h thin-film cascadable amplifier 5 to 1000 mhz t echnical data features ? frequency range: 5 to 1000mhz ? high dynamic range ? high output power: +18.5 dbm (typ) ? noise figure: 5.0 db (typ) ? temperature compensated ? surface mount option applications ? if/rf amplification ? surface mount assembly description the 1006 series is a medium-gain, thinfilm bipolar rf amplifier using resistive feedback and active bias for stability over temperature and bias variations. inductive net- works maintain good vswr while rf is coupled through input and output blocking capacitors. the 1006 series amplifiers are avail- able in three packages: the surface mount hermetic pp-38 (.375 in. x .375 in.) case, the to- 8 hermetic case and the connectorized tc-1 case. a vantek products uto/utc/ppa 1006 series pin configuration utoto-8t ground case ground v + rf out rf in utctc-1 rf v + in rf out ppapp-38 v + ground rf in rf out schematic maximum ratings parameter maximum dc voltage +17 volts continuous rf input power +13 dbm operating case temperature C55 to +100 c storage temperature C62 to +150 c r series burn-in temperature +100 c 13.0 gain, db 0 gain frequency, mhz 200 12.5 12.0 400 800 1000 11.5 rf out rf in 11.0 600 5.0 noise figure, db frequency, mhz 4.5 4.0 noise figure 200 400 600 800 0 1000 3.0 v+ 3.5 thermal characteristics 1 q jc 75 c/w active transistor power dissipation 640 mw junction temperature above case temperature 48 c mtbf (mil-hdbk-217e, a uf @ 90 c) 743,600 hrs. note 1: for further information, see reliability screening, pub. 5963-3240e. weight: (typical) ut o 2.1 grams; ut c 21.5 grams
2 electrical specifications (measured in 50 w system @ +15 vdc nominal unless otherwise noted) symbol unit t c = C55 to +85 c 5-1000 10.5 1.0 6.5 +16.0 2.0:1 2.0:1 mhz db db db dbm dbm dbm dbm ma t c = 0 to 50 c guaranteed specifications typical t c = 25 c 5-1000 12.0 0.3 4.8 +18.5 <1.3:1 <1.3:1 +27.0 +30.0 +36.0 70 5-1000 11.0 1.0 6.0 +17.0 2.0:1 2.0:1 characteristic frequency range small signal gain (min.) gain flatness (max.) noise figure (max.) power output @ +1 db comp. (min.) input vswr (max.) output vswr (max.) two tone 3rd order intercept point two tone 2nd order intercept point one tone 2nd harmonic intercept point dc current bw gp nf p 1db ip 3 ip 2 hp 2 i d typical performance over temperature (@ +15 vdc unless otherwise noted) key: +25 c +85 c -55 c 13.0 gain, db 0 gain frequency, mhz 200 12.5 12.0 400 800 1000 11.5 rf out rf in 11.0 600 5.0 noise figure, db frequency, mhz 4.5 4.0 noise figure 200 400 600 800 0 1000 3.0 v+ 3.5 20.0 power output
@ 1 db gain
compression, dbm power output frequency, mhz 0 18.5 2.0 vswr input vswr frequency, mhz 1.75 1.5 1.0 vswr output vswr frequency, mhz 200 2.0 1.75 1.5 1.25 0 200 400 1.0 0 200 400 1.25 600 18.0 1000 1000 1000 19.5 400 800 600 800 600 800 25 35 600 800 35 600 800 50 200 600 800 19.0 40 40 35 30 40 ip 3 , dbm third-order intercept point frequency, mhz 50 ip 2 , dbm second-order intercept point frequency, mhz 45 55 hp 2 , dbm second-harmonic intercept point frequency, mhz 45 30 200 400 1000 30 400 1000 0 200 400 1000 20 25 25 0 0 19.5 400 800 600 800 600 800 25 35 600 800 35 600 800 50 200 600 800 19.0 40 40 35 30
