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eia standard board layout drawing for bga, ccga, csp, and qfn july 2009 july 2009
2 eia standard board layout drawing for bga, ccga, csp, and qfn notes: 1. ta b l e 2 a through table 6 on page 11 contain the recommended guidelines for board layout soldered pad dimensions for the following actel pa ckages (including pad dimension for prototyping socket accordingly): cs (chip scale bga, 0.8 mm pitch), fg (fine pitch bga, 1.00 mm pitch), bg (plastic ball grid array, 1.27 mm pitch, cg (ceramic column grid ar ray, 1.27 mm pitch), cg adapter socket, qn (quad fine pitch no-lead qfn, 0.5 mm pitch). 2. for e-tec prototyping socket soldering, actel re commends using non-silver type solder paste with 6 mils thickness. figure 1: suggested board layout of soldered pads for bga packages sl sm vl th a_a dl a_a bl bl lw
eia standard board layout drawing for bga, ccga, csp, and qfn 3 table 1a: recommended pcb design guidelines for actel cs (0.5 mm pitch bga) package dim. ucs36 ucs81 cs81 cs121 cs196 cs201 cs281 component land pad diameter (smd) 0.33 0.33 0.35 0.35 0.35 0.35 0.35 solder land diameter (sl) 0.23 0.23 0.25 0.25 0.25 0.25 0.25 solder mask opening diameter (sm) 0.33 0.33 0.35 0.35 0.35 0.35 0.35 solder ball land pitch (bl) 0.4 0.4 0.50 0.50 0.50 0.50 0.50 line width between via and solder land (lw) via in pad via in pad 0.15 to 0.20 0.15 to 0.20 0.15 to 0.20 0.15 to 0.20 0.15 to 0.20 distance between via and solder land (dl) via in pad via in pad 0.353 0.353 0.353 0.353 0.353 via land diameter (vl) see land diameter see land diameter 0.200 to 0.250 0.200 to 0.250 0.200 to 0.250 0.200 to 0.250 0.200 to 0.250 through hole diameter (th) 0.100 to 0.125 0.100 to 0.125 0.100 to 0.125 0.100 to 0.125 0.100 to 0.125 0.100 to 0.125 0.100 to 0.125 line width (l) 0.075 0.075 0.075 0.075 0.075 0.075 0.075 line width (l) if inner outer via's staggered. na na na na na na 0.10 line space (s) 0.085 0.085 0.085 0.085 0.085 0.085 0.085 pad array full full full full full perimeter perimeter pad matrix 6 x 6 9 x 9 9x9 11x11 14x14 15x15 19x19 periphery rows ? ? ? ? ? 4, 1, 5 2, 2, 7 table 2a: recommended pcb design guidelines for actel cs (0.8 mm pitch bga) package dimension cs49 cs128 cs180 component land pad diameter (smd) 0.35 0.35 0.35 solder land diameter (sl) 0.30 0.30 0.30 solder mask opening diameter (sm) 0.45 0.45 0.45 solder ball land pitch (bl) 0.80 0.80 0.80 line width between via and solder land (lw) 0.15 0.15 0.15 distance between via and solder land (dl) 0.56 0.56 0.56 via land diameter (vl) 0.50 0.50 0.50 through hole diameter (th) 0.25 0.25 0.25 pad array full perimeter perimeter pad matrix 77 1212 1414 periphery rows ? 4 5
4 eia standard board layout drawing for bga, ccga, csp, and qfn table 2b: recommended pcb design guidelines for prototyping socket of cs package dimension cs49 prototyping socket. actel p/n: se-cs49-h cs128 prototyping socket. actel p/n: se-cs128-h cs180 prototyping socket. actel p/n: se-cs180-h socket pin diameter 0.45 0.45 0.45 solder land diameter (sl) 0.50 0.50 0.50 solder mask opening diameter (sm) 0.60 0.60 0.60 solder ball land pitch (bl) 0.80 0.80 0.80 line width between via and solder land (lw) 0.15 0.15 0.15 distance between via and solder land (dl) 0.56 0.56 0.56 via land diameter (vl) 0.50 0.50 0.50 through hole diameter (th) 0.25 0.25 0.25 pad array full perimeter perimeter pad matrix 77 1212 1414 periphery rows ? 4 5
