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db14-000165-01 LSI53C875/875e pci to ultra scsi i/o processor technical manual april 2003 version 4.2
ii this document contains proprietary information of lsi logic corporation. the information contained herein is not to be used by or disclosed to third parties without the express written permission of an of?er of lsi logic corporation. lsi logic products are not intended for use in life-support appliances, devices, or systems. use of any lsi logic product in such applications without written consent of the appropriate lsi logic of?er is prohibited. document db14-000165-01, sixth edition (april 2003) this document describes the lsi logic LSI53C875/875e pci to ultra scsi i/o processor and will remain the of?ial reference source for all revisions/releases of this product until rescinded by an update. to receive product literature, visit us at http://www.lsilogic.com. lsi logic corporation reserves the right to make changes to any products herein at any time without notice. lsi logic does not assume any responsibility or liability arising out of the application or use of any product described herein, except as expressly agreed to in writing by lsi logic; nor does the purchase or use of a product from lsi logic convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual property rights of lsi logic or third parties. copyright 1998?001/2003 by lsi logic corporation. all rights reserved. trademark acknowledgment the lsi logic logo design, tolerant, sdms, and scripts are registered trademarks or trademarks of lsi logic corporation. all other brand and product names may be trademarks of their respective companies. preface iii preface this book is the primary reference and technical manual for the lsi logic LSI53C875/875e pci to ultra scsi i/o processor. it contains a complete functional description for the LSI53C875/875e and includes complete physical and electrical speci?ations for the LSI53C875/875e. audience this technical manual is intended for system designers and programmers who are using this device to design a scsi port for pci-based personal computers, workstations, or embedded applications. organization this document has the following chapters and appendixes: ? chapter 1, general description , includes general information about the LSI53C875 and other members of the lsi53c8xx family of pci to scsi i/o processors. ? chapter 2, functional description , describes the main functional areas of the chip in more detail, including the interfaces to the scsi bus. ? chapter 3, pci functional description , describes the chip s connection to the pci bus, including the pci commands and con?uration registers supported. ? chapter 4, signal descriptions , contains the pin diagrams and de?itions of each signal. ? chapter 5, scsi operating registers , describes each bit in the operating registers, organized by address. iv preface ? chapter 6, instruction set of the i/o processor , de?es all of the scsi scripts instructions that are supported by the LSI53C875. ? chapter 7, instruction set of the i/o processor , contains the electrical characteristics and ac timings for the chip. ? appendix a, register summary , is a register summary. ? appendix b, external memory interface diagram examples , contains several example interface drawings to connect the LSI53C875 to an external rom. related publications for background information, please contact: ansi 11 west 42nd street new york, ny 10036 (212) 642-4900 ask for document number x3.131-199x (scsi-2) global engineering documents 15 inverness way east englewood, co 80112 (800) 854-7179 or (303) 397-7956 (outside u.s.) fax (303) 397-2740 ask for document number x3.131-1994 (scsi-2); x3.253 ( scsi-3 parallel interface ) endl publications 14426 black walnut court saratoga, ca 95070 (408) 867-6642 document names: scsi bench reference, scsi encyclopedia, scsi tutor prentice hall 113 sylvan avenue englewood cliffs, nj 07632 (800) 947-7700 ask for document number isbn 0-13-796855-8, scsi: understanding the small computer system interface preface v lsi logic world wide web home page www.lsilogic.com scsi scripts processors programming guide , version 2.2, order number s14044.a pci special interest group 2575 n. e. katherine hillsboro, or 97214 (800) 433-5177; (503) 693-6232 (international); fax (503) 693-8344 conventions used in this manual the word assert means to drive a signal true or active. the word deassert means to drive a signal false or inactive. hexadecimal numbers are indicated by the pre? ?x ?or example, 0x32cf. binary numbers are indicated by the pre? ?b ?or example, 0b0011.0010.1100.1111. revision record revision date remarks 1.0 6/95 revision 1.0 2.0 3/96 revision 2.0. fast-20 changed to ultra scsi throughout. 3.0 9/96 revision 3.0. minor copy changes throughout. 4.0 2/98 revision 4.0. minor copy changes throughout 4.1 3/01 product names changed from sym to lsi. 4.2 4/03 revision 4.2. correct v dd -s in table 4.3 vi preface contents vii contents chapter 1 general description 1.1 package and feature options 1-4 1.2 bene?s of ultra scsi 1-4 1.3 tolerant technology 1-5 1.4 LSI53C875 bene?s summary 1-6 1.4.1 scsi performance 1-6 1.4.2 pci performance 1-7 1.4.3 integration 1-7 1.4.4 ease of use 1-7 1.4.5 flexibility 1-8 1.4.6 reliability 1-9 1.4.7 testability 1-9 chapter 2 functional description 2.1 scsi functional description 2-1 2.1.1 scsi core 2-1 2.1.2 dma core 2-2 2.1.3 scripts processor 2-2 2.1.4 internal scripts ram 2-3 2.1.5 sdms software: the total scsi solution 2-3 2.2 designing an ultra scsi system 2-4 2.2.1 using the scsi clock doubler 2-4 2.3 prefetching scripts instructions 2-5 2.3.1 opcode fetch burst capability 2-6 2.4 external memory interface 2-6 2.5 pci cache mode 2-8 2.5.1 load/store instructions 2-8 2.5.2 3.3 v/5 v pci interface 2-9 2.5.3 additional access to general purpose pins 2-9 viii contents 2.5.4 jtag boundary scan testing 2-10 2.5.5 big and little endian support 2-10 2.5.6 loopback mode 2-12 2.5.7 parity options 2-12 2.5.8 dma fifo 2-15 2.5.9 scsi bus interface 2-19 2.5.10 select/reselect during selection/reselection 2-25 2.5.11 synchronous operation 2-25 2.5.12 ultra scsi synchronous data transfers 2-27 2.5.13 interrupt handling 2-28 2.5.14 chained block moves 2-34 2.6 power management 2-38 2.6.1 power state d0 2-38 2.6.2 power state d3 2-39 chapter 3 pci functional description 3.1 pci addressing 3-1 3.1.1 pci bus commands and functions supported 3-2 3.2 pci cache mode 3-4 3.2.1 support for pci cache line size register 3-4 3.2.2 selection of cache line size 3-5 3.2.3 alignment 3-5 3.2.4 memory move misalignment 3-6 3.2.5 memory write and invalidate command 3-6 3.2.6 memory read line command 3-8 3.2.7 memory read multiple command 3-9 3.3 con?uration registers 3-11 chapter 4 signal descriptions 4.1 mad bus programming 4-22 chapter 5 scsi operating registers chapter 6 instruction set of the i/o processor 6.1 scsi scripts 6-1 6.1.1 sample operation 6-3 contents ix 6.2 block move instructions 6-5 6.2.1 first dword 6-5 6.2.2 second dword 6-12 6.3 i/o instruction 6-12 6.3.1 first dword 6-12 6.3.2 second dword 6-21 6.4 read/write instructions 6-21 6.4.1 first dword 6-21 6.4.2 second dword 6-22 6.4.3 read-modify-write cycles 6-22 6.4.4 move to/from sfbr cycles 6-24 6.5 transfer control instructions 6-26 6.5.1 first dword 6-26 6.5.2 second dword 6-33 6.6 memory move instructions 6-33 6.6.1 read/write system memory from scripts 6-34 6.6.2 second dword 6-35 6.6.3 third dword 6-35 6.7 load and store instructions 6-37 6.7.1 first dword 6-38 6.7.2 second dword 6-39 chapter 7 instruction set of the i/o processor 7.1 dc characteristics 7-1 7.2 tolerant technology electrical characteristics 7-7 7.3 ac characteristics 7-10 7.4 pci and external memory interface timing diagrams 7-13 7.4.1 target timing 7-15 7.4.2 initiator timing 7-24 7.4.3 external memory timing 7-32 7.5 pci and external memory interface timing 7-50 7.6 scsi timing diagrams 7-51 7.7 package drawings 7-58 appendix a register summary appendix b external memory interface diagram examples x contents index customer feedback figures 1.1 LSI53C875 external memory interface 1-2 1.2 LSI53C875 chip block diagram 1-3 2.1 dma fifo sections 2-15 2.2 LSI53C875 host interface data paths 2-16 2.3 differential wiring diagram 2-22 2.4 regulated termination 2-24 2.5 determining the synchronous transfer rate 2-26 2.6 block move and chained block move instructions 2-35 4.1 LSI53C875 pin diagram 4-2 4.2 LSI53C875j pin diagram 4-3 4.3 LSI53C875n pin diagram 4-4 4.4 LSI53C875jb pin diagram (top view) 4-5 4.5 LSI53C875 functional signal grouping 4-9 6.1 scripts overview 6-4 6.2 block move instruction register 6-7 6.3 i/o instruction register 6-15 6.4 read/write instruction register 6-23 6.5 transfer control instructions 6-28 6.6 memory move instruction 6-36 6.7 load and store instruction format 6-40 7.1 rise and fall time test conditions 7-8 7.2 scsi input filtering 7-8 7.3 hysteresis of scsi receiver 7-9 7.4 input current as a function of input voltage 7-9 7.5 output current as function of output voltage 7-10 7.6 clock waveforms 7-11 7.7 reset input 7-12 7.8 interrupt output 7-13 7.9 pci con?uration register read 7-15 7.10 pci con?uration register write 7-16 7.11 operating register/scripts ram read 7-17 contents xi 7.12 operating register/scripts ram write 7-18 7.13 external memory read 7-20 7.14 external memory write 7-22 7.15 opcode fetch, nonburst 7-24 7.16 burst opcode fetch 7-25 7.17 back-to-back read 7-26 7.18 back-to-back write 7-27 7.19 burst read 7-28 7.20 burst write 7-30 7.21 read cycle, normal/fast memory ( 64 kbytes), single byte access 7-32 7.22 write cycle, normal/fast memory ( 64 kbytes), single byte access 7-34 7.23 read cycle, normal/fast memory ( 64 kbyte), multiple byte access 7-36 7.24 write cycle, normal/fast memory ( 64 kbyte), multiple byte access 7-38 7.25 read cycle, slow memory ( 64 kbyte) 7-40 7.26 write cycle, slow memory ( 64 kbyte) 7-42 7.27 read cycle, normal/fast memory ( 64 kbyte) 7-44 7.28 write cycle, normal/fast memory ( 64 kbyte) 7-45 7.29 read cycle, slow memory ( 64 kbyte) 7-46 7.30 write cycle, slow memory ( 64 kbyte) 7-48 7.31 initiator asynchronous send 7-51 7.32 initiator asynchronous receive 7-52 7.33 target asynchronous send 7-52 7.34 target asynchronous receive 7-53 7.35 initiator and target synchronous transfer 7-53 7.36 169-pin pbga (gv) mechanical drawing 7-58 7.37 160-pin pqfp (p3) mechanical drawing 7-59 b.1 64 kbyte interface with 200 ns memory b-1 b.2 64 kbyte interface with 150 ns memory b-2 b.3 256 kbyte interface with 150 ns memory b-3 b.4 512 kbyte interface with 150 ns memory b-4 xii contents tables 2.1 external memory support 2-7 2.2 bits used for parity control and generation 2-13 2.3 scsi parity control 2-14 2.4 scsi parity errors and interrupts 2-15 2.5 differential mode 2-20 3.1 pci bus commands and encoding types 3-3 3.2 pci con?uration register map 3-12 4.1 LSI53C875, LSI53C875j, LSI53C875e, and LSI53C875je power and ground signals 4-7 4.2 LSI53C875n power and ground signals 4-7 4.3 LSI53C875jb and LSI53C875jbe power and ground signals 4-8 4.4 system signals 4-10 4.5 address and data signals 4-11 4.6 interface control signals 4-12 4.7 arbitration signals 4-13 4.8 error reporting signals 4-14 4.9 scsi signals 4-15 4.10 additional interface signals 4-18 4.11 external memory interface signals 4-21 4.12 jtag signals (LSI53C875j/LSI53C875n/LSI53C875jb only) 4-22 4.13 subsystem data con?uration table for the LSI53C875e (pci rev id 0x26) 4-23 4.14 subsystem data con?uration table for the LSI53C875 (pci rev id 0x04), revision g only 4-23 4.15 external memory support 4-24 5.1 LSI53C875 register map 5-2 5.2 examples of synchronous transfer periods for scsi-1 transfer rates 5-16 5.3 example transfer periods for fast scsi-2 and ultra scsi transfer rates 5-17 5.4 maximum synchronous offset 5-18 5.5 scsi synchronous data fifo word count 5-28 6.1 scripts instructions 6-2 6.2 read/write instructions 6-24 contents xiii 7.1 absolute maximum stress ratings 7-2 7.2 operating conditions 7-2 7.3 scsi signals?d[15:0]/, sdp[1:0]/, sreq/, sack/ 7-3 7.4 scsi signals?msg, si_o/, sc_d/, satn/, sbsy/, ssel/, srst/ 7-3 7.5 input signals?lk, sclk, gnt/, idsel, rst/, testin, diffsens, big_lit/ 7-3 7.6 capacitance 7-4 7.7 output signals?ac/_testout, req/ 7-4 7.8 output signals?rq/, sdir[15:0], sdirp0, sdirp1, bsydir, seldir, rstdir, tgs, igs, mas/[1:0], mce/, moe/, mwe/ 7-4 7.9 output signal?err/ 7-4 7.10 bidirectional signals?d[31:0], c_be[3:0], frame/, irdy/, trdy/, devsel/, stop/, perr/, par 7-5 7.11 bidirectional signals?pio0_fetch/, gpio1_master/, gpio2_mas2/, gpio3, gpio4 7-5 7.12 bidirectional signals?ad[7:0] 7-6 7.13 input signals?di, tms, tck (LSI53C875j, LSI53C875jb, LSI53C875n only) 7-6 7.14 output signal?do (LSI53C875, LSI53C875jb, LSI53C875n only) 7-6 7.15 tolerant technology electrical characteristics 7-7 7.16 clock timing 7-11 7.17 reset input 7-12 7.18 interrupt output 7-13 7.19 LSI53C875 pci and external memory interface timing 7-50 7.20 initiator asynchronous send 7-51 7.21 initiator asynchronous receive 7-52 7.22 target asynchronous send 7-52 7.23 target asynchronous receive 7-53 7.24 scsi-1 transfers (se, 5.0 mbytes/s) 7-54 7.25 scsi-1 transfers (differential, 4.17 mbytes/s) 7-54 7.26 scsi-2 fast transfers 10.0 mbytes/s (8-bit transfers) or 20.0 mbytes/s (16-bit transfers), 40 mhz clock 7-55 7.27 scsi-2 fast transfers 10.0 mbytes/s (8-bit transfers) or 20.0 mbytes/s (16-bit transfers), 50 mhz clock 7-55 7.28 ultra scsi se transfers 20.0 mbytes/s (8-bit transfers) or 40.0 mbytes/s (16-bit transfers), 80 mhz clock 7-56 xiv contents 7.29 ultra scsi differential transfers 20.0 mbytes/s (8-bit transfers) or 40.0 mbytes/s (16-bit transfers), 80 mhz clock 7-57 a.1 con?uration registers a-1 a.2 LSI53C875 register map a-2 LSI53C875/875e pci to ultra scsi i/o processor 1-1 chapter 1 general description chapter 1 is divided into the following sections: ? section 1.1, ?ackage and feature options ? section 1.2, ?ene?s of ultra scsi ? section 1.3, ?olerant technology ? section 1.4, ?si53c875 bene?s summary this manual combines information on the LSI53C875 and LSI53C875e, which are pci to ultra scsi i/o processors. the LSI53C875e is a minor modi?ation of the existing LSI53C875 product. it has all the functionality of the LSI53C875 with the addition of features to enable it to comply with the microsoft pc 97 hardware design guide. speci?ally, the LSI53C875e has a power management support enhancement. because there are only slight differences between them, the LSI53C875 and LSI53C875e are referred to as LSI53C875 throughout this technical manual. only the new enhancements are referred to as LSI53C875e. this technical manual assumes the user is familiar with the current and proposed standards for scsi and pci. for additional background information on these topics, please refer to the list of reference materials provided in the preface of this document. the LSI53C875 brings high-performance i/o solutions to host adapter, workstation, and general computer designs, making it easy to add scsi to any pci system. the LSI53C875 has a local memory bus for local storage of the device s bios rom in flash memory or standard eproms. most versions of the LSI53C875 support big and little endian byte addressing to accommodate a variety of data con?urations. the LSI53C875 supports programming of local flash memory for updates to bios or scripts programs. 