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? 2003 microchip technology inc. ds80023c-page 1 pic12c508/509 the pic12c5xx parts conform functionally to the pic12c5xx data sheet (ds40139 e ), except for the anomalies described below: none clarifications/corrections to the data sheet: in the device data sheet (ds40139e), the following clarifications and corrections should be noted. section 11: corrections for the dc characteristics, section 11.2 are shown. corrections for the gpio pull-up resistor ranges are shown in table 11-1. for the section titled ?reset?, additional information is provided on osc1/clkin and osc2/clkout pin states during a mclr . pic12c508/509 data sheet errata
pic12c508/509 ds80023c-page 2 ? 2003 microchip technology inc. 11.2 dc characteristics: pic12c508/509 (commercial, industrial, extended) dc characteristics standard operating conditions (unless otherwise specified) operating temperature 0c t a +70c (commercial) -40c t a +85c (industrial) -40c t a +125c (extended) operating voltage v dd range as described in dc spec section 11.1 and section 11.2. param no. characteristic sym min typ? max units conditions input high voltage i/o ports v ih ? d040 with ttl buffer 2.0v ? v dd v4.5 v dd 5.5v d040a 0.25v dd + 0.8v ?v dd v otherwise d070 gpio weak pull-up current (7) i pur 50 250 400 av dd = 5v, v pin = v ss input leakage current (2), (3) for v dd 5.5v i il d061 gp3/mclr (5) 8 130 250 a vss v pin v dd d061a gp3/mclr (6) ??+ 5 a vss v pin v dd ? data in ?typ? column is at 5v, 25 c unless otherwise stated. these parameters are for design guidance only and are not tested. note 1: in extrc oscillator configuration, the osc1/clkin pin is a schmitt trigger input. it is not recommended that the pic12c5xx be driven with external clock in rc mode. 2: the leakage current on the mclr pin is strongly dependent on the applied voltage level. the specified levels represent normal operating conditions. higher leakage current may be measured at different input voltages. 3: negative current is defined as coming out of the pin. 4: extended operating range is advanced information for this device. 5: this specification applies to gp3/mclr configured as external mclr and gp3/mclr configured as input with internal pull-up enabled. 6: this specification applies when gp3/mclr is configured as an input with pull-up disabled. the leakage current of the mclr circuit is higher than the standard i/o logic. 7: does not include gp3. for gp3 see parameters d0061 and d0061a.
? 2003 microchip technology inc. ds80023c-page 3 pic12c508/509 table 11-1: pull-up resistor ranges - pic12c508/c509 1. module: reset when mclr is asserted, the state of the osc1/clkin and clkout/osc2 pins are as follows: clkin/clkout pin states when mclr asserted v dd (volts) temperature ( c) min typ max units gp0/gp1 2.5 -40 38k 42k 63k ? 25 42k 48k 63k ? 85 42k 49k 63k ? 125 50k 55k 63k ? 5.5 -40 15k 17k 20k ? 25 18k 20k 23k ? 85 19k 22k 25k ? 125 22k 24k 28k ? gp3 (1) 2.5 -40 65k 80k 850k ? 25 80k 100k 1150k ? 85 85k 110k 1300k ? 125 100k 120k 1500k ? 5.5 -40 50k 60k 600k ? 25 60k 65k 750k ? 85 65k 80k 900k ? 125 75k 90k 990k ? * these parameters are characterized but not tested. note 1: the weak pull-up resistor and associated current for the gp3/mclr pin is non-linear when the respective pin voltage is less than v dd - 1.0v. see parameter d061 for gp3/mclr pin current specifications. oscillator mode osc1/clkin pin osc2/clkout pin extrc, clkout on osc2 osc1 pin is tristated and driven by external circuit osc2 pin is driven low extrc, osc2 is i/o osc1 pin is tristated and driven by external circuit osc2 pin is tristate input intrc, clkout on osc2 osc1 pin is tristate input osc2 pin is driven low intrc, osc2 is i/o osc1 pin is tristate input osc2 pin is tristate input
pic12c508/509 ds80023c-page 4 ? 2003 microchip technology inc. 2. module: packaging the package information contained in the data sheet is incorrect. please refer to the following tables for correct package data. 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 5 10 15 5 10 15 mold draft angle bottom 5 10 15 5 10 15 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
