features and specifications 0.75mm (.030) pitch amc.0 b+ 170-circuit connectors 75800 standard 75908 pegless 75791 extended height specifications features and benefts amc.0 b+ connectors from molex support the next generation of mezzanine card standards and 12.5 gbps speeds the 170-circuit amc.0 b+, or advancedmc tm connectors from molex support the next generation of mezzanine card standards that allow for hot-plugging of high-speed serial interconnects. these connectors support advancedtca (advanced telecommunications computing architecture), a standard developed by picmg (pci industrial computer manufacturers group). molex amc.0 b+ connectors feature controlled impedance and reduced crosstalk, plus a footprint launch optimized for high-speed data rates. this design enables the connector to achieve 12.5 gbps nrz (non return to zero) signal transmission. this enhanced footprint further reduces crosstalk by managing inter-pair affnity and incorporating additional ground vias for isolation. as a result, the amc.0 b+ connectors achieve crosstalk of less than 3 percent at 12.5 gbps. three versions of the molex amc.0 b+ connector exist: the standard connector with locating pegs (series 75800), connector without pegs (series 75908) and the 1.15mm (.045) extended-height connector (series 75791). this taller height is optimized for blade-server applications where cooling is critical. reference information packaging: tray ul file no.: e29179 csa file no.: lr19980 mates with: amc module designed in: millimeters electrical voltage: 250v ac current: 1.5a power terminal 1.0a other terminals contact resistance: 60 milliohms max. dielectric withstanding voltage: 80v rms insulation resistance: 500v dc mechanical insertion force to pcb: 6050n (1360 lbf) max. mating force: 100n (22 lbf) max. unmating force: 65n (14 lbf) max. durability: 200 cycles physical housing: black thermoplastic contact: copper (cu) alloy plating: contact area 0.76m gold (au) solder tail area tin or tin-lead (sn or sn/pb) underplating nickel (ni) pcb thickness: 2.36mm (.092) operating temperature: -40 to +105oc series 75800 standard amc.0 b+ connector n insert-molded wafer design provides excellent electrical performance n press-ft contacts and high-speed footprint for simpler application to pcb and superior signal integrity than competition n tin or tin-lead tail plating supports rohs requirements and customer preferences for press-ft n meets picmg advanced mc tm specifcation and industry standard requirements
visit our website at www.molex.com order no. 987650-0651 printed in usa/ji/2007.01 ?2007, molex 0.75mm (.030) pitch amc.0 b+ 170-circuit connectors 75800 standard 75908 pegless 75791 extended height ordering information americas headquarters lisle, illinois 60532 u.s.a. 1-800-78molex amerinfo@molex.com asia pacifc north headquarters yamato, kanagawa, japan 81-462-65-2324 feninfo@molex.com asia pacifc south headquarters jurong, singapore 65-6268-6868 fesinfo@molex.com european headquarters munich, germany 49-89-413092-0 eurinfo@molex.com corporate headquarters 2222 wellington ct. lisle, il 60532 u.s.a. 630-969-4550 fax:630-969-1352 appl ications n telecommunications equipment n for use in the ieee 1386 market as it transitions to serial buses n general blade computing applications n extended-height version used in non-atca applications n any hot-pluggable high-speed serial bus application atca rack atca carrier order no. comment tail plating height pcb peg 75800-0001 with alignment pegs tin plated 21.85mm (.860) yes 75800-0002 with alignment pegs tin/lead plated 21.85mm (.860) yes 75908-0001 without alignment pegs tin plated 21.85mm (.860) no 75908-0002 without alignment pegs tin/lead plated 21.85mm (.860) no 75791-0001 extended height tin plated 23.0mm (.905) yes 75791-0002 extended height tin/lead plated 23.0mm (.905) yes
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