white electronic designs corporation ? (602) 437-1520 www.whiteedc.com
february 2002 rev. 1
25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm package material and assembly process ball pads diameter and ball attach process substrate dimensions, materal, process and thickness (no vias) die dimensions and thickness (dummy die, no wirebonds) 3 - state outputs all linear dimensions are in millimeters and parenthetically in inches p ackage d imension :
this is a mechaincal daisy-chain test vehicle designed to be representative of the 25 x 32mm, 25 x 25mm, 25 x 21mm, and 21 x 21mm packages. use is for second level intercon- nection assembly test such tempature cycling, and conti- nuity verification of the pbga to the test board when it is overflowed.
white electronic designs corporation phoenix az (602) 437-1520
white electronic designs corporation (602) 437-1520 www.whiteedc.com
b = 219 pbga
3225 = 32mm x 25mm dc = daisy chain
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