3 automatic network analyzer measurements frequency vswr gain phase phase group delay vswr isolation mhz in db degrees dev ns out db numerical readings bias = 15.00 volts 100.0 1.44 12.63 170.36 C.01 .00 1.20 17.41 150.0 1.43 12.55 165.04 C.31 .29 1.20 17.30 200.0 1.42 12.46 159.97 C.35 .29 1.20 17.35 250.0 1.40 12.40 154.76 C.53 .28 1.20 17.42 300.0 1.38 12.34 149.83 C.43 .27 1.19 17.46 350.0 1.36 12.27 145.02 C.22 .27 1.18 17.51 400.0 1.34 12.20 139.96 C.25 .28 1.16 17.54 450.0 1.33 12.13 135.07 C.11 .27 1.15 17.61 500.0 1.32 12.10 130.23 .07 .27 1.12 17.59 550.0 1.31 12.12 125.50 .36 .26 1.10 17.54 600.0 1.29 12.13 120.91 .81 .26 1.07 17.47 650.0 1.27 12.11 116.24 1.17 .27 1.04 17.35 700.0 1.27 12.09 111.20 1.16 .28 1.03 17.27 750.0 1.27 12.04 106.16 1.15 .29 1.06 17.17 800.0 1.28 11.97 100.68 .69 .31 1.10 17.13 850.0 1.27 11.97 95.13 .17 .31 1.14 17.10 900.0 1.27 11.96 89.38 C.55 .32 1.19 16.94 950.0 1.28 11.96 83.76 C1.13 .31 1.24 16.95 1000.0 1.28 12.06 78.20 C1.67 .31 1.30 16.85 1050.0 1.28 11.99 72.66 .32 1.36 16.78 1100.0 1.29 12.03 66.85 .36 1.42 16.72 1200.0 1.36 11.88 52.69 .39 1.55 16.39 1300.0 1.58 11.73 37.09 .47 1.72 16.22 1400.0 2.11 11.37 18.41 .54 1.95 16.52 1500.0 3.20 10.30 C.79 .57 2.23 17.43 1600.0 5.16 8.32 C20.98 .51 2.61 18.99 1700.0 7.80 5.94 C38.40 .44 2.95 20.62 1800.0 10.73 3.46 C50.25 .32 3.25 22.50 1900.0 13.12 .79 C62.74 .30 3.60 23.46 2000.0 15.53 C1.82 C74.60 .00 3.76 24.62 (typical production unit @ +25 c ambient) linearization range: 100.0 to 1000.0 mhz s-parameters s 21 100.00 .184 C177.8 12.616 170.2 C17.438 C1.3 .093 164.3 200.00 .174 176.9 12.453 159.9 C17.342 C2.3 .089 151.6 300.00 .161 176.3 12.369 149.6 C17.451 C3.9 .085 138.9 400.00 .152 177.7 12.265 139.9 C17.464 C6.0 .076 126.1 500.00 .143 C179.2 12.222 129.3 C17.503 C8.5 .064 110.8 600.00 .131 C172.5 12.195 119.4 C17.384 C11.6 .046 98.9 700.00 .142 C162.1 12.085 109.4 C17.275 C14.6 .017 79.6 800.00 .142 C156.6 11.907 98.8 C17.171 C17.5 .022 C90.5 900.00 .141 C149.4 11.869 87.2 C17.050 C21.6 .069 C108.1 1000.00 .154 C138.0 11.954 76.0 C16.956 C24.6 .126 C121.5 1100.00 .159 C124.6 11.904 84.2 C16.872 C29.7 .186 C137.4 1200.00 .185 C108.7 11.761 49.3 C16.509 C36.6 .243 C158.5 1300.00 .258 C93.3 11.526 32.6 C16.393 C45.8 .306 172.1 1400.00 .398 C90.1 11.044 12.7 C16.885 C60.1 .370 136.0 1500.00 .572 C96.1 9.645 C7.7 C18.062 C75.1 .432 96.5 1600.00 .711 C107.1 7.102 C29.2 C20.192 C87.9 .491 60.7 1700.00 .786 C119.3 3.672 C46.4 C22.673 C95.7 .531 31.7 1800.00 .786 C133.4 C.551 C56.2 C26.297 C92.6 .556 6.9 1900.00 .363 C136.6 C.896 C23.7 C25.231 C54.9 .532 C14.4 2000.00 .788 C112.6 C.753 C65.2 C23.488 C89.8 .562 C26.9 bias = 15.00 volts frequency mhz mag ang db ang db ang mag ang s 11 s 22 s 12
4 product options uto ?509r screening option blank = no screening
r = r-series screening
for more information on r-series screening,
see reliability screening, pub. 5963-3240e. model number prefix uto-
utm-
ppa- model number utc ?509-1 connector option for tc-1 case the only connector option
available is the -1. the -1 option consists
of a sma female connector on both the
input and output (see note). model number prefix utc- model number note: r-series screening is not available in the tc-1 case as the case is non-hermetic. case drawings to-8t .031 .031 .50
dia .450
dia max .200 .017 .22
