lg3330/t-pf doc. no : qw0905-lg3330/t-pf rev. : b date : 24 - may - 2007 data sheet ligitek electronics co.,ltd. property of ligitek only pb lead-free parts low current round type led lamps
2.specifications are subject to change without notice. 0.25mm unless otherwise noted. note : 1.all dimension are in millimeter tolerance is directivity radiation package dimensions property of ligitek only ligitek electronics co.,ltd. 1/5 page lg3330/t-pf part no. 5.0 5.9 1.5max 25.0min 1.0min 2.54typ - + 0.5 typ 8.6 7.6
typical electrical & optical characteristics (ta=25 ) ligitek electronics co.,ltd. property of ligitek only page 2/5 symbol absolute maximum ratings parameter operating temperature storage temperature -40 ~ +85 -40 ~ +100 t opr tstg peak forward current duty 1/10@10khz reverse current @5v forward current power dissipation ir i f pd i fp absolute maximum ratings at ta=25 unit a ma mw ma note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. forward voltage @2ma(v) peak wave length pnm spectral halfwidth nm viewing angle 2 1/2 (deg) luminous intensity @2ma(mcd) part nomaterial color emittedlensmin.max. typ. min. lg3330/t-pf 120 10 100 30 g green diffused gap green 1.8 565301.8 2.2 28 3.0 lg3330/t-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page 3/5 forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip lg3330/t-pf part no.
2.wave soldering profile 5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 25 2 /sec max preheat 0 0 50 120 time(sec) 150 100 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 260 temp( c) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only part no. page 4/5 60 seconds max lg3330/t-pf
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. thermal shock test high temperature high humidity test low temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only operating life test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition test item description part no. reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard page 5/5 lg3330/t-pf
|