eia standard board layout drawing for bga, ccga, csp, and qfn 5 table 3a: recommended pcb design guidelines for actel fg (1.00 mm pitch bga) package dimension fg144 fg256 fg324 fg484 2323 fg484 fg676 fg896 fg1152 component land pad diameter (smd) 0.40 0.45 0.45 0.45 0.45 0.45 0.45 0.45 solder land diameter (sl) 0.35 0.40 0.40 0.40 0.40 0.40 0.40 0.40 solder mask opening diameter (sm) 0.50 0.55 0.55 0.55 0.55 0.55 0.55 0.55 solder ball land pitch (bl) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 line width between via and solder land (lw) 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 distance between via and solder land (dl) 0.70 0.70 0.70 0.70 0.70 0.70 0.70 0.70 via land diameter (vl) 0.60 0.60 0.60 0.60 0.60 0.60 0.60 0.60 through hole diameter (th) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 pad array full full full full perimeter full full full pad matrix 1212 1616 1818 2222 2626 2626 3030 3434 periphery rows ? ? ? ? 5 + 88 ? ? ? table 3b: recommended pcb design guidelines fo r prototyping socket of fg package dimension fg144 prototyping socket. actel p/n: se-fg144-h fg256 prototyping socket. actel p/n: se-fg256-hu fg324 prototyping socket. actel p/n: se-fg324-h fg484 2323 prototyping socket. actel p/n: se-fg484-s-h fg484 prototyping socket. actel p/n: se-fg484-h fg676 prototyping socket. actel p/n: SE-FG676-h fg896 prototyping socket. actel p/n: se-fg896 fg1152 prototyping socket. actel p/n: se-fg1152 socket pin diameter 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 solder land diameter (sl) 0.58 0.58 0.58 0.58 0.58 0.58 0.58 0.58 solder mask opening diameter (sm) 0.73 0.73 0.73 0.73 0.73 0.73 0.73 0.73 solder ball land pitch (bl) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 line width between via and solder land (lw) 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 distance between via and solder land (dl) 0.70 0.70 0.70 0.70 0.70 0.70 0.70 0.70 via land diameter (vl) 0.60 0.60 0.60 0.60 0.60 0.60 0.60 0.60 through hole diameter (th) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 pad array full full full full perimeter full full full pad matrix 1212 1616 1818 2222 2626 2626 3030 3434 periphery rows ? ? ? ? 5 + 88 ? ? ?
6 eia standard board layout drawing for bga, ccga, csp, and qfn table 4a: recommended pcb design guidelines for actel bg (1.27 mm pitch bga) package dimension bg272 bg313 bg329 bg456 bg729 component land pad diameter (smd) 0.63 0.63 0.63 0.63 0.63 solder land diameter (sl) 0.58 0.58 0.58 0.58 .058 solder mask opening diameter (sm) 0.73 0.73 0.73 0.73 0.73 solder ball land pitch (bl) 1.27 1.27 1.27 1.27 1.27 line width between via and solder land (lw) 0.15 0.15 0.15 0.15 0.15 distance between via and solder land (dl) 0.80 0.80 0.80 0.80 0.80 via land diameter (vl) 0.60 0.60 0.60 0.60 0.60 through hole diameter (th) 0.30 0.30 0.30 0.30 0.30 pad array perimeter staggered perimeter perimeter full pad matrix 2020 2525 2323 2626 2727 periphery rows 4 + 44 ? 4 + 55 5 + 66 ? table 4b: recommended pcb design guidelines for prototyping socket of bg package dimension bg272 prototyping socket. actel p/n: sm-bg272-b bg313 prototyping socket. actel p/n: sm-bg313-b bg329 prototyping socket. actel p/n: sm-bg329-b bg456 prototyping socket. actel p/n: sm-bg456-b bg729 prototyping socket. actel p/n: se-bg729 socket pin diameter 0.55 0.55 0.55 0.55 0.55 solder land diameter (sl) 0.58 0.58 0.58 0.58 .058 solder mask opening diameter (sm) 0.73 0.73 0.73 0.73 0.73 solder ball land pitch (bl) 1.27 1.27 1.27 1.27 1.27 line width between via and solder land (lw) 0.15 0.15 0.15 0.15 0.15 distance between via and solder land (dl) 0.80 0.80 0.80 0.80 0.80 via land diameter (vl) 0.60 0.60 0.60 0.60 0.60 through hole diameter (th) 0.30 0.30 0.30 0.30 0.30 pad array perimeter staggered perimeter perimeter full pad matrix 2020 2525 2323 2626 2727 periphery rows 4 + 44 ? 4 + 55 5 + 66 ?