1-2 general description the LSI53C875 is a pin-for-pin replacement for the lsi53c825 pci to scsi i/o processor, with added support for the scsi-3 ultra standard as well as other new features. some software enhancements are needed to take advantage of the features and ultra scsi transfer rates supported by the LSI53C875. the LSI53C875 performs ultra scsi transfers or fast 8- or 16- bit scsi transfers in single-ended (se) or differential mode, and improves performance by optimizing pci bus utilization. a system diagram showing the connections of the LSI53C875 with an external rom or flash memory is pictured in figure 1.1 . figure 1.1 LSI53C875 external memory interface pci bus scsi bus big_lit LSI53C875 gpio2_mas2/ mas1/ mwe/ moe/ mce/ mad[7:0] mas0/ gpio4 v pp translator v pp (optional) v pp hct374 hct374 hct374 rom or flash d[7:0] a[7:0] a[15:8] a[19:16] (optional) memory 1-3 a block diagram of the LSI53C875 is pictured in figure 1.2 . figure 1.2 LSI53C875 chip block diagram the LSI53C875 integrates a high-performance scsi core, a pci bus master dma core, and the lsi logic scsi scripts processor to meet the ?xibility requirements of scsi-3 and ultra scsi standards. it is designed to implement multithreaded i/o algorithms with a minimum of processor intervention, solving the protocol overhead problems of previous intelligent and nonintelligent adapter designs. the LSI53C875 is fully supported by the lsi logic storage device management system (sdms ), a software package that supports the advanced scsi protocol interface (aspi) and the ansi common access method (cam). sdms software provides bios and driver support for hard disk, tape, removable media products, and cd-rom under the major pc operating systems. pci master and slave control block data fifo 536 bytes memory control scsi scripts processor operating registers con?uration registers scripts ram scsi fifo and scsi control block local bus memory tolerant drivers and receivers scsi bus external memory pci 1-4 general description 1.1 package and feature options the LSI53C875 is available in three versions with different packaging and feature options. the LSI53C875 is packaged in a 160-pin plastic quad flat pack (pqfp). the LSI53C875j is identical to the LSI53C875 with additional pins that support jtag boundary scan testing. the jtag boundary scan signals replace the testin, mac/_testout, big_lit/, and sdirp1 pins. the LSI53C875n includes all of the signals in the LSI53C875, with the addition of the jtag pins and four additional signals for extended parity checking and generation. it is packaged in a 208-pin pqfp. the LSI53C875jb is identical to the LSI53C875j, but is packaged in a 169-pin ball grid array (bga). the LSI53C875e, LSI53C875je, and LSI53C875jbe have been upgraded to include the power management features. 1.2 bene?s of ultra scsi ultra scsi is an extension of the scsi-3 standard that expands the bandwidth of the scsi bus and allows faster synchronous scsi transfer rates. when enabled, ultra scsi performs 20 megatransfers during an i/o operation, resulting in approximately twice the synchronous transfer rates of fast scsi-2. the LSI53C875 can perform 8-bit, ultra scsi synchronous transfers as fast as 20 mbytes/s. this advantage is most noticeable in heavily loaded systems, or large block size requirements, such as video on-demand and image processing. an advantage of ultra scsi is that it signi?antly improves scsi bandwidth while preserving existing hardware and software investments. the LSI53C875 is compatible with all existing lsi53c825 and lsi53c825a software; the only changes required are to enable the chip to perform synchronous negotiations for ultra scsi rates. the LSI53C875 can use the same board socket as an lsi53c825, with the addition of an 80 mhz sclk or enabling the internal scsi clock doubler to provide the correct frequency when transferring synchronous scsi data at 50 nanosecond transfer rates. some changes to existing cabling or system designs may be needed to maintain signal integrity at ultra scsi synchronous transfer rates. these design issues are discussed in chapter 2, ?unctional description. tolerant technology 1-5 1.3 tolerant technology the LSI53C875 features tolerant technology, which includes active negation on the scsi drivers and input signal ?tering on the scsi receivers. active negation actively drives the scsi request, acknowledge, data, and parity signals high rather than allowing them to be passively pulled up by terminators. active negation is enabled by setting bit 7 in the scsi test three (stest3) register. tolerant receiver technology improves data integrity in unreliable cabling environments, where other devices would be subject to data corruption. tolerant receivers ?ter the scsi bus signals to eliminate unwanted transitions, without the long signal delay associated with rc-type input ?ters. this improved driver and receiver technology helps eliminate double clocking of data, the single biggest reliability issue with scsi operations. tolerant technology input signal ?tering is a built-in feature of the LSI53C875 and all lsi logic fast scsi devices. on the LSI53C875, the user may select a ?tering period of 30 or 60 ns, with bit 1 in the scsi test two (stest2) register. the bene?s of tolerant technology include increased immunity to noise when the signal is going high, better performance due to balanced duty cycles, and improved fast scsi transfer rates. in addition, tolerant scsi devices do not cause glitches on the scsi bus at power-up or power-down, so other devices on the bus are also protected from data corruption. tolerant technology is compatible with both the alternative one and alternative two termination schemes proposed by the american national standards institute. 1-6 general description 1.4 LSI53C875 bene?s summary the section provides an overview of the LSI53C875 features and bene?s. it contains information on scsi performance , pci performance , integration , ease of use , flexibility , reliability , and testability . 1.4.1 scsi performance to improve scsi performance, the LSI53C875: ? includes 4 kbyte internal ram for scripts instruction storage. ? performs wide, ultra scsi synchronous transfers as fast as 40 mbytes/s. ? increases scsi synchronous offset from 8 to 16 levels. ? supports variable block size and scatter/gather data transfers. ? performs sustained memory-to-memory dma transfers faster than 47 mbytes/s (@ 33 mhz). ? minimizes scsi i/o start latency. ? performs complex bus sequences without interrupts, including restore data pointers. ? reduces interrupt service routine overhead through a unique interrupt status reporting method. ? performs fast and wide scsi bus transfers in se and differential mode. 10 mbytes/s asynchronous (20 mbytes/s with ultra scsi). 20 mbytes/s synchronous (40 mbytes/s with ultra scsi). ? supports load and store scripts instructions to increase the performance of data transfers to and from chip registers. ? supports target disconnect and later reconnect with no interrupt to the system processor. ? supports multithreaded i/o algorithms in scsi scripts with fast i/o context switching. ? supports expanded register move instructions to support additional arithmetic capability. ? complies with pci bus power management speci?ation (LSI53C875e) revision 1.0. LSI53C875 bene?s summary 1-7 1.4.2 pci performance to improve pci performance, the LSI53C875: ? complies with pci 2.1 speci?ation. ? bursts 2, 4, 8, 16, 32, 64, or 128 dwords across pci bus. ? supports 32-bit word data bursts with variable burst lengths. ? prefetches up to 8 dwords of scripts instructions. ? bursts scripts opcode fetches across the pci bus. ? performs zero wait-state bus master data bursts faster than 110 mbytes/s (@ 33 mhz). ? supports pci cache line size register. ? supports pci write and invalidate, read line, and read multiple commands. 1.4.3 integration the following features ease integration of the LSI53C875 into a system: ? 3.3 v/5 v pci interface. ? full 32-bit pci dma bus master. ? memory move instructions allow use as a third-party pci bus dma controller. ? high-performance scsi core. ? integrated scripts processor. 1.4.4 ease of use the following features of the LSI53C875 make the device user friendly: ? up to 1 mbyte of add-in memory support for bios and scripts storage. ? direct pci to scsi connection. ? reduced scsi development effort. ? easily adapted to the advanced scsi protocol interface (aspi) or the ansi common access method (cam), with sdms software. 1-8 general description ? compiler-compatible with existing lsi53c7xx and lsi53c8xx family scripts. ? direct connection to pci, and scsi se and differential buses. ? development tools and sample scsi scripts available. ? maskable and pollable interrupts. ? wide scsi, a or p cable, and up to 16 devices are supported. ? three programmable scsi timers: select/reselect, handshake-to- handshake, and general purpose. the time-out period is programmable from 100 s to greater than 25.6 seconds. ? sdms software for complete pc-based operating system support. ? support for relative jumps. ? scsi selected as id bits for responding with multiple ids. 1.4.5 flexibility the following features increase the ?xibility of the LSI53C875: ? high level programming interface (scsi scripts). ? programs local memory and bus flash memory. ? big/little endian support. ? selectable 88 or 536 byte dma fifo for backward compatibility. ? tailored scsi sequences execute from main system ram or internal scripts ram. ? flexible programming interface to tune i/o performance or to adapt to unique scsi devices. ? support for changes in the logical i/o interface de?ition. ? low level access to all registers and all scsi bus signals. ? fetch, master, and memory access control pins. ? separate scsi and system clocks. ? scsi clock doubler bits enable ultra scsi transfer rates with a 40 mhz scsi clock. ? selectable irq pin disable bit. ? 32 additional scratch pad registers. ? ability to route system clock to scsi clock. LSI53C875 bene?s summary 1-9 1.4.6 reliability the following features enhance the reliability of the LSI53C875: ? 2 kv esd protection on scsi signals. ? typical 300 mv scsi bus hysteresis. ? protection against bus re?ctions due to impedance mismatches. ? controlled bus assertion times (reduces rfi, improves reliability, and eases fcc certi?ation). ? latch-up protection greater than 150 ma. ? voltage feed-through protection (minimum leakage current through scsi pads). ? a high proportion (> 25%) of pins are power and ground. ? power and ground isolation of i/o pads and internal chip logic. ? tolerant technology which provides: active negation of scsi data, parity, request, and acknowledge signals for improved fast scsi transfer rates. input signal ?tering on scsi receivers improves data integrity, even in noisy cabling environments. ? jtag boundary scan support (LSI53C875j, LSI53C875jb, LSI53C875n only). ? extended pci parity checking and generation (LSI53C875n only). ? extended scsi parity checking. 1.4.7 testability the following features enhance the testability of the LSI53C875: ? access to all scsi signals through programmed i/o. ? scsi loopback diagnostics. ? scsi bus signal continuity checking. ? support for single step mode operation. ? test mode (and tree) to check pin continuity to the board (most package options). ? jtag boundary scan support (LSI53C875j, LSI53C875jb, LSI53C875n only). 1-10 general description LSI53C875/875e pci to ultra scsi i/o processor 2-1 chapter 2 functional description chapter 2 is divided into the following sections: ? section 2.1, ?csi functional description ? section 2.2, ?esigning an ultra scsi system ? section 2.3, ?refetching scripts instructions ? section 2.4, ?xternal memory interface ? section 2.5, ?ci cache mode ? section 2.6, ?ower management 2.1 scsi functional description the LSI53C875 is composed of three functional blocks: the scsi core , the dma core , and the scripts processor . the LSI53C875 is fully supported by sdms software, a complete software package that supports the lsi logic product line of scsi processors and controllers. the pci bus power management support (LSI53C875e) is discussed section 2.6, ?ower management. 2.1.1 scsi core the scsi core supports the 8-bit or 16-bit data bus. it supports ultra scsi synchronous transfer rates up to 40 mbytes/s, scsi synchronous transfer rates up to 20 mbytes/s, and asynchronous transfer rates up to 10 mbytes/s on a 16-bit wide scsi bus. the scsi core can be programmed with scsi scripts, making it easy to ne tune the system for speci? mass storage devices or scsi-3 requirements. 