specifications are subject to alteration without prior notice ? dimensions in millimeter test & burn-in dual inline memory module (dimm, 184 pins) ic589 series housing: contacts: plating: polyetherimide (pei), glass-filled beryllium copper (becu) gold over nickel card thickness 1.27mm for 184 contact pins with 1.27mm pitch materials and finish features series no. mf = flanged unmarked = not flanged ic-589 1mf -- insulation resistance: dielectric withstanding voltage: contact resistance: operating temperature range: mating cycles: pin count: 1,000m min. at 500v dc 700v ac for 1 minute 30m max. at 10ma/20mv max. ?55c to +170c 10,000 insertions minimum 184 contact pins w w 30.48 19.80 17.80 10.00 4.00 2.500.2 120.65 1.27 3.00 1.80 4.00 6.35 ? 3.20 184- 0.80 ? 133.35 120.65 0.1 162.70 0.1 8.280.05 5.080.05 1.27 0.05 thru hole thru hole 1.270.05 6.35 + 0.1 0 + 0.1 0 13.00 17.00 design no. 162.70 0.2 171.70 0.4 153.70 0.4 129.50 120.65 0.2 1.27 0.15 6.35 ref. 1.27 0.15 + 0.2 0 1.27x51=64.77 0.2 1.27x51=64.77 0.1 1.27x39=49.53 0.2 1.27x39=49.53 0.1 ? 3.20 thru hole 15.48 0.1 3.70 0.5 w0.40 x t0.30 34.10 ref 6.00 2.300.1 4.00 11.00 153.70 ref 128.00 ref 1.27x51=64.77 0.1 1.27x39=49.53 0.1 specifications outline socket dimensions recommended pc board layout top view from socket matching module dimensions part number (details) b-6
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