specifications (characteristics) recommended soldering pattern external dimensions (unit: mm) do not connect #2 and #3 to external device. internal connection (unit: mm) #4 #4 #3 #1 #2 #3 #1 0.4 5.08 #2 2.5 1.3 1.5 max. 3.3max. 7.1 max. ea89 1.2 1.5 1.0 1.5 1.2 3.88 (0.75) (0.75) 1.6 MC-156 ? high-density mounting-type smd of 1.5mm thickness. ? small packaging area and light weight. ? excellent shock resistance and environmental capability. ? most suitable for small communications devices. item nominal frequency storage temperature operating temperature maximum drive level soldering condition frequency tolerance(standard) peak temperature(frequency) temperature coefficient(frequency) load capacitance series resistance motional capacitance shunt capacitance insulation resistance aging shock resistance symbol f t stg t opr gl t sol d f/f q t a c l r 1 c 1 c 0 ir fa s.r. specifications 32.768khz 75.000khz -55?c to +125?c -40?c to +85?c 1.0w max. twice at under 260 ?c within 10 sec. or under 230?c within 3 min. 20ppm, 50ppm 25?c 5?c -0.04ppm/?c 2 max. 6pf to 65 k max. 30k 1.9ff typ. 0.8pf typ. 500 m min. 3ppm/year max. 5ppm max. remarks please contact us for inquiries about usable frequencies ta=25?c, dl=0.1w please specify ta=25?c 3?c, first year three drops on a hard board from 75 cm or excitation test with 3000g x 0.3ms x 1/2 sine wave x 3 directions actual size thin smd low/medium-frequency crystal unit metal may be exposed on the top of this product. this won't affect any quality, reliability or electrical spec. 17 temperature range operating drive level 0.5? max. crystal unit
the crystalmaster notice seiko epson corp. quartz device division acquired iso9001 and iso14001 certification by b.v.q. i. (bureau veritas quality international) . iso9001 in october, 1992. iso14001 in november,1997. no part of this material may be reproduced or duplicated in any form or by any means without the written permission of seiko epson. seiko epson reserves the right to make changes to this material without notice. seiko epson does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any produc t or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. this material of portions there may contain technology or the subject relating to strategic prod ucts under the control of the foreign exchange and foreign trade control law of japan and may require an export license from the ministry of international trade and industry or other approval from another government agency. energy saving epson our concept of energy saving technology conserves resources by blending the essence of these three efficiency technologies. the essence of these technologies is repre- sented in each of the products that we provide to our cus- tomers. in the industrial sector, leading priorities include mea- sures to counter the greenhouse effect by reducing co2, measures to preserve the global environ- ment, and the development of energy- efficient products. environmental problems are of global concern, and although the contribution of energy- saving technology developed by epson may appear insignificant, we seek to contribute to the develop- ment of energy-saving products by our customers through the utilization of our electronic devices. epson is committed to the conservation of energy, both for the sake of people and of the planet on which we live. epson offers effective savings to its customers through a wide range of electronic devices, such as semiconductors, liquid crystal display (lcd) modules, and crystal devices. these savings are achieved through a sophisticated melding of three different efficiency technologies. power saving technology provides low power con- sumption at low voltages. space saving technology provides further reductions in product size and weight through super-precise pro- cessing and high-density assembly technology. time saving technology shortens the time required for design and development on the customer side and shortens delivery times. energy saving power saving space saving time saving resource saving
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