2-2 functional description the scsi core offers low level register access or a high level control interface. like ?st generation scsi devices, the LSI53C875 scsi core can be accessed as a register oriented device. the ability to sample and/or assert any signal on the scsi bus can be used in error recovery and diagnostic procedures. in support of loopback diagnostics, the scsi core may perform a self-selection and operate as both an initiator and a target. the LSI53C875 scsi core is controlled by the integrated scripts processor through a high level logical interface. commands controlling the scsi core are fetched out of the main host memory or local memory. these commands instruct the scsi core to select, reselect, disconnect, wait for a disconnect, transfer information, change bus phases and, in general, implement all aspects of the scsi protocol. the scripts processor is a special high speed processor optimized for scsi protocol. 2.1.2 dma core the dma core is a bus master dma device that attaches directly to the industry standard pci bus. the dma core is tightly coupled to the scsi core through the scripts processor, which supports uninterrupted scatter/gather memory operations. the LSI53C875 supports 32-bit memory and automatically supports misaligned dma transfers. a 536-byte fifo allows the LSI53C875 to support 2, 4, 8, 16, 32, 64, or 128 longword bursts across the pci bus interface. 2.1.3 scripts processor the scsi scripts processor allows both dma and scsi commands to be fetched from host memory or internal scripts ram. algorithms written in scsi scripts control the actions of the scsi and dma cores and are executed from 32-bit system ram. the scripts processor executes complex scsi bus sequences independently of the host cpu. the scripts processor can begin a scsi i/o operation in approximately 500 ns. this compares with 2? ms required for traditional intelligent host adapters. algorithms may be designed to tune scsi bus performance, to adjust to new bus device types (such as scanners, communication gateways, etc.), or to incorporate changes in the scsi-2 scsi functional description 2-3 or scsi-3 logical bus de?itions without sacri?ing i/o performance. scsi scripts are hardware independent, so they can be used interchangeably on any host or cpu system bus. 2.1.4 internal scripts ram the LSI53C875 has 4 kbyte (1024 x 32 bits) of internal, general purpose ram. the ram is designed for scripts program storage, but is not limited to this type of information. when the chip fetches scripts instructions or table indirect information from the internal ram, these fetches remain internal to the chip and do not use the pci bus. other types of access to the ram by the LSI53C875 use the pci bus, as if they were external accesses. the mad5 pin enables the 4 kbyte internal ram. to disable the internal ram, connect a 4.7 k ? resistor between the mad5 pin and v ss . the ram can be relocated by the pci system bios anywhere in 32-bit address space. the ram base address register in pci con?uration space contains the base address of the internal ram. this register is similar to the rom base address register in pci con?uration space. to simplify loading of scripts instructions, the base address of the ram will appear in the scratch register b (scratchb) register when bit 3 of the chip test two (ctest2) register is set. the ram is byte accessible from the pci bus and is visible to any bus mastering device on the bus. external accesses to the ram (by the cpu) follow the same timing sequence as a standard slave register access, except that the target wait-states required drop from 5 to 3. a complete set of development tools is available for writing custom drivers with scsi scripts. for more information on the scsi scripts instructions supported by the LSI53C875, see chapter 6, ?nstruction set of the i/o processor. 2.1.5 sdms software: the total scsi solution for users who do not need to develop custom drivers, lsi logic provides a total scsi solution in pc environments with the sdms. sdms software provides bios driver support for hard disk, tape, and removable media peripherals for the major pc-based operating systems. 2-4 functional description sdms software includes a scsi bios to manage all scsi functions related to the device. it also provides a series of scsi device drivers that support most major operating systems. sdms software supports a multithreaded i/o application programming interface (api) for user developed scsi applications. sdms software supports both the aspi and cam scsi software speci?ations. 2.2 designing an ultra scsi system migrating an existing se scsi design from scsi-2 to ultra scsi requires minor software modi?ations as well as consideration for some hardware design guidelines. since ultra scsi is based on existing scsi standards, it can use existing software programs as long as the software is able to negotiate for ultra scsi synchronous transfer rates. in the area of hardware, the primary area of concern in se systems is to maintain signal integrity at high data transfer rates. to assure reliable operation at ultra scsi transfer speeds, follow the system design parameters recommended in the scsi-3 ultra parallel interface standard. chapter 7, ?nstruction set of the i/o processor, contains ultra scsi timing information. in addition to the guidelines in the draft standard, make the following software and hardware adjustments to accommodate ultra scsi transfers: ? set the ultra enable bit to enable ultra scsi transfers. ? set the tolerant enable bit, bit 7 in the scsi test three (stest3) register whenever the ultra enable bit is set. ? do not extend the sreq/sack ?tering period with scsi test two (stest2), bit 1. 2.2.1 using the scsi clock doubler the LSI53C875 can double the frequency of a 40?0 mhz scsi clock, allowing the system to perform ultra scsi transfers in systems that do not have 80 mhz clock input. this option is user selectable with bit settings in the scsi test one (stest1) , scsi test three (stest3) , and scsi control three (scntl3) registers. at power-on or reset, the doubler is disabled and powered down. follow these steps to use the clock doubler: prefetching scripts instructions 2-5 step 1. set the sclk doubler enable bit ( scsi test one (stest1) , bit 3). step 2. wait 20 s. step 3. halt the scsi clock by setting the halt scsi clock bit ( scsi test three (stest3), bit 5). step 4. set the clock conversion factor using the scf and ccf ?lds in the scsi control three (scntl3) register. step 5. set the sclk doubler select bit ( scsi test one (stest1) , bit 2). step 6. clear the halt scsi clock bit. 2.3 prefetching scripts instructions when enabled by setting the prefetch enable bit in the dma control (dcntl) register, the prefetch logic in the LSI53C875 fetches 8 dwords of instructions. the prefetch logic automatically determines the maximum burst size that it can perform, based on the burst length as determined by the values in the dma mode (dmode) register. if the unit cannot perform bursts of at least four dwords, it disables itself. while the LSI53C875 is prefetching scripts instructions, the pci cache line size register value does not have any effect and the read line, read multiple, and write and invalidate commands are not used. the LSI53C875 may ?sh the contents of the prefetch unit under certain conditions, listed below, to ensure that the chip always operates from the most current version of the software. when one of these conditions apply, the contents of the prefetch unit are automatically ?shed. ? on every memory move instruction. the memory move instruction is often used to place modi?d code directly into memory. to make sure that the chip executes all recent modi?ations, the prefetch unit ?shes its contents and loads the modi?d code every time an instruction is issued. to avoid inadvertently ?shing the prefetch unit contents, use the no flush option for all memory move operations that do not modify code within the next 8 dwords. for more information on this instruction, refer to chapter 6, ?nstruction set of the i/o processor. 2-6 functional description ? on every store instruction. the store instruction may also be used to place modi?d code directly into memory. to avoid inadvertently ?shing the prefetch unit contents use the no flush option for all store operations that do not modify code within the next 8 dwords. ? on every write to the dma scripts pointer (dsp) . ? on all transfer control instructions when the transfer conditions are met. this is necessary because the next instruction to execute is not the sequential next instruction in the prefetch unit. ? when the prefetch flush bit ( dma control (dcntl) , bit 6) is set. the unit ?shes whenever this bit is set. the bit is self-clearing. 2.3.1 opcode fetch burst capability setting the burst opcode fetch enable bit in the dma mode (dmode) register (0x38) causes the LSI53C875 to burst in the ?st two longwords of all instruction fetches. if the instruction is a memory-to-memory move, the third longword is accessed in a separate ownership. if the instruction is an indirect type, the additional longword is accessed in a subsequent bus ownership. if the instruction is a table indirect block move, the chip uses two accesses to obtain the four longwords required, in two bursts of two longwords each. note: this feature is only useful if prefetching is disabled. 2.4 external memory interface the LSI53C875 supports up to one megabyte of external memory in binary increments from 16 kbytes, to allow the use of expansion rom for add-in pci cards. the device also supports flash rom updates through the add-in interface and the gpio4 pin (used to control v pp , the power supply for programming external memory). this interface is designed for low speed operations such as downloading instruction code from rom. it is not intended for dynamic activities such as executing instructions. system requirements include the LSI53C875, two or three external 8-bit address holding registers (hct273 or hct374), and the appropriate memory device. the 4.7 k ? pull-down resistors on the mad bus require hc or hct external components to be used. if in-system flash rom external memory interface 2-7 updates are required, a 7406 (high voltage open collector inverter), an mtd4p05, and several passive components are also needed. the memory size and speed is determined by pull-down resistors on the 8-bit bidirectional memory bus at power-up. the LSI53C875 senses this bus shortly after the release of the reset signal and con?ures the rom base address register and the memory cycle state machines for the appropriate conditions. the external memory interface works with a variety of rom sizes and speeds. an example set of interface drawings is in appendix b, ?xternal memory interface diagram examples. the LSI53C875 supports a variety of sizes and speeds of expansion rom, using pull-down resistors on the mad[3:0] pins. the encoding of pins mad[3:1] allows the user to de?e how much external memory is available to the LSI53C875. table 2.1 shows the memory space associated with the possible values of mad[3:1]. the mad[3:1] pins are fully de?ed in chapter 4, ?ignal descriptions. to use one of the con?urations mentioned above in a host adapter board design, put 4.7 k ? pull-down resistors on the mad pins corresponding to the available memory space. for example, to connect to a 32 kbytes external rom, use pull-downs on mad[3] and mad[2]. if the external memory interface is not used, then no external resistors are table 2.1 external memory support mad[3:1] available memory space 000 16 kbytes 001 32 kbytes 010 64 kbytes 011 128 kbytes 100 256 kbytes 101 512 kbytes 110 1024 kbytes 111 no external memory present 2-8 functional description necessary since there are internal pull-ups on the mad bus. the internal pull-up resistors are disabled when external pull-down resistors are detected, to reduce current drain. the LSI53C875 allows the system to determine the size of the available external memory using the expansion rom base address register in pci con?uration space. for more information on how this works, refer to the pci speci?ation or the expansion rom base address register description in chapter 3, ?ci functional description. mad[0] is the slow rom pin. when pulled down, it enables two extra clock cycles of data access time to allow use of slower memory devices. the external memory interface also supports updates to flash memory. the 12 v power supply for flash memory, v pp , is enabled and disabled with the gpio4 pin and the gpio4 control bit. for more information on the gpio4 pin, refer to chapter 4, ?ignal descriptions. 2.5 pci cache mode the LSI53C875 supports the pci speci?ation for an 8-bit cache line size register located in pci con?uration space. the cache line size register provides the ability to sense and react to nonaligned addresses corresponding to cache line boundaries. in conjunction with the cache line size register, the pci commands read line, read multiple, and write and invalidate are each software enabled or disabled to allow the user full ?xibility in using these commands. for more information on pci cache mode operations, refer to chapter 3, ?ci functional description. 2.5.1 load/store instructions the LSI53C875 supports the load and store instruction type, which simpli?s the movement of data between memory and the internal chip registers. it also enables the chip to transfer bytes to addresses relative to the data structure address (dsa) register. for more information on the load and store instructions, refer to chapter 6, ?nstruction set of the i/o processor. pci cache mode 2-9 2.5.2 3.3 v/5 v pci interface the LSI53C875 can attach directly to a 3.3 v o ra5vpci interface, due to separate v dd pins for the pci bus drivers. this allows the devices to be used on the universal board recommended by the pci special interest group. 