asdl-4360 high power and high speed infrared emitter (885nm) in plcc-2 package data sheet description asdl-4360 infrared emitter is encapsulated in the industry standard plcc-2 smt package that is designed for application that requires high radiant intensity and fast switching at wide viewing angle. this device optimizes at emissive wavelength of 885nm. applications ? high-speed machine automated system ? medical applications ? non-contact position sensing ? optical sensing ? security applications ordering information features ? 885nm wavelength ? industry standard footprint: plcc-2 smt package ? high speed ? high power ? low forward voltage ? high pulse rate ? lead free and rohs compliant ? tape & reel for automation placement part number packaging shipping option ASDL-4360-C22 tape & reel 2000pcs
2 package outline all dimensions are in millimeters tape and reel dimension all dimensions are in millimeters
3 absolute maximum ratings at 25 c parameter symbol min. max unit reference peak forward current i fpk 500 ma t p =500ns t w = 100ns duty cycle = 20% continuous forward current i fdc 100 ma power dissipation p diss 200 mw reverse voltage v r 11 v i r =100ua operating temperature t o -40 85 c storage temperature t s -40 100 c led junction temperature t j 110 c lead soldering temperature 260 for 5 sec c electrical characteristics at 25 c parameter symbol min. typ. max. unit condition forward voltage v f 1.4 1.6 1.7 2.0 v v i f =20ma i f =100ma reverse voltage v r 11 v i r =10ua thermal resistance 250 c/w diode capacitance c o 90 pf vr=0v, f=1mhz optical characteristics at 25 c parameter symbol min. typ. max. unit condition radiant on-axis intensity i e 1.0 5.1 2.0 10.0 mw/sr i f = 20ma i f =100ma viewing angle 2 1/2 120 deg peak wavelength pk 885 nm i f = 20ma spectral width ? 55 nm i f = 20ma optical rise time t r 20 ns i fpk =500ma duty factor=20% pulse width=100ns optical fall time t f 17 ns i fpk =500ma duty factor=20% pulse width=100ns
4 typical electrical / optical characteristics curve (t a = 25 c unless otherwise stated) figure 1. peak wavelength vs relative radiant intensity figure 2. forward current vs forward voltage figure 3. forward current vs radiant intensity figure 4. angular displacement vs relative radiant intensity figure 5. forward current vs ambient temperature derated based on tj C 110 c and thermal resistance at 250 c/w 0 0.2 0.4 0.6 0.8 1 1.2 700 800 900 1000 peak wavelength (nm) relative radiant intensity 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0 0.5 1 1.5 2 vf forward voltage (v) if forward current (a) 0 2 4 6 8 10 12 0 2 0 4 0 6 0 8 0 100 120 forward current (ma) radiant intensity (mw/sr) 0 0.2 0.4 0.6 0.8 1 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 ie - relative radiant intensity 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - o c i dc max - maximum dc current per segment - ma
5 50 100 150 200 250 30 0 t-tim e (seconds ) 25 80 120 150 180 200 230 255 0 t - temperature (c) r1 r2 r3 r4 r5 217 max 260c 60 sec to 90 sec above 217 c p1 heat u p p2 solder paste dr y p3 solder reflo w p4 cool down process zone symbol d t maximum d t/ d time or duration heat up p1, r1 25c to 150c 3c/s solder paste dry p2, r2 150c to 200c 100s to 180s solder refow p3, r3 p3, r4 200c to 260c 260c to 200c 3c/s -6c/s cool down p4, r5 200c to 25c -6c/s time maintained above liquidus point , 217c > 217c 60s to 90s peak temperature 260c - time within 5c of actual peak temperature - 20s to 40s time 25c to peak temperature 25c to 260c 8mins the refow profle is a straight-line representation of a nominal temperature profle for a convective refow solder process. the temperature profle is divided into four process zones, each with diferent d t/ d time temperature change rates or duration. the d t/ d time rates or duration are detailed in the above table. the temperatures are measured at the component to printed circuit board connections. in process zone p1, the pc board and component pins are heated to a temperature of 150c to activate the fux in the solder paste. the temperature ramp up rate, r1, is limited to 3c per second to allow for even heating of both the pc board and component pins. process zone p2 should be of sufcient time duration (100 to 180 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the solder. process zone p3 is the solder refow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 260c (500f) for optimum results. the dwell time above the liquidus point of solder should be between 60 and 90 seconds. this is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. the temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25c (77f) should not exceed 6c per second maximum. this limitation is necessary to allow the pc board and component pins to change dimensions evenly, putting minimal stresses on the component. it is recommended to perform refow soldering no more than twice. recommended refow profle
recommended land pattern all dimensions are in millimeters for company and product information, please go to our web site: www.liteon.com or http://optodatabook.liteon.com/databook/databook.aspx data subject to change. copyright ? 2007 lite-on technology corporation. all rights reserved.
|
