doc. no : qw0905-l rev : d date : 21 - dec.- 2007 sefg9553/tr1 surface mount led tape and reel data sheet lsefg9553/tr1 ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
carrier type dimensions 12.0 lsefg9553/tr1 part no. 2.2 2.6 1/8 page
74.0 1.5 ! 178 2.0 12.0mm tape,7"reel description lsefg9553/tr1 part no. 1500 devices quantity/reel reel dimensions 14.2 1.0 16.0 1.0 part no. lsefg9553/tr1 ligitek electronics co.,ltd. property of ligitek only 2/8 page
algainp material note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 " ) part no gap lsefg9553/tr1 20 color spectral halfwidth #$ nm dominant wave length $ dnm luminous intensity @20ma(mcd) forward voltage @ ma(v) viewing angle 2 % 1/2 (deg) 1.72.6 green 32120 12.5 ---- 30 water clear orange 605 emittedlens 17 1.72.6 500 200120 max. min. typ. min. parameter reverse current @5v storage temperature operating temperature peak forward current duty 1/10@10khz forward current power dissipation t opr tstg ir " -40 ~ +85 -40 ~ +100 " 10 & a 90 i fp pd120 i f 50 ma 120 100 mw 30 ma symbol sefg unit ratings absolute maximum ratings at ta=25 " part no. : ligitek electronics co.,ltd. property of ligitek only 3/8 page lsefg9553/tr1 electrostatic discharge esd 2000 v ---- peak wave length $ pnm ---- 565
r e l a t i v e i n t e n s i t y @ 2 0 m a 550 0.0 0.5 wavelength (nm) 600650 500 ambient temperature( " ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 " 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 " -20 ambient temperature( " ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 sef chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 1.52.02.53.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only page 4/8 part no. lsefg9553/tr1 fig.6 directivity radiation 30 ' 0 ' -30 ' 100% 50% 25%75% 25%0 75%50% 60 ' 100% -60 '
r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500550 0.0 0.5 600650 ambient temperature( " ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 " 1.0 0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 " 0 ambient temperature( " ) 100 80 60 40 20-40-20 0.0 100 6080 2040 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 5/8 page fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 2.0 1.0 10 1000 g chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 10 forward current(ma) 4.0 3.05.0 0.0 1.0 1.5 0.5 1.0 2.5 2.0 1000 100 fig.2 relative intensity vs. forward current 3.5 3.0 ligitek electronics co.,ltd. property of ligitek only part no. lsefg9553/tr1 fig.6 directivity radiation 30 ' 0 ' -30 ' 100% 50% 25%75% 25%0 75%50% 60 ' 100% -60 '
soldering heat max. 260 " 120 ~ 150 " note:1.wave solder and reflow soldering should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 6/8 recommended soldering conditions ligitek electronics co.,ltd. property of ligitek only 245 5 " within 5 sec preheat 2. wave solder 240 3-1. lead reflow solder temp. ( " ) 1. hand solder basic spec is ( 280 " 3 sec one time only. time 260 ! c max. 10sec.max above 220 ! c 60 sec.max. 150 120 preheat 1~5 ! c/sec preheat 180~200 ! c 3-2 pb-free reflow solder 1~5 ! c/sec 120 sec.max. rising +5 " /sec cooling -5 " /sec part no. 60 ~ 120 sec 5sec 120 ~ 180 sec lsefg9553/tr1
drive method: led is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. circuit model a led circuit model b led precautions for use: storage time: 1.the operation of temperatures and rh are : 5 " ~35 " ,rh<60%. 2.once the package is opened, the products should be used within a week. otherwise, they should be kept in a damp proof box with descanting agent. considering the tape life, we suggest our customers to use our products within a year(from production date). 3.if opened more than one week in an atmosphere 5 " ~ 35 " ,rh<60%, they should be treated at 60 " 5 " fo r 15hrs. page 7/8 ligitek electronics co.,ltd. property of ligitek only part no. lsefg9553/tr1
ramp-up rate(183 " to peak) +3 " second max temp. maintain at 125( 25) " 120 seconds max temp. maintain above 183 " 60-150 seconds peak temperature range 235 " +5-0 " time within 5 " of actual peak temperature(tp) 10-30 seconds ramp-down rate +6 " /second max solderability test mil-std-750d:2031.2 j-std-020 1.t.sol=260 " 5 " 2.dwell time= 10 1sec. environmental test temperature cycling 1.105 " ~ 25 " ~ 55 " ~ 25 " 30mins 5mins 30mins 5mins 2.10 cyeles solderability test 1.t.sol=235 " 5 " 2.immersion time 2 0.5sec 3.immersion rate 25 2.5mm/sec 4.immersion rate 25 2.5mm/sec 5.coverage ) 95% of the dipped surface 1.ir-reflow in-board,2 times 2.ta=105 " 5 " & -40 " 5 " (10min) (10min) 3.total 10 cycles solder resistance test thermal shock test high temperature high humidity storage test 1.ir-reflow in-board, 2 times 2.ta=65
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