5 10 -10 5 10 -9 5 10 -8 5 10 -7 5 10 -6 5 10 -5 5 10 -4 10 20 50 100 200 500 1000 1 10 100 1000 1000 output output input 012 45 40 60 20 0 3 relative collector current ( % ) ambient temperature t a ( ?c ) fig. 8 collector dark current vs. ambient temperature v ce = 10v collector dark current i ceo ( a ) ambient temperature t a ( ?c ) i f = 4ma v ce =5v v ce =2v t a = 25?c t d t s v ce =2v i c = 10ma t a = 25?c t r t f t d t s response time ( m s ) relative collector current ( % ) d ( mm ) v cc input r d r l t d t r t s t f 90 % 10 % response time ( m s ) distance between sensor and al evaporation glass i f = 4ma v ce =2v t a = 25?c i c = 10ma 1000 500 200 100 50 20 10 5 2 1 1000 500 200 100 50 20 10 5 2 1 0.5 0.2 0.1 fig. 7 relative collector current vs. ambient temperature t r t f fig. 9-a response time vs. test circuit for response time fig.10 relative collector current vs. 80 100 distance between sensor and al evaporation glass fig. 9-b response time vs. ( gp2l09 )( gp2l24/gp2l26 ) load resistance load resistance r l ( w ) load resistance r l ( w ) load resistance
gp2l09/gp2l24/gp2l26 024 40 60 20 0 6 d= 1mm -1 1 3 5 10 w frequency f ( hz ) 0 -5 -10 -15 -20 2 5 2 5 2 5 600 700 800 900 1000 1200 80 100 40 60 20 0 1100 correspond to fig.10 al evaporation d correspond to fig.11 oms card l = 0 d + white lmm test condition d = 1mm - - d = 1mm test condition lmm white + d l = 0 oms card correspond to fig.12 black black -20 -15 -10 -5 0 frequency f ( khz ) 100 w 7 5 3 1 -1 d= 1mm 6 0 20 60 40 100 80 4 2 0 -2 gp2l24 2 100 w 5 10 w i f = 4ma v ce =2v t a = 25?c relative collector current ( % ) card moving distance l ( mm ) card moving distance ( 1 ) card moving distance ( 2 ) i f = 4ma v ce =2v t a = 25?c relative collector current ( % ) card moving distance l ( mm ) ( ex.: gp2l24 ) i f v ce = 2v i f = 4ma v ce = 2v gp2l09 ) r l =1k w / ) i f = 10ma v ce =2v t a = 25?c r l =1k w relative sensitivity ( % ) wavelength l ( nm ) position characteristics 10 2 10 3 10 4 10 5 v ce =2v i c = 10ma t a = 25?c t a = 25?c 80 100 fig.12 relative collector current vs. fig.13 frequency response ( = 4ma test condition for distance & detecting fig.14 frequency response ( gp2l24 gp2l26 fig.15 spectral sensitivity ( detecting side ) fig.11 relative collector current vs. 10 2 10 3 10 4 10 5 10 6 voltage gain av ( db ) voltage gain av ( db )
gp2l09/gp2l24/gp2l26 n precautions for use ethyl alcohol, methyl alcohol, isopropyl alcohol, freon te, freon tf, diflon solvent s3-e when the cleaning solvents except for specified materials are used, please consult us. ( 3 ) remove dust or stains, using an air blower or a soft cloth moistened in cleaning solvent. however, do not perform the above cleaning using a soft cloth with cleaning solvent in the marking portion. in this case, use only the following type of cleaning solvent used for wiping off: ( 1 ) in order to stabilize power supply line, connect a by-pass capacitor of more than 0.01 m f bet- ween vcc and gnd near the device. ( 2 ) in this product, the pwb is fixed with a resin cover, and cleaning solvent may remain inside the case; therefore, dip cleaning or ultrasonic cleaning are prohibited. ( 4 ) as for other general cautions, refer to the chapter precautions for use .
115 application circuits notice l the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. l contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. l observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii)measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii)sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). l contact a sharp representative in advance when intending to use sharp devices for any "specific" applications other than those recommended by sharp or when it is unclear which category mentioned above controls the intended use. l if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade control law of japan, it is necessary to obtain approval to export such sharp devices. l this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. l contact and consult with a sharp representative if there are any questions about the contents of this publication.
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