? 2003 microchip technology inc. ds80023c-page 5 pic12c508/509 8-lead plastic small outline (sm) ? medium, 208 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.43 0.36 .020 .017 .014 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.64 0.51 .030 .025 .020 l foot length 5.33 5.21 5.13 .210 .205 .202 d overall length 5.38 5.28 5.11 .212 .208 .201 e1 molded package width 8.26 7.95 7.62 .325 .313 .300 e overall width 0.25 0.13 0.05 .010 .005 .002 a1 standoff 1.98 .078 a2 molded package thickness 2.03 .080 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units a2 a a1 l c 2 1 d n p b e e1 .070 .075 .069 .074 1.78 1.75 1.97 1.88 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. drawing no. c04-056 significant characteristic
pic12c508/509 ds80023c-page 6 ? 2003 microchip technology inc. 8-lead ceramic side brazed dual in-line with window (jw) ? 300 mil 7.11 6.86 6.60 .280 .270 .260 u lid width 11.68 11.43 11.18 .460 .450 .440 t lid length 4.34 4.22 4.09 .171 .166 .161 w window diameter 8.23 7.87 7.52 .324 .310 .296 eb overall row spacing 0.51 0.46 0.41 .020 .018 .016 b lower lead width 1.52 1.40 1.27 .060 .055 .050 b1 upper lead width 0.30 0.25 0.20 .012 .010 .008 c lead thickness 3.81 3.56 3.30 .150 .140 .130 l tip to seating plane 13.46 13.21 12.95 .530 .520 .510 d overall length 7.62 7.37 7.11 .300 .290 .280 e1 package width 1.14 0.89 0.64 .045 .035 .025 a1 standoff 3.63 3.12 2.62 .143 .123 .103 a2 top of body to seating plane 4.70 4.19 3.68 .185 .165 .145 a top to seating plane 2.54 .100 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n t e1 u w c eb l a2 b b1 a a1 p * controlling parameter significant characteristic jedc equivalent: ms-015 drawing no. c04-083
? 2003 microchip technology inc. ds80023c-page 7 pic12c508/509 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
pic12c508/509 ds80023c-page 8 ? 2003 microchip technology inc. 8-lead plastic dual flat no lead package (mf) 6x5 mm body (dfn-s) nom .050 bsc inches .194 bsc .184 bsc .226 bsc .236 bsc .008 ref. d overall width jedec equivalent: pending notes: drawing no. c04-113 molded package width lead width *controlling parameter mold draft angle top tie bar width lead length r b l d1 .014 .020 dimension limits molded package thickness pitch overall height overall length molded package length base thickness standoff number of pins a3 e1 e a2 a1 a .000 units n p min top view 12 a2 a 5.99 bsc .019 12 .030 .014 .016 .024 0.35 0.50 .356 0.40 0.60 5.74 bsc 12 0.47 0.75 millimeters* .039 .002 .031 .026 .0004 .033 0.00 8 max min 1.27 bsc 0.20 ref. 4.92 bsc 4.67 bsc 0.85 0.01 0.65 0.80 0.05 1.00 max nom 8 bottom view n e e1 pin 1 p b exposed pad length e2 exposed pad width d2 .085 .091 .097 2.16 2.31 2.46 .152 .158 .163 3.85 4.00 4.15 exposed metal pads d2 e2 a1 a3 l id d1 d r dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per si de.
? 2003 microchip technology inc. ds80023c-page 9 pic12c508/509 appendix a: revision history rev. c document (3/2003) under clarifications/corrections to the data sheet, item 2, packaging: correct package data was added. added appendix a: revision history.
pic12c508/509 ds80023c-page 10 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds80023c - page 11 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, k ee l oq , mplab, pic, picmicro, picstart, pro mate and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, micro id , mxdev, mxlab, picmaster, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. accuron, dspic, dspicdem, dspicdem.net, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, picc, pickit, picdem, picdem.net, powercal, powerinfo, powertool, rflab, rfpic, select mode, smartsensor, smartshunt, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2003, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified. note the following details of the code protection feature on microchip devices: microchip products meet the specification contained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchip's data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act.
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