2.5.3 additional access to general purpose pins the LSI53C875 can access the gpio0 and gpio1 general purpose pins through register bits in the pci con?uration space, instead of using the general purpose pin control (gpcntl) register in the operating register space to control these pins. in the lsi logic sdms software, the con?uration bits control pins as the clock and data lines, respectively. to access the gpio[1:0] pins through the con?uration space, connect a 4.7 k ? resistor between the mad[7] pin and v ss . mad[7] contains an internal pull-up that is sensed shortly after chip reset. if the pin is sensed high, gpio[1:0] access is disabled; if it is low, gpio[1:0] access is enabled. additionally, if gpio[1:0] access has been enabled through the mad[7] pin and if gpio0 and/or gpio1 are sensed low after chip reset, gpio[1:0] access is disabled. if gpio[1:0] access through con?uration space is enabled, the gpio0 and gpio1 pins cannot be controlled from the general purpose pin control (gpcntl) and general purpose (gpreg) registers, but are observable from the general purpose (gpreg) register. when gpio[1:0] access is enabled, the serial interface control register at con?uration addresses 0x34?x35 controls the gpio0 and gpio1 pins. for more information on gpio[1:0] access, refer to the serial interface control register description in chapter 3, ?ci functional description. for more information on the gpio pins, see chapter 4, ?ignal descriptions. this does not apply to the LSI53C875e. note: the lsi logic sdms software controls the gpio0 and gpio1 pins using the general purpose pin control (gpcntl) and general purpose (gpreg) registers. therefore, if using sdms software, do not connect a 4.7 k ? resistor between mad[7] and vss. 2-10 functional description 2.5.4 jtag boundary scan testing the LSI53C875j/LSI53C875n/LSI53C875jb include support for jtag boundary scan testing in accordance with the ieee 1149.1 speci?ation with one exception, which is discussed in this section. the device accepts all required boundary scan instructions, including the optional clamp, high-z, and idcode instructions. the LSI53C875j/LSI53C875n/LSI53C875jb use an 8-bit instruction register to support all boundary scan instructions. the data registers included in the device are the boundary data register, the idcode register, and the bypass register. this device can handle a 10 mhz tck frequency for tdo and tdi. due to design constraints, the rst/ pin (system reset) always 3-states the scsi pins when it is asserted. boundary scan logic does not control this action, and this is not compliant with the speci?ation. there are two solutions that resolve this issue: 1. use the rst/ pin as a boundary scan compliance pin. when the pin is deasserted, the device is boundary scan compliant and when asserted, the device is noncompliant. to maintain compliance the rst/ pin must be driven high. 2. when rst/ is asserted during boundary scan testing the expected output on the scsi pins must be a high-z condition, and not what is contained in the boundary scan data registers for the scsi pin output cells. because of package limitations, the LSI53C875j/LSI53C875jb replaces the testin, mac/_testout, big_lit/, and sdirp1 signals with the jtag boundary scan signals. the LSI53C875n includes support for these signals in addition to the jtag pins. 2.5.5 big and little endian support the LSI53C875/LSI53C875n supports both big and little endian byte ordering through pin selection. the LSI53C875j/LSI53C875jb operate in little endian mode only (the big_lit pin is replaced by one of the jtag boundary scan signals). in big endian mode, the ?st byte of an aligned scsi to pci transfer is routed to lane three and succeeding transfers are routed to descending lanes. this mode of operation also applies to data transfers over the add-in rom interface. the byte of data accessed at pci cache mode 2-11 location 0x0000 from memory is routed to lane three, and the data at location 0x0003 is routed to byte lane 0. in little endian mode, the ?st byte of an aligned scsi to pci transfer is routed to lane zero and succeeding transfers are routed to ascending lanes. this mode of operation also applies to the add-in rom interface. the byte of data accessed at location 0x0000 from memory is routed to lane zero, and the data at location 0x0003 is routed to byte lane 3. the big_lit pin gives the LSI53C875 the ?xibility of operating with either big or little endian byte orientation. internally, in either mode, the actual byte lanes of the dma fifo and registers are not modi?d. the LSI53C875 supports slave accesses in big or little endian mode. when a dword is accessed, no repositioning of the individual bytes is necessary since dwords are addressed by the address of the least signi?ant byte. scripts always uses dwords in 32-bit systems, so compatibility is maintained between systems using different byte orientations. when less than a dword is accessed, individual bytes must be repositioned. internally, the LSI53C875 adjusts the byte control logic of the dma fifo and register decodes to access the appropriate byte lanes. the registers always appear on the same byte lane, but the address of the register is repositioned. big/little endian mode selection has the most effect on individual byte access. internally, the LSI53C875 adjusts the byte control logic of the dma fifo and register decodes to enable the appropriate byte lane. the registers always appear on the same byte lane, but the address of the register is repositioned. data to be transferred between system memory and the scsi bus always starts at address zero and continues through address ? there is no byte ordering in the chip. the ?st byte in from the scsi bus goes to address 0, the second to address 1, etc. going out onto the scsi bus, address zero is the ?st byte out on the scsi bus, address 1 is the second byte, etc. the only difference is that in a little endian system, address 0 is on byte lane 0, and in big endian mode address zero is on byte lane 3. correct scripts are generated if the scripts compiler is run on a system that has the same byte ordering as the target system. any scripts patching in memory must patch the instruction with the byte ordering that the scripts processor expects. 2-12 functional description software drivers for the LSI53C875 should access registers by their logical name (that is, scntl0) rather than by their address. the logical name should be equated to the register s big endian address in big endian mode (scntl0 = 0x03), and its little endian address in little endian mode (scntl0 = 0x00). this way, there is no change to the software when moving from one mode to the other; only the equate statement setting the operating modes needs to be changed. addressing of registers from within a scripts instruction is independent of bus mode. internally, the LSI53C875 always operates in little endian mode. 2.5.6 loopback mode the LSI53C875 loopback mode allows testing of both initiator and target functions and, in effect, lets the chip communicate with itself. when the loopback enable bit is set in the scsi test one (stest1) register, the LSI53C875 allows control of all scsi signals whether the chip is operating in initiator or target mode. for more information on this mode of operation refer to the scsi scripts processors programming guide . 2.5.7 parity options the LSI53C875 implements a exible parity scheme that allows control of the parity sense, allows parity checking to be turned on or off, and has the ability to deliberately send a byte with bad parity over the scsi bus to test parity error recovery procedures. table 2.2 de?es the bits that are involved in parity control and observation. table 2.3 describes the parity control function of the enable parity checking and assert scsi even parity bits in the scsi control zero (scntl0) register. table 2.4 describes the options available when a parity error occurs. the LSI53C875n has four additional parity pins for checking incoming data on the pci bus. these pins are assigned to each byte of the pci address/data bus, and work in addition to the par (pci parity) pin. in pci master read or slave write operations, each byte of incoming data on the pci bus is checked against its corresponding parity line, in addition to the normal parity checking against the pci par signal. in pci master write or slave read operations, parity is generated for each byte. this extra parity checking is always enabled for the LSI53C875n. the host system must support these pins. this feature is not register selectable. a parity error on any byte parity pin for pci master read or pci cache mode 2-13 slave write operations causes a fatal dma interrupt; scripts stops running. mask this interrupt with the ebpe interrupt enable bit, bit 1 in the dma interrupt enable (dien) register. these additional parity pins in no way affect the generation or checking of the pci speci?d parity line. table 2.2 bits used for parity control and generation bit name location description assert satn/ on parity errors scsi control zero (scntl0) , bit 1 when this bit is set, the LSI53C875 automatically asserts the satn/ signal upon detection of a parity error. satn/ is only asserted in initiator mode. enable parity checking scsi control zero (scntl0) , bit 3 enables the LSI53C875 to check for parity errors. the LSI53C875 checks for odd parity. this bit also checks for parity errors on the four additional parity pins on the LSI53C875n. assert even scsi parity scsi control one (scntl1) , bit 2 determines the scsi parity sense generated by the LSI53C875 to the scsi bus. disable halt on satn/ or a parity error (target mode only) scsi control one (scntl1) , bit 5 causes the LSI53C875 not to halt operations when a parity error is detected in target mode. enable parity error interrupt scsi interrupt enable zero (sien0) , bit 0 determines whether the LSI53C875 generates an interrupt when it detects a scsi parity error. parity error scsi interrupt status zero (sist0) , bit 0 this status bit is set whenever the LSI53C875 has detected a parity error on the scsi bus. status of scsi parity signal scsi status zero (sstat0) , bit 0 this status bit represents the active high current state of the scsi sdp0 parity signal. scsi sdp1 signal scsi status two (sstat2) , bit 0 this bit represents the active high current state of the scsi sdp1 parity signal. latched scsi parity scsi status two (sstat2) , bit 3 and scsi status one (sstat1) , bit 3 these bits re?ct the scsi odd parity signal corresponding to the data latched into the scsi input data latch (sidl) register. master parity error enable chip test four (ctest4) , bit 3 enables parity checking during master data phases. 2-14 functional description master data parity error dma status (dstat) , bit 6 set when the LSI53C875 as a master detects that a target device has signaled a parity error during a data phase. master data parity error interrupt enable dma interrupt enable (dien) , bit 6 by clearing this bit, a master data parity error will not cause irq/ to be asserted, but the status bit will be set in the dma status (dstat) register. extended byte parity error interrupt enable (LSI53C875n only) dma interrupt enable (dien) , bit 1 by clearing this bit, an extended byte parity error will not cause irq/ to be asserted, but the status bit will be set in the dma status (dstat) register. table 2.3 scsi parity control epc aesp description 0 0 does not check for parity errors. parity is generated when sending scsi data. asserts odd parity when sending scsi data. 0 1 does not check for parity errors. parity is generated when sending scsi data. asserts even parity when sending scsi data. 1 0 checks for odd parity on scsi data received. parity is generated when sending scsi data. asserts odd parity when sending scsi data. 1 1 checks for odd parity on scsi data received. parity is generated when sending scsi data. asserts even parity when sending scsi data. 1. key: epc = enable parity checking (bit 3, scsi control zero (scntl0) ). asep = assert scsi even parity (bit 2, scsi control one (scntl1) ). 2. this table only applies when the enable parity checking bit is set. table 2.2 bits used for parity control and generation (cont.) bit name location description pci cache mode 2-15 2.5.8 dma fifo the dma fifo is 4 bytes wide by 134 transfers deep. the dma fifo is illustrated in figure 2.1 . to assure compatibility with older products in the lsi53c8xx family, the dma fifo size may be set to 88 bytes by setting the dma fifo size bit, bit 5 in the chip test five (ctest5) register. figure 2.1 dma fifo sections table 2.4 scsi parity errors and interrupts dph par description 0 0 halts when a parity error occurs in target or initiator mode and does not generate an interrupt. 0 1 halts when a parity error occurs in target mode and generates an interrupt in the target or initiator mode. 1 0 does not halt in target mode when a parity error occurs until the end of the transfer. an interrupt is not generated. 1 1 does not halt in target mode when a parity error occurs until the end of the transfer. an interrupt is generated. key: dhp = disable halt on satn/ or parity error (bit 5, scsi control one (scntl1) . par = parity error (bit 0, scsi interrupt enable one (sien1) . 134 transfers deep . . . . . . 