eia standard board layout drawing for bga, ccga, csp, and qfn 7 figure 2: recommended pcb design guidelines for actel ccga (ceramic column grid array, or cg) package table 5: recommended pcb design guidelines for actel ccga (ceramic column grid array, or cg) package the recommended guidelines for the 1.27 mm pitch package pertain to the actel cg624 package, the cg624 to fg484 adapter socket, and the cg624 to fg896 adapter socket. the 1.00 mm pi tch recommendations relate to the actel cg1152 and cg1272 packages. notes: 1. functional surface 2. normal diameter at copper/polyimate interface with typical edge angle 45? typical solder mask window (diameter a) mounting pad (diameter b) 2 via solder mask window (diameter d) via (diameter e) land (diameter f) g typical .3 mm line a a h all dimensions are in mm unless otherwise specified. diameter b 2 diameter c solderable surface 1 section a-a diameter 1.27 mm pitch a 0.851 mm b 0.749 mm d 0.720 mm d 0.483 mm e 0.305 mm f 0.560 mm g 0.635 mm h 0.635 mm 0.50 mm 0.50 mm 0.46 mm 0.20 mm 0.38 mm 0.67 mm 0.70 mm 0.80 mm 1.00 mm pitch cg1152/1272 cg624
8 eia standard board layout drawing for bga, ccga, csp, and qfn note: this suggested board layout is for smd. to use nsmd, swap sl and sm dimensions. figure 3: suggested board layout of soldered pads for qfn (top) packages s m s m s l s l bl bl bl ll l s ll ll ll l s lw1 l s th 150 4800 4700 200 bl
eia standard board layout drawing for bga, ccga, csp, and qfn 9 figure 4: suggested board layout of soldered pads for qfn (bottom) packages lw1 lw2 lw1 lv lv th vl
10 eia standard board layout drawing for bga, ccga, csp, and qfn figure 5: suggested board layout of soldered pads for qfn packages (pcb bottom layer) this suggested board layout is for reduced thermal pad, nsmd, to use smd swap sl and sm dimensions. bl bl bl ll ll th 1250 1250 so so sm sl sm bl so sl lw1 ll ll
eia standard board layout drawing for bga, ccga, csp, and qfn 11 ta b l e 6 contains the recommended guidelines for boar d layout soldered pad dimension for actel qn (0.5 mm pitch qfn) packages only. figure 6: suggested board layout of soldered pads for qfn packages (pcb bottom layer), reduced thermal pad table 6: recommended qfn design guidelines dimension qn68* qn108 qn132 qn180 component land pad diameter (smd) 0.200/0.400 0.3 0.3 0.3 solder land diameter (sl) 0.200/0.400 0.3 0.3 0.3 solder mask opening diameter (sm) 0.300/0.500 0.425 0.425 0.425 solder land to solder land (ll) 0.075 0.075 0.075 0.075 solder mask overlap (so) 0.0625 0.0625 0.0625 0.0625 solder land pitch (bl) 0.400 0.5 0.5 0.5 line width between via and via land (lw2) n/a 0.1 0.1 0.1 line width between via out side via land (lw1) 0.127 0.127 0.127 0.127 line to via land (lv) n/a 0.050 - 0.100 0.050 -0.100 0.050 - 0.100 via land diameter (vl) n/a 0.250 - 0.400 0.250 - 0.400 0.250 - 0.400 through hole diameter (th) n/a 0.100 - 0.250 0.100 - 0.250 0.100 - 0.250 die attach pad (dp) 2.920 x 2.920 4.700 x 4.700 5.700 x 5.700 6.300 x 6.300 pad array perimeter perimeter perimeter perimeter body size 8x8 8x8 8x8 10x10 periphery rows 1233 note: *component land pad and solder lands are rectangular, longest dimension is perpendicular to package edge. lw1 lw2 lw1 lv vl lv th
12 eia standard board layout drawing for bga, ccga, csp, and qfn pcb land pattern design file you can download the qn132 pcb land patter design file from actel?s website. th is can be used to assist the layout of the board. download the file from http://www.actel.com/documents/pcb_qn132_df.zip . list of changes the following table lists critical changes that were made in the current version of the document. previous version changes in current version page 55700007-6/7.08* table 1a: recommended pcb design guidelines for actel cs (0.5 mm pitch bga) package was updated to include uc36 data. page 3 55700007-5/3.08* table 1a: recommended pcb design guidelines for actel cs (0.5 mm pitch bga) package was updated to include uc81 data. page 3 table 6: recommended qfn design guidelines was updated to include qn68 data. page 11 55700007-4/2.08* table 1a: recommended pcb design guidelines for actel cs (0.5 mm pitch bga) package was updated to include cs201 and cs281. page 3 figure 5:suggested board layout of soldered pads for qfn packages (pcb bottom layer) this suggested board layout is for reduced thermal pad, nsmd, to use smd swap sl and sm dimensions. is new. page 10 figure 6:suggested board layout of soldered pads for qfn packages (pcb bottom layer), reduced thermal pad is new. page 11 table 6: recommended qfn design guidelines was updated. page 11 note: *the part number is located on the last page of the document.
actel hong kong room 2107, china resources building 26 harbour road wanchai, hong kong phone +852 2185 6460 fax +852 2185 6488 www.actel.com.cn ? 2009 actel corporation. all rights reserved. actel and the actel logo are trademarks of actel corporation. all other brand or product names are the property of their respective owners. 55900007-7/7.09 actel corporation 2061 stierlin court mountain view, ca 94043-4655 usa phone 650.318.4200 fax 650.318.4600 actel europe ltd. river court, meadows business park station approach, blackwatery camberley surrey gu17 9ab united kingdom phone +44 (0) 1276 609 300 fax +44 (0) 1276 607 540 actel japan exos ebisu building 4f 1-24-14 ebisu shibuya-ku tokyo 150 japan phone +81.03.3445.7671 fax +81.03.3445.7668 http://jp.actel.com actel is the leader in low-power and mixed-signal fpgas an d offers the most comprehensive portfolio of system and power management solutions. power ma tters. learn more at www.actel.com.

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