min +.002 - 001 .150
typ .300
typ ground case
ground v .150
typ 3 4 2 1 45 approximate weight 2.1 grams + rf in rf out glass ring
.060 dia typ
(3x) notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xx .02 xxx .010
5 case drawings tc-1 gnd .350 .890 .460 .310 dc input .38
(2) pl .24 .19 sma jack (female)
(2) pl .180 .640 .905 .095 .250 .570 2-56 unc-2b x .15 deep
threaded insert
(4) pl .460 .310 .350 1.000 .820 product marking
area typical weight with connectors = 21.5 grams
rf .100 v + in rf out notes: 1. the tc-1 case is a non-hermetic case.
2. the only connector option available for the tc-1 case is the ?, sma female connectors at both input and output ports.
agc (if required) .890 .500 notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xx .02 xxx .010
.375 x .375 planarpak surface mounted components case drawings pp-38 .010 r
(4) plcs. .035r
(4) plcs detail "a" "a" .040
(4) plcs .010
(4) plcs. .015 .006 .004 .150 ?.010 .010 (4) plcs .040 .015 + .002
(4) plcs .030
(3) plcs .375 sq. c l c l .050 ?.010
(8) plcs. 4 3 2 1 note 5 typical weight 0.5 grams notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xxx .005 3. leads are for testing only and may be trimmed flush at time of installation. 4. n/c = not connected 5. pin 2 is not at ground potential for pp-38m. it looks the same as pins 1, 3, and 4. recommended assembly procedure 1. chemically clean the pc board and the unit to be mounted using a vapor degreaser or acetone followed by an isopropol alcohol wash. do not use ultrasonic cleaning. 2. mask the backside of the pc board to prevent solder from reflowing through the plated thru-holes causing a rough ground plane surface. a suggested masking material is 2 mil thick kapton? film with silicone adhesive back (permacel part #p-222). 3. apply solder cream (suggest multicore sn62prmab3 or equivalent) using screen printing techniques or careful hand application. a layer 4 to 6 mils thick is adequate. 4. reflow of the unit to the board may be done in many ways. using a hot plate is one of the most simple. during reflow, pressure (with a clamping arrangement) on the unit is recommended, but not absolutely necessary. absolute maximum reflow temperature is 260 c for not more than 10 seconds. 5. chemically reclean the unit using the procedures given in step one. make sure that a flux remover is used which is appropriate for the type of solder cream used (multicore pc81 is the recommended flux remover for the above mentioned cream). it should be noted that there are many alternatives for component attachment. this procedure has been found to be simple and effective. for more detailed instructions on how to use planarpak products, please see the application note planarpak users information pub.5963-3232e. for more information: united state s * europe* far east/australasia: (65) 290-6305 canada: (416) 206-4725 japan: (81 3) 3331-6111 * call your local hp sales office listed in your telephone directory. ask for a components representative. data subject to change copyright ? 1995 hewlett-packard co. printed in u.s.a. 5963-2455e (10/94) h pin designation case 1 2 3 4 pp-38 rf in ground rf out v + pp-38m rf lo if n/c pp-38f rf in ground rf out ground
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