32 bytes wide 8 bits byte lane 3 8 bits byte lane 2 8 bits byte lane 1 8 bits byte lane 0 2-16 functional description 2.5.8.1 data paths the data path through the LSI53C875 is dependent on whether data is being moved into or out of the chip, and whether scsi data is being transferred asynchronously or synchronously. figure 2.2 shows how data is moved to/from the scsi bus in each of the different modes. figure 2.2 LSI53C875 host interface data paths pci interface pci interface pci interface pci interface dma fifo (32 bits x 16) dma fifo (32 bits x 16) dma fifo (32 bits x 16) dma fifo (32 bits x 16) sodl register sidl register sodl register scsi fifo (8 or 16 bits x 16) scsi interface scsi interface sodr register scsi interface scsi interface asynchronous scsi send asynchronous scsi receive synchronous scsi send synchronous scsi receive swide register swide register pci cache mode 2-17 the following steps determine if any bytes remain in the data path when the chip halts an operation: asynchronous scsi send step 1. if the dma fifo size is set to 88 bytes, look at the dma fifo (dfifo) and dma byte counter (dbc) registers and calculate if there are bytes left in the dma fifo. to make this calculation, subtract the seven least signi?ant bits of the dbc register from the 7-bit value of the dfifo register. and the result with 0x7f for a byte count between 0 and 88. if the dma fifo size is set to 536 bytes (bit 5 of the chip test five (ctest5) register), subtract the 10 least signi?ant bits of the dma byte counter (dbc) register from the 10-bit value of the dma fifo byte offset counter, which consists of bits [1:0] in the chip test five (ctest5) register and bits [7:0] of the dma fifo (dfifo) register. and the result with 0x3ff for a byte count between 0 and 536. step 2. read bit 5 in the scsi status zero (sstat0) and scsi status two (sstat2) registers to determine if any bytes are left in the scsi output data latch (sodl) register. if bit 5 is set in the sstat0 or sstat2 register, then the least signi?ant byte or the most signi?ant byte in the sodl register is full, respectively. checking this bit also reveals bytes left in the sodl register from a chained move operation with an odd byte count. synchronous scsi send step 1. if the dma fifo size is set to 88 bytes, look at the dma fifo (dfifo) and dma byte counter (dbc) registers and calculate if there are bytes left in the dma fifo. to make this calculation, subtract the seven least signi?ant bits of the dbc register from the 7-bit value of the dfifo register. and the result with 0x7f for a byte count between 0 and 88. if the dma fifo size is set to 536 bytes (bit 5 of the chip test five (ctest5) register), subtract the 10 least signi?ant bits of the dma byte counter (dbc) register from the 10-bit value of 2-18 functional description the dma fifo byte offset counter, which consists of bits [1:0] in the ctest5 register and bits [7:0] of the dma fifo register. and the result with 0x3ff for a byte count between 0 and 536. step 2. read bit 5 in the scsi status zero (sstat0) and scsi status two (sstat2) registers to determine if any bytes are left in the scsi output data latch (sodl) register. if bit 5 is set in the sstat0 or sstat2 register, then the least signi?ant byte or the most signi?ant byte in the sodl register is full, respectively. checking this bit also reveals bytes left in the sodl register from a chained move operation with an odd byte count. step 3. read bit 6 in the scsi status zero (sstat0) and scsi status two (sstat2) registers to determine if any bytes are left in the sodr register. if bit 6 is set in the sstat0 or sstat2 register, then the least signi?ant byte or the most signi?ant byte in the sodr register is full, respectively. asynchronous scsi receive step 1. if the dma fifo size is set to 88 bytes, look at the dma fifo (dfifo) and dma byte counter (dbc) registers and calculate if there are bytes left in the dma fifo. to make this calculation, subtract the seven least signi?ant bits of the dbc register from the 7-bit value of the dfifo register. and the result with 0x7f for a byte count between 0 and 88. if the dma fifo size is set to 536 bytes (using bit 5 of the chip test five (ctest5) register), subtract the 10 least signi?ant bits of the dma byte counter (dbc) register from the 10-bit value of the dma fifo byte offset counter, which consists of bits [1:0] in the ctest5 register and bits [7:0] of the dma fifo register. and the result with 0x3ff for a byte count between 0 and 536. step 2. read bit 7 in the scsi status zero (sstat0) and scsi status two (sstat2) register to determine if any bytes are left in the scsi input data latch (sidl) register. if bit 7 is set in the sstat0 or sstat2, then the least signi?ant byte or the most signi?ant byte is full, respectively. pci cache mode 2-19 step 3. if any wide transfers have been performed using the chained move instruction, read the wide scsi receive bit ( scsi control two (scntl2) , bit 0) to determine whether a byte is left in the scsi wide residue (swide) register. synchronous scsi receive step 1. if the dma fifo size is set to 88 bytes, subtract the seven least signi?ant bits of the dma byte counter (dbc) register from the 7-bit value of the dma fifo (dfifo) register. and the result with 0x7f for a byte count between 0 and 88. if the dma fifo size is set to 536 bytes (using bit 5 of the chip test five (ctest5) register), subtract the 10 least signi?ant bits of the dma byte counter (dbc) register from the 10-bit value of the dma fifo byte offset counter, which consists of bits [1:0] in the ctest5 register and bits [7:0] of the dma fifo register. and the result with 0x3ff for a byte count between 0 and 536. step 2. read bits [7:4] of the scsi status one (sstat1) register and bit 4 of the scsi status two (sstat2) register, the binary representation of the number of valid bytes in the scsi fifo, to determine if any bytes are left in the scsi fifo. step 3. if any wide transfers have been performed using the chained move instruction, read the wide scsi receive bit ( scsi control two (scntl2) , bit 0) to determine whether a byte is left in the scsi wide residue (swide) register. 2.5.9 scsi bus interface the LSI53C875 supports both se and differential operation. all scsi signals are active low. the LSI53C875 contains the se output drivers and can be connected directly to the scsi bus. each output is isolated from the power supply to ensure that a powered down LSI53C875 has no effect on an active scsi bus (cmos ?oltage feed-through phenomena). tolerant technology provides signal ?tering at the inputs of sreq/ and sack/ to increase immunity to signal re?ctions. 2-20 functional description 2.5.9.1 differential mode in differential mode, the sdir[15:0], sdirp[1:0], igs, tgs, rstdir, bsydir, and seldir signals control the direction of external differential pair transceivers. the LSI53C875 is placed in differential mode by setting the dif bit, bit 5 of the scsi test two (stest2) register (0x4e). setting this bit 3-states the bsy/, sel/, and rst/ pads so they can be used as pure input pins. in addition to the standard scsi lines, the following signals de?ed in table 2.5 are used during differential operation by the LSI53C875: see figure 2.3 for an example differential wiring diagram, in which the LSI53C875 is connected to the texas instruments sn75976a differential transceiver. the recommended value of the pull-up resistor on the req/, ack/, msg/, c/d/, i/o/, atn/, sd[7:0]/, and sdp0/ lines is 680 ? when the active negation portion of tolerant technology is not enabled. when active negation is enabled, the recommended resistor value on the req/, ack/, sd[7:0]/, and sdp0/ signals is 1.5 k ? . the electrical characteristics of these pins change when active negation is enabled, permitting a higher resistor value. table 2.5 differential mode signal function bsydir, seldir, rstdir active high signals used to enable the differential drivers as outputs for scsi signals bsy/, sel/, and rst/, respectively. sdir[15:0], sdirp[1:0] active high signals used to control direction of the differential drivers for scsi data and parity lines, respectively. igs active high signal used to control direction of the differential driver for initiator group signals atn/ and ack/. tgs active high signal used to control direction of the differential drivers for target group signals msg/, c/d/, i/o/, and req/. diffsens input to the LSI53C875 used to detect the presence of a se device on a differential system. if a logical zero is detected on this pin, then it is assumed that an se device is on the bus and all scsi outputs will be 3-stated to avoid damage to the transceiver. pci cache mode 2-21 to interface the LSI53C875 to the sn75976a, connect the dir pins, as well as igs and tgs, of the LSI53C875 directly to the transceiver enables (nde/re/). these signals control the direction of the channels on the sn75976a. the scsi bidirectional control and data pins (sd[7:0]/, sdp0/, req/, ack/, msg/, i_o/, c_d/, and atn/) of the LSI53C875 connect to the bidirectional data pins (na) of the sn75976a with a pull-up resistor. the pull-up value should be no lower than the transceiver i ol can tolerate, but not so high as to cause rc timing problems. the three remaining pins, sel/, bsy/, and rst/ are connected to the sn75976a with a pull-down resistor. the pull-down resistors are required when the pins (na) of the sn75976a are con?ured as inputs. when the data pins are inputs, the resistors provide a bias voltage to both the LSI53C875 pins (sel/, bsy/, and rst/) and the sn75976a data pins. because the sel/, bsy/, and rst/ pins on the LSI53C875 are inputs only, this con?uration allows for the sel/, bsy/, and rst/ scsi signals to be asserted on the scsi bus. the differential pairs on the scsi bus are reversed when connected to the sn75976a, due to the active low nature of the scsi bus. note: the sn75976a differential transceiver must be used to achieve ultra scsi transfer rates. 8-bit/16-bit scsi and the differential interface in an 8-bit scsi bus, the sd[15:8] pins on the LSI53C875 should be pulled up with a 1.5 k ? resistor or terminated like the rest of the scsi bus lines. this is very important, as errors may occur during reselection if these lines are left ?ating. in the LSI53C875j and LSI53C875jb, the sdirp1 pin is replaced by the tck jtag signal. if the device is used in a wide differential system, use the sdirp0 pin to control the direction of the differential transceiver for both the sp0 and sp1 signals. the sdirp0 signal is capable of driving both direction inputs from a transceiver. 2-22 functional description figure 2.3 differential wiring diagram lsi53c8xx seldir bsydir rstdir sel/ bsy/ rst/ req/ ack/ msg/ c/d/ i/o/ atn/ tgs igs sd[8:15]/ sdp1/ sdirp0 sdir7 sdir6 sdir5 sdir4 sdir3 sdir2 sdir1 sdir0 sdp0/ sd7/ sd6/ sd5/ sd4/ sd3/ sd2/ sd1/ sd0/ diffsens 1.5 k 1.5 k ? vdd vdd 1.5 k ? 1.5 k ? vdd 1.5 k ? vdd vdd 1.5 k ? sn75976a cde0 cde1 cde2 bsr cre 1a 1de/re 2a 2de/re 4a 4de/re 5a 5de/re 6a 6de/re 7a 7de/re 8a 8de/re 9a 9de/re 3a 3de/re sel/ seldir bsydir rstdir req/ bsy/ rst/ ack/ msg/ c_d/ i_o/ atn/ vdd 1.5 k ? diffsens schottky diode diffsens (pin 21) ? sel scsi bus +sel ? bsy +bsy ? rst (42) +rst ? req +req ? ack +ack ? msg +msg ? c/d +c/d ? i/o +i/o ? at n +atn 1b+ 1b ? 2b+ 2b ? 3b+ 3b ? 4b+ 4b ? 5b+ 5b ? 6b+ 6b ? 7b+ 7b ? 8b+ 8b ? 9b+ 9b ? (41) (34) (33) (38) (37) (46) (45) (36) (35) (40) (39) (44) (43) (48) (47) (30) (29) sn75976a cde0 cde1 cde2 bsr cre 1a 1de/re 2a 2de/re 4a 4de/re 5a 5de/re 6a 6de/re 7a 7de/re 8a 8de/re 9a 9de/re 3a 3de/re ? db0 +db0 ? db1 +db1 ? db2 (4) +db2 ? db3 +db3 ? db4 +db4 ? db5 +db5 ? db6 +db6 ? db7 +db7 ? dbp +dbp 1b+ 1b ? 2b+ 2b ? 3b+ 3b ? 4b+ 4b ? 5b+ 5b ? 6b+ 6b ? 7b+ 7b ? 8b+ 8b ? 9b+ 9b ? (3) (6) (5) (8) (7) (10) (9) (12) (11) (14) (13) (16) (15) (18) (17) (20) (19) diffsens diffsens sdir0 sdir1 sdir2 sdir3 sdir4 sdir5 sdir6 sdir7 sdirp0 sd0 / sd1 / sd2/ sd3/ sd4 / sd5 / sd6/ sd7/ sdp0/ 1.5 k pci cache mode 2-23 2.5.9.2 terminator networks the terminator networks provide the biasing needed to pull signals to an inactive voltage level, and to match the impedance seen at the end of the cable with the characteristic impedance of the cable. terminators must be installed at the extreme ends of the scsi chain, and only at the ends. no system should ever have more or less than two terminators installed and active. scsi host adapters should provide a means of accommodating terminators. there should be a means of disabling termination. se cables can use a 220 ? pull-up to the terminator power supply (term power) line and a 330 ? pull-down to ground. because of the high-performance nature of the LSI53C875, regulated (or active) termination is recommended. figure 2.4 shows a unitrode active terminator. for additional information, refer to the scsi-2 speci?ation. tolerant technology active negation can be used with either termination network. note: if the LSI53C875 is to be used in a design with only an 8-bit scsi bus, all 16 data lines still must be terminated or pulled high. active termination is required for ultra scsi synchronous transfers. 2-24 functional description figure 2.4 regulated termination terml1 terml2 terml3 terml4 terml5 terml6 terml7 terml8 terml9 terml10 terml11 terml12 terml13 terml14 terml15 terml16 terml17 terml18 sd0 (j1.40) sd1 (j1.41) sd2 (j1.42) sd3 (j1.43) sd4 (j1.44) sd5 (j1.45) sd6 (j1.46) sd7 (j1.47) sdp (j1.48) atn (j1.55) bsy (j1.57) ack (j1.58) rst (j1.59) msg (j1.60) sel (j1.61) c/d (j1.62) req (j1.63) i/o (j1.64) 20 21 22 23 24 25 26 27 28 3 4 5 6 7 8 9 10 11 19 disconnect reg_out 2 2.85 v uc5601qp c1 c2 notes: ? c1 - 10 f smt ? c2 - 0.1 f smt ? c3 - 2.2 f smt ? j1 - 68-pin, high density ? connector terml1 terml2 terml3 terml4 terml5 terml6 terml7 terml8 terml9 sd15 (j1.38) sd14 (j1.37) sd13 (j1.36) sd12 (j1.35) sd11 (j1.68) sd10 (j1.67) sd9 (j1.66) sd8 (j1.65) sdp1 (j1.39) 10 9 8 7 3 2 1 16 15 reg_out 14 uc5603dp c3 6 disconnect pci cache mode 2-25 2.5.10 select/reselect during selection/reselection in multithreaded scsi i/o environments, it is not uncommon to be selected or reselected while trying to perform selection/reselection. this situation may occur when a scsi controller (operating in the initiator mode) tries to select a target and is reselected by another. the select scripts instruction has an alternate address to which the scripts will jump when this situation occurs. the analogous situation for target devices is being selected while trying to perform a reselection. once a change in operating mode occurs, the initiator scripts should start with a set initiator instruction or the target scripts should start with a set target instruction. the selection and reselection enable bits ( scsi chip id (scid) bits 5 and 6, respectively) should both be asserted so that the LSI53C875 may respond as an initiator or as a target. if only selection is enabled, the LSI53C875 cannot be reselected as an initiator. there are also status and interrupt bits in the scsi interrupt status zero (sist0) and scsi interrupt enable zero (sien0) registers, respectively, indicating that the LSI53C875 has been selected (bit 5) and reselected (bit 4). 2.5.11 synchronous operation the LSI53C875 can transfer synchronous scsi data in both the initiator and target modes. the scsi transfer (sxfer) register controls both the synchronous offset and the transfer period. it may be loaded by the cpu before scripts execution begins, from within scripts using a table indirect i/o instruction, or with a read-modify-write instruction. the LSI53C875 can receive data from the scsi bus at a synchronous transfer period as short as 50 ns, regardless of the transfer period used to send data. the LSI53C875 can receive data at one-fourth of the divided sclk frequency. depending on the sclk frequency, the negotiated transfer period, and the synchronous clock divider, the LSI53C875 can send synchronous data at intervals as short as 50 ns for ultra scsi, 100 ns for fast scsi, and 200 ns for scsi-1. 2-26 functional description 2.5.11.1 determining the data transfer rate synchronous data transfer rates are controlled by bits in two different registers of the LSI53C875. following is a brief description of the bits. figure 2.5 illustrates the clock division factors used in each register, and the role of the register bits in determining the transfer rate. figure 2.5 determining the synchronous transfer rate 2.5.11.2 scsi control three (scntl3) register, bits [6:4] (scf[2:0]) the scf[2:0] bits select the factor by which the frequency of sclk is divided before being presented to the synchronous scsi control logic. the output from this divider controls the rate at which data can be received; this rate must not exceed 80 mhz. the receive rate of synchronous scsi data is one-fourth of the scf divider output. for sclk scf divider ccf divider synchronous divider asynchronous scsi logic divide by 4 scf2 scf1 scf0 scf divisor 0011 0 1 0 1.5 0112 1003 0003 1014 tp2 tp1 tp0 xferp divisor 0004 0015 0106 0117 1008 1019 11010 11111 ccf2 ccf1 ccf0 divisor 0011 0 1 0 1.5 0112 1003 0003 1014 example (8-bit scsi bus): sclk = 80 mhz, scf = 1 ( 1) , xferp = 4 ( 4), ccf = 5 ( 4) this point must not exceed 80 mhz receive clock send clock (to scsi bus) this point must not exceed 25 mhz = (80 1) 4 = 20 mbytes/s scsi receive rate = (sclk scf) 4 = (80 1) 4 = 20 mbytes/s clock doubler scsi send rate = (sclk scf) xferp pci cache mode 2-27 example, if sclk is 80 mhz and the scf value is set to divide by two, then the maximum rate at which data can be received is 10 mhz (80/(2*4) = 10). 2.5.11.3 scsi control three (scntl3) register, bits [2:0] (ccf[2:0]) the ccf[2:0] bits select the factor by which the frequency of sclk is divided before being presented to the asynchronous scsi core logic. this divider must be set according to the input clock frequency in the table. 2.5.11.4 scsi transfer (sxfer) register, bits [7:5] (tp[2:0]) the tp[2:0] divider bits determine the scsi synchronous transfer period when sending synchronous scsi data in either initiator or target mode. this value further divides the output from the scf divider. 2.5.11.5 achieving optimal scsi send rates to achieve optimal synchronous scsi send timings, the scf divisor value should be set high, to divide the clock as much as possible before presenting the clock to the tp divider bits in the scsi transfer (sxfer) register. the tp[2:0] divider value should be as low as possible. for example, with an 80 mhz clock to achieve a 20 mbytes/s ultra scsi send rate, the scf bits can be set to divide by 1 (001) and the tp bits to divide by 4 (000). to set for a 10 mbytes/s send rate for fast scsi- 2, the scf bits can be set to divide by 2 (011) and the tp bits set to divide by 4 (000). 2.5.12 ultra scsi synchronous data transfers ultra scsi is an extension of current fast scsi-2 synchronous transfer speci?ations. it allows synchronous transfer periods to be negotiated down as low as 50 ns, which is half the 100 ns period allowed under fast scsi-2. this will allow a maximum transfer rate of 40 mbytes/s on a 16-bit scsi bus. the LSI53C875 requires an 80 mhz scsi clock input to perform ultra scsi transfers. in addition, the following bit values affect the chip s ability to support ultra scsi synchronous transfer rates: ? clock conversion factor bits, scsi control three (scntl3) register bits [2:0] and synchronous clock conversion factor bits, scsi control three (scntl3) register bits [6:4]. these ?lds now support 2-28 functional description a value of 101 (binary), allowing the sclk frequency to be divided down by 4. this allows systems using an 80 mhz clock or the internal clock doubler to operate at fast scsi-2 transfer rates as well as ultra scsi rates, if needed. ? ultra mode enable bit, scsi control three (scntl3) register bit 7. setting this bit enables ultra scsi synchronous transfers in systems that have an 80 mhz clock or use the internal scsi clock doubler. 2.5.13 interrupt handling the scripts processors in the LSI53C875 perform most functions independently of the host microprocessor. however, certain interrupt situations must be handled by the external microprocessor. this section explains all aspects of interrupts as they apply to the LSI53C875. 2.5.13.1 polling and hardware interrupts the external microprocessor is informed of an interrupt condition by polling or hardware interrupts. polling means that the microprocessor must continually loop and read a register until it detects a bit set that indicates an interrupt. this method is the fastest, but it wastes cpu time that could be used for other system tasks. the preferred method of detecting interrupts in most systems is hardware interrupts. in this case, the LSI53C875 asserts the interrupt request (irq/) line that interrupts the microprocessor, causing the microprocessor to execute an interrupt service routine. a hybrid approach would use hardware interrupts for long waits, and use polling for short waits. 2.5.13.2 registers the registers in the LSI53C875 that are used for detecting or de?ing interrupts are the interrupt status (istat) , scsi interrupt status zero (sist0) , scsi interrupt status one (sist1) , dma status (dstat) , scsi interrupt enable zero (sien0) , scsi interrupt enable one (sien1) , dma control (dcntl) , and dma interrupt enable (dien) . istat the istat register is the only register that can be accessed as a slave during scripts operation. therefore it is the register that is polled when polled interrupts are used. it is also the ?st register that should be read when the irq/ pin has been asserted in association with pci cache mode 2-29 a hardware interrupt. the intf (interrupt-on-the-fly) bit should be the ?st interrupt serviced. it must be written to one to be cleared. this interrupt must be cleared before servicing any other interrupts. if the sip bit in the interrupt status (istat) register is set, then a scsi-type interrupt has occurred and the scsi interrupt status zero (sist0) and scsi interrupt status one (sist1) registers should be read. if the dip bit in the interrupt status (istat) register is set, then a dma-type interrupt has occurred and the dma status (dstat) register should be read. scsi-type and dma-type interrupts may occur simultaneously, so in some cases both sip and dip may be set. sist0 and sist1 the scsi interrupt status zero (sist0) and scsi interrupt status one (sist1) registers contain the scsi-type interrupt bits. reading these registers determines which condition or conditions caused the scsi-type interrupt, and clears that scsi interrupt condition. if the LSI53C875 is receiving data from the scsi bus and a fatal interrupt condition occurs, the chip attempts to send the contents of the dma fifo to memory before generating the interrupt. if the LSI53C875 is sending data to the scsi bus and a fatal scsi interrupt condition occurs, data could be left in the dma fifo. because of this, the dma fifo empty (dfe) bit in dma status (dstat) should be checked. if this bit is cleared, set the clf (clear dma fifo) and csf (clear scsi fifo) bits before continuing. the clf bit is bit 2 in chip test three (ctest3) . the csf bit is bit 1 in scsi test three (stest3) . dstat the dma status (dstat) register contains the dma-type interrupt bits. reading this register determines which condition or conditions caused the dma-type interrupt, and clears that dma interrupt condition. bit 7 in dstat, dfe, is purely a status bit; it will not generate an interrupt under any circumstances and will not be cleared when read. dma interrupts ?sh neither the dma nor scsi fifos before generating the interrupt, so the dfe bit in the dma status (dstat) register should be checked after any dma interrupt. 2-30 functional description if the dfe bit is cleared, then the fifos must be cleared by setting the clf (clear dma fifo) and csf (clear scsi fifo) bits, or ?shed by setting the flf (flush dma fifo) bit. sien0 and sien1 the scsi interrupt enable zero (sien0) and scsi interrupt enable one (sien1) registers are the interrupt enable registers for the scsi interrupts in scsi interrupt status zero (sist0) and scsi interrupt status one (sist1) . dien the dma interrupt enable (dien) register is the interrupt enable register for dma interrupts in dma status (dstat) . dcntl when bit 1 in this register is set, the irq/ pin is not asserted when an interrupt condition occurs. the interrupt is not lost or ignored, but merely masked at the pin. clearing this bit when an interrupt is pending immediately causes the irq/ pin to assert. as with any register other than istat, this register cannot be accessed except by a scripts instruction during scripts execution. 2.5.13.3 fatal vs. nonfatal interrupts a fatal interrupt, as the name implies, always causes scripts to stop running. all nonfatal interrupts become fatal when they are enabled by setting the appropriate interrupt enable bit. interrupt masking is discussed section 2.5.13.4, ?asking. all dma interrupts (indicated by the dip bit in istat and one or more bits in dma status (dstat) being set) are fatal. some scsi interrupts (indicated by the sip bit in the istat and one or more bits in scsi interrupt status zero (sist0) or scsi interrupt status one (sist1) being set) are nonfatal. when the LSI53C875 is operating in initiator mode, only the function complete (cmp), selected (sel), reselected (rsl), general purpose timer expired (gen), and handshake-to-handshake timer expired (hth) interrupts are nonfatal. when operating in target mode cmp, sel, rsl, target mode: satn/ active (m/a), gen, and hth are nonfatal. refer to the description for the disable halt on a parity error or satn/ active (target mode only) (dhp) bit in the scsi control one (scntl1) register to con?ure the chip s pci cache mode 2-31 behavior when the satn/ interrupt is enabled during target mode operation. the interrupt-on-the-fly interrupt is also nonfatal, since scripts can continue when it occurs. the reason for nonfatal interrupts is to prevent scripts from stopping when an interrupt occurs that does not require service from the cpu. this prevents an interrupt when arbitration is complete (cmp set), when the LSI53C875 has been selected or reselected (sel or rsl set), when the initiator asserts atn (target mode: satn/ active), or when the general purpose or handshake-to-handshake timers expire. these interrupts are not needed for events that occur during high-level scripts operation. 2.5.13.4 masking masking an interrupt means disabling or ignoring that interrupt. interrupts can be masked by clearing bits in the scsi interrupt enable zero (sien0) and scsi interrupt enable one (sien1) (for scsi interrupts) registers or dma interrupt enable (dien) (for dma interrupts) register. how the chip responds to masked interrupts depends on: whether polling or hardware interrupts are being used; whether the interrupt is fatal or nonfatal; and whether the chip is operating in initiator or target mode. if a nonfatal interrupt is masked and that condition occurs, the scripts do not stop, the appropriate bit in the scsi interrupt status zero (sist0) or scsi interrupt status one (sist1) is still set, the sip bit in the interrupt status (istat) is not set, and the irq/ pin is not asserted. see section 2.5.13.3, ?atal vs. nonfatal interrupts, for a list of the nonfatal interrupts. if a fatal interrupt is masked and that condition occurs, then the scripts still stop, the appropriate bit in the dma status (dstat) , scsi interrupt status zero (sist0) ,or scsi interrupt status one (sist1) register is set, and the sip or dip bits in the interrupt status (istat) is set, but the irq/ pin is not asserted. when the chip is initialized, enable all fatal interrupts if you are using hardware interrupts. if a fatal interrupt is disabled and that interrupt condition occurs, scripts halts and the system will never know it unless it times out and checks the istat after a certain period of inactivity. 2-32 functional description if you are polling the istat instead of using hardware interrupts, then masking a fatal interrupt makes no difference since the sip and dip bits in the interrupt status (istat) inform the system of interrupts, not the irq/ pin. masking an interrupt after irq/ is asserted does not cause irq/ to be deasserted. 2.5.13.5 stacked interrupts the LSI53C875 will stack interrupts if they occur one after the other. if the sip or dip bits in the istat register are set (?st level), then there is already at least one pending interrupt, and any future interrupts are stacked in extra registers behind the scsi interrupt status zero (sist0) , scsi interrupt status one (sist1) , and dma status (dstat) registers (second level). when two interrupts have occurred and the two levels of the stack are full, any further interrupts set additional bits in the extra registers behind scsi interrupt status zero (sist0) , scsi interrupt status one (sist1) , and dma status (dstat) . when the ?st level of interrupts are cleared, all the interrupts that came in afterward move into the sist0, sist1, and dstat. after the ?st interrupt is cleared by reading the appropriate register, the irq/ pin is deasserted for a minimum of three clks; the stacked interrupts move into the scsi interrupt status zero (sist0) , scsi interrupt status one (sist1) ,or dma status (dstat) ; and the irq/ pin is asserted once again. since a masked nonfatal interrupt does not set the sip or dip bits, interrupt stacking does not occur. a masked, nonfatal interrupt still posts the interrupt in sist0, but does not assert the irq/ pin. since no interrupt is generated, future interrupts move right into the scsi interrupt status zero (sist0) or scsi interrupt status one (sist1) instead of being stacked behind another interrupt. when another condition occurs that generates an interrupt, the bit corresponding to the earlier masked nonfatal interrupt is still set. a related situation to interrupt stacking is when two interrupts occur simultaneously. since stacking does not occur until the sip or dip bits are set, there is a small timing window in which multiple interrupts can occur but will not be stacked. these could be multiple scsi interrupts (sip set), multiple dma interrupts (dip set), or multiple scsi and multiple dma interrupts (both sip and dip set). pci cache mode 2-33 as previously mentioned, dma interrupts do not attempt to ?sh the fifos before generating the interrupt. it is important to set either the clear dma fifo (clf) and clear scsi fifo (csf) bits if a dma interrupt occurs and the dma fifo empty (dfe) bit is not set. this is because any future scsi interrupts are not posted until the dma fifo is cleared of data. these ?ocked out scsi interrupts are posted as soon as the dma fifo is empty. 2.5.13.6 halting in an orderly fashion when an interrupt occurs, the LSI53C875 attempts to halt in an orderly fashion. ? if the interrupt occurs in the middle of an instruction fetch, the fetch is completed, except in the case of a bus fault. execution does not begin, but the dma scripts pointer (dsp) points to the next instruction since it is updated when the current instruction is fetched. ? if the dma direction is a write to memory and a scsi interrupt occurs, the LSI53C875 attempts to ?sh the dma fifo to memory before halting. under any other circumstances only the current cycle is completed before halting, so the dfe bit in dstat should be checked to see if any data remains in the dma fifo. ? scsi sreq/sack handshakes that have begun are completed before halting. ? the LSI53C875 attempts to clean up any outstanding synchronous offset before halting. ? in the case of transfer control instructions, once instruction execution begins it continues to completion before halting. ? if the instruction is a jump/call when/if 2-34 functional description 1. read interrupt status (istat) . 2. if the intf bit is set, it must be written to a one to clear this status. 3. if only the sip bit is set, read scsi interrupt status zero (sist0) and scsi interrupt status one (sist1) to clear the scsi interrupt condition and get the scsi interrupt status. the bits in the sist0 and sist1 tell which scsi interrupts occurred and determine what action is required to service the interrupts. 4. if only the dip bit is set, read the dma status (dstat) to clear the interrupt condition and get the dma interrupt status. the bits in dstat tell which dma interrupts occurred and determine what action is required to service the interrupts. 5. if both the sip and dip bits are set, read scsi interrupt status zero (sist0) , scsi interrupt status one (sist1) , and dma status (dstat) to clear the scsi and dma interrupt condition and get the interrupt status. if using 8-bit reads of the sist0, sist1, and dstat registers to clear interrupts, insert a 12 clk delay between the consecutive reads to ensure that the interrupts clear properly. both the scsi and dma interrupt conditions should be handled before leaving the interrupt service routine. it is recommended that the dma interrupt be serviced before the scsi interrupt, because a serious dma interrupt condition could in?ence how the scsi interrupt is acted upon. 6. when using polled interrupts, go back to step 1 before leaving the interrupt service routine, in case any stacked interrupts moved in when the ?st interrupt was cleared. when using hardware interrupts, the irq/ pin is asserted again if there are any stacked interrupts. this should cause the system to re-enter the interrupt service routine. 2.5.14 chained block moves since the LSI53C875 has the capability to transfer 16-bit wide scsi data, a unique situation occurs when dealing with odd bytes. the chained move (chmov) scripts instruction along with the wide scsi send (wss) and wide scsi receive (wsr) bits in the scsi control two (scntl2) register are used to facilitate these situations. the chained block move instruction is illustrated in figure 2.6 . pci cache mode 2-35 figure 2.6 block move and chained block move instructions chmov 5, 3 when data_out moves ve bytes from address 0x03 in the host memory to the scsi bus. bytes 0x03, 0x04, 0x05, and 0x06 are moved and byte 0x07 remains in the low-order byte of the scsi output data latch (sodl) register and is combined with the ?st byte of the following move instruction. move 5, 9 when data_out moves ve bytes from address 0x09 in the host memory to the scsi bus. 2.5.14.1 wide scsi send bit the wss bit is set whenever the scsi controller is sending data (data-out for initiator or data-in for target) and the controller detects a partial transfer at the end of a chained block move scripts instruction (this ?g is not set if a normal block move instruction is used). under this condition, the scsi controller does not send the low-order byte of the last partial memory transfer across the scsi bus. instead, the low-order byte is temporarily stored in the lower byte of the scsi output data latch (sodl) register and the wss ?g is set. the hardware uses the wss ?g to determine what behavior must occur at the start of the next data 0x03 0x02 0x01 0x00 0x07 0x06 0x05 0x04 0x0b 0x0a 0x09 0x08 0x0f 0x0e 0x0d 0x0c 0x13 0x12 0x11 0x10 0x04 0x03 0x06 0x05 0x09 0x07 0x0b 0x0a 0x0d 0x0c 32 bits 16 bits host memory scsi bus 00 04 08 0c 10 2-36 functional description send transfer. when the wss ?g is set at the start of the next transfer, the ?st byte (the high-order byte) of the next data send transfer is ?arried with the stored low-order byte in the sodl register; and the two bytes are sent out across the bus, regardless of the type of block move instruction (normal or chained). the ?g is automatically cleared when the ?arried word is sent. the ?g can alternately be cleared through scripts or by the microprocessor. also, the microprocessor or scripts can use this bit for error detection and recovery purposes. 2.5.14.2 wide scsi receive bit the wsr bit is set whenever the scsi controller is receiving data (data-in for initiator or data-out for target) and the controller detects a partial transfer at the end of a block move or chained block move scripts instruction. when wsr is set, the high-order byte of the last scsi bus transfer is not transferred to memory. instead, the byte is temporarily stored in the scsi wide residue (swide) register. the hardware uses the wsr bit to determine what behavior must occur at the start of the next data receive transfer. the bit is automatically cleared at the start of the next data receive transfer. the bit can alternatively be cleared by the microprocessor or through scripts. the bit can also be used by the microprocessor or scripts for error detection and recovery purposes. 2.5.14.3 swide register this register stores data for partial byte data transfers. for receive data, the scsi wide residue (swide) register holds the high-order byte of a partial scsi transfer which has not yet been transferred to memory. this stored data may be a residue byte (and therefore ignored) or it may be valid data that is transferred to memory at the beginning of the next block move instruction. 2.5.14.4 sodl register for send data, the low-order byte of the scsi output data latch (sodl) register holds the low-order byte of a partial memory transfer which has not yet been transferred across the scsi bus. this stored data is usually ?arried with the ?st byte of the next data send transfer, and both bytes are sent across the scsi bus at the start of the next data send block move command. pci cache mode 2-37 2.5.14.5 chained block move scripts instruction a chained block move scripts instruction is primarily used to transfer consecutive data send or data receive blocks. using the chained block move instruction facilitates partial receive transfers and allows correct partial send behavior without additional opcode overhead. behavior of the chained block move instruction varies slightly for sending and receiving data. for receive data (data-in for initiator or data-out for target), a chained block move instruction indicates that if a partial transfer occurred at the end of the instruction, the wsr ?g is set. the high-order byte of the last scsi transfer is stored in the scsi wide residue (swide) register rather than transferred to memory. the contents of the swide register should be the ?st byte transferred to memory at the start of the chained block move data stream. since the byte count always represents data transfers to/from memory (as opposed to the scsi bus), the byte transferred out of the scsi wide residue (swide) register is one of the bytes in the byte count. if the wsr bit is clear when a receive data chained block move instruction is executed, the data transfer occurs similar to that of the regular block move instruction. whether the wsr bit is set or clear, when a normal block move instruction is executed, the contents of the scsi wide residue (swide) register are ignored and the transfer takes place normally. for ? consecutive wide data receive block move instructions, the 2nd through the nth block move instructions should be chained block moves. for send data (data-out for initiator or data-in for target), a chained block move instruction indicates that if a partial transfer terminates the chained block move instruction, the last low-order byte (the partial memory transfer) should be stored in the lower byte of the scsi output data latch (sodl) register and not sent across the scsi bus. without the chained block move instruction, the last low-order byte would be sent across the scsi bus. the starting byte count represents data bytes transferred from memory but not to the scsi bus when a partial transfer exists. for example, if the instruction is an initiator chained block move data out of ?e bytes (and wss is not previously set), ?e bytes are transferred out of memory to the scsi controller, four bytes are transferred from the scsi controller across the scsi bus, and one byte is temporarily stored in the lower byte of the scsi output data latch (sodl) register waiting to be married with the ?st byte of the next block move instruction. regardless of whether a chained block move or normal 2-38 functional description block move instruction is used, if the wss bit is set at the start of a data send command, the ?st byte of the data send command is assumed to be the high-order byte and is ?arried with the low-order byte stored in the lower byte of the scsi output data latch (sodl) register before the two bytes are sent across the scsi bus. for ? consecutive wide data send block move commands, the ?st through the (nth 1) block move instructions should be chained block moves. 2.6 power management the LSI53C875e complies with the pci bus power management interface speci?ation, revision 1.0. the pci function power states d0, d1, d2, and d3 are de?ed in that speci?ation. d0 and d3 are required by speci?ation, and d1 and d2 are optional. d0 is the maximum powered state, and d3 is the minimum powered state. power state d3 is further categorized as d3hot or d3cold. a function that is powered off is said to be in the d3cold power state. the power states for the scsi function are independently controlled through two power state bits that are located in the pci con?uration space register 0x44. the bits are encoded as: power states d1 and d2 are not discussed because they have not been implemented as a new feature. the power states d0 and d3 are described below in conjunction with each scsi function. power state actions are separate for each function. 2.6.1 power state d0 power state d0 is the maximum power state and is the power-up default state for each function. 00b d0 01b reserved 10b reserved 11b d3 power management 2-39 2.6.2 power state d3 power state d3 is the minimum power state, which includes subsettings called d3hot and d3cold. the devices are considered to be in power state d3cold when power is removed from them. d3cold can transition to d0 by applying v cc and resetting the device. d3hot allows the device to transition to d0 using software. to obtain power reduction in d3hot, the scsi clock and the scsi clock doubler phase lock loop (pll) are disabled. furthermore, the function s soft reset is continually asserted while in power state d3, which clears all pending interrupts and 3-states the scsi bus. in addition, the function s pci command register is cleared. 2-40 functional description LSI53C875/875e pci to ultra scsi i/o processor 3-1 chapter 3 pci functional description this chapter is divided into the following sections: ? section 3.1, ?ci addressing ? section 3.2, ?ci cache mode ? section 3.3, ?on?uration registers 3.1 pci addressing there are three types of pci-de?ed address space: ? con?uration space ? memory space ? i/o space the con?uration space is a contiguous 256 x 8-bit set of addresses dedicated to each ?lot or ?tub on the bus. decoding c_be/[3:0] determines if a pci cycle is intended to access con?uration register space. the idsel bus signal is a ?hip select that allows access to the con?uration register space only. a con?uration read/write cycle without idsel is ignored. the eight lower order addresses select a speci? 8-bit register. ad[10:8] are decoded as well, but they must be zero or the LSI53C875 does not respond. according to the pci speci?ation, ad[10:8] are reserved for multifunction devices. the host processor uses the pci con?uration space to initialize the LSI53C875. the lower 128 bytes of the LSI53C875 con?uration space holds system parameters while the upper 128 bytes map into the LSI53C875 operating registers. for all pci cycles except con?uration cycles, the LSI53C875 registers are located on the 256-byte block boundary de?ed by the base 3-2 pci functional description address assigned through the con?ured register. the LSI53C875 operating registers are available in both the upper and lower 128-byte portions of the 256-byte space selected. at initialization time, each pci device is assigned a base address (in the case of the LSI53C875, the upper 24 bits of the address are selected) for memory and i/o accesses. on every access, the LSI53C875 compares its assigned base addresses with the value on the address/data bus during the pci address phase. if the upper 24 bits match, the access is for the LSI53C875 and the low-order eight bits de?e the register to be accessed. a decode of c_be/[3:0] determines which registers and what type of access is to be performed. the pci speci?ation de?es memory space as a contiguous 32-bit memory address that is shared by all system resources, including the LSI53C875. base address one (memory) determines which 256-byte memory area this device occupies. the pci speci?ation de?es i/o space as a contiguous 32-bit i/o address that is shared by all system resources, including the LSI53C875. base address zero (i/o) determines which 256-byte i/o area this device occupies. 3.1.1 pci bus commands and functions supported bus commands indicate to the target the type of transaction the master is requesting. bus commands are encoded on the c_be/[3:0] lines during the address phase. pci bus command encoding and types appear in table 3.1 . pci addressing 3-3 3.1.1.1 i/o read command the i/o read command reads data from an agent mapped in i/o address space. all 32 address bits are decoded. 3.1.1.2 i/o write command the i/o write command writes data to an agent when mapped in i/o address space. all 32 address bits are decoded. table 3.1 pci bus commands and encoding types c_be[3:0] command type supported as master supported as slave 0000 special interrupt acknowledge no no 0001 special cycle no no 0010 i/o read cycle yes yes 0011 i/o write cycle yes yes 0100 reserved n/a n/a 0101 reserved n/a n/a 0110 memory read yes yes 0111 memory write yes yes 1000 reserved n/a n/a 1001 reserved n/a n/a 1010 con?uration read no yes 1011 con?uration write no yes 1100 memory read multiple yes 1 no (defaults to 0110) 1101 dual address cycle no no 1110 memory read line yes 2 no (defaults to 0110) 1111 memory write and invalidate yes 3 no (defaults to 0111) 1. this operation is selectable by bit 2 in the dma mode (dmode) operating register. 2. this operation is selectable by bit 3 in the dma mode (dmode) operating register. 3. this operation is selectable by bit 0 in the chip test three (ctest3) operating register. 3-4 pci functional description 3.1.1.3 memory read the memory read command reads data from an agent mapped in memory address space. all 32 address bits are decoded. 3.1.1.4 memory read multiple the memory read command reads data from an agent mapped in memory address space. all 32 address bits are decoded. 3.1.1.5 memory read line the memory read command reads data from an agent mapped in memory address space. all 32 address bits are decoded. 3.1.1.6 memory write the memory write command writes data to an agent when mapped in memory address space. all 32 address bits are decoded. 3.1.1.7 memory write and invalidate the memory write command writes data to an agent when mapped in memory address space. all 32 address bits are decoded. 3.2 pci cache mode the LSI53C875 supports the pci speci?ation for an 8-bit cache line size register located in the pci con?uration space. the cache line size register provides the ability to sense and react to nonaligned addresses corresponding to cache line boundaries. in conjunction with the cache line size register, the pci commands read line, read multiple, and write and invalidate are each software enabled or disabled to allow the user full ?xibility in using these commands. 3.2.1 support for pci cache line size register the LSI53C875 supports the pci speci?ation for an 8-bit cache line size register in pci con?uration space. it can sense and react to nonaligned addresses corresponding to cache line boundaries. pci cache mode 3-5 3.2.2 selection of cache line size the cache logic selects a cache line size based on the values for the burst size in the dma mode (dmode) register, bit 2 in the chip test five (ctest5) register, and the pci cache line size register. note: the LSI53C875 does not automatically use the value in the pci cache line size register as the cache line size value. the chip scales the value of the cache line size register down to the nearest binary burst size allowed by the chip (2, 4, 8, 16, 32, 64, or 128), compares this value to the burst size de?ed by the values of the dma mode (dmode) register and bit 2 of the chip test five (ctest5) register, then selects the smallest as the value for the cache line size. the LSI53C875 uses this value for all burst data transfers. 3.2.3 alignment the LSI53C875 uses the calculated line size value to monitor the current address for alignment to the cache line size. when it is not aligned, the chip attempts to align to the cache boundary by using a ?mart aligning scheme. this means that it attempts to use the largest burst size possible that is less than the cache line size, to reach the cache boundary quickly with no over?w. this process is a stepping mechanism that steps up to the highest possible burst size based on the current address. the stepping process begins a ta4dword boundary. the LSI53C875 will ?st try to align to a 4 dword boundary (0x00, 0x010, 0x020, etc.) by using single dword transfers (no bursting). once this boundary is reached the chip evaluates the current alignment to various burst sizes allowed, and selects the largest possible as the next burst size, while not exceeding the cache line size. the chip then issues this burst, and reevaluates the alignment to various burst sizes, again selecting the largest possible while not exceeding the cache line size, as the next burst size. this stepping process continues until the chip reaches the cache line size boundary or runs out of data. once a cache line boundary is reached, the chip uses the cache line size as the burst size from then on, except in the case of multiples (explained below). the alignment process is ?ished at this point. 3-6 pci functional description example: cache line size - 16, current address = 0x01 the chip is not aligned to a 4 dword cache boundary (the stepping threshold), so it issues four single dword transfers (the ?st is a 3-byte transfer). at address 0x10, the chip is aligned to a 4 dword boundary, but not aligned to any higher burst size boundaries that are less than the cache line size. so, the part issues a burst of 4. at this point, the address is 0x20, and the chip evaluates that it is aligned not only t oa4dword boundary, but also to an 8 dword boundary. it selects the highest, 8, and bursts 8 dwords. at this point, the address is 0x40, which is a cache line size boundary. alignment stops, and the burst size from then on is switched to 16. 3.2.4 memory move misalignment the LSI53C875 does not operate in a cache alignment mode when a memory move instruction type is issued and the read and write addresses are different distances from the nearest cache line boundary. for example, if the read address is 0x21f and the write address is 0x42f, and the cache line size is 8, the addresses are byte aligned, but they are not the same distance from the nearest cache boundary. the read address is 1 byte from the cache boundary 0x220 and the write address is 17 bytes from the cache boundary 0x440. in this situation, the chip does not align to cache boundaries and operates as an lsi53c825. 3.2.5 memory write and invalidate command the memory write and invalidate command is identical to the memory write command, except that it additionally guarantees a minimum transfer of one complete cache line; that is to say, the master intends to write all bytes within the addressed cache line in a single pci transaction unless interrupted by the target. this command requires implementation of the pci cache line size register at address 0x0c in pci con?uration space. the LSI53C875 enables memory write and invalidate cycles when bit 0 in the chip test three (ctest3) register (wrie) and bit 4 in the pci command register are set. when the following conditions are met, memory write and invalidate commands are issued: 1. the clse bit (cache line size enable, bit 7, dma control (dcntl) register), wrie bit (write and invalidate enable, bit 0, chip test three (ctest3) register), and pci con?uration command register, bit 4 are set. pci cache mode 3-7 2. the cache line size register contains a legal burst size (2, 4, 8, 16, 32, 64, or 128) value and that value must be less than or equal to the dma mode (dmode) burst size. 3. the chip has enough bytes in the dma fifo to complete at least one full cache line burst. 4. the chip is aligned to a cache line boundary. when these conditions are met, the LSI53C875 issues a write and invalidate command instead of a memory write command during all pci write cycles. multiple cache line transfers the write and invalidate command can write multiple cache lines of data in a single bus ownership. the chip issues a burst transfer as soon as it reaches a cache line boundary. the size of the transfer is not automatically the cache line size, but rather a multiple of the cache line size speci?d in the revision 2.1 of the pci speci?ation. the logic selects the largest multiple of the cache line size based on the amount of data to transfer, with the maximum allowable burst size being that determined from the dma mode (dmode) burst size bits and chip test five (ctest5) , bit 2. if multiple cache line size transfers are not desired, set the dma mode (dmode) burst size to exactly the cache line size and the chip only issues single cache line transfers. after each data transfer, the chip re-evaluates the burst size based on the amount of remaining data to transfer and again selects the highest possible multiple of the cache line size, no larger than the dma mode (dmode) burst size. the most likely scenario of this scheme is that the chip selects the dma mode (dmode) burst size after alignment, and issues bursts of this size. the burst size is, in effect, throttled down toward the end of a long memory move or block move transfer until only the cache line size burst size is left. the chip ?ishes the transfer with this burst size. 3.2.5.1 latency in accordance with the pci speci?ation, the latency timer is ignored when issuing a write and invalidate command such that when a latency time-out occurs, the LSI53C875 continues to transfer up to a cache line boundary. at that point, the chip relinquishes the bus, and ?ishes the 3-8 pci functional description transfer at a later time using another bus ownership. if the chip is transferring multiple cache lines it continues to transfer until the next cache boundary is reached. pci target retry during a write and invalidate transfer, if the target device issues a retry (stop with no trdy, indicating that no data was transferred), the chip relinquishes the bus and immediately tries to ?ish the transfer on another bus ownership. the chip issues another write and invalidate command on the next ownership, in accordance with the pci speci?ation. pci target disconnect during a write and invalidate transfer, if the target device issues a disconnect the LSI53C875 relinquishes the bus and immediately tries to ?ish the transfer on another bus ownership. the chip does not issue another write and invalidate command on the next ownership unless the address is aligned. 3.2.6 memory read line command this command is identical to the memory read command, except that it additionally indicates that the master intends to fetch a complete cache line. this command is intended for use with bulk sequential data transfers where the memory system and the requesting master might gain some performance advantage by reading up to a cache line boundary rather than a single memory cycle. the read line function in the LSI53C875 takes advantage of the pci 2.1 speci?ation regarding issuing this command. the functionality of the enable read line bit (bit 3in dma mode (dmode)) has been modi?d to more resemble the write and invalidate mode in terms of conditions that must be met before a read line command is issued. however, the read line option operates exactly like the previous lsi53c8xx chips when cache mode has been disabled by a clse bit reset or when certain conditions exist in the chip (explained below). the read line mode is enabled by setting bit 3 in the dma mode (dmode) register. if cache mode is disabled, read line commands are issued on every read data transfer, except opcode fetches, as in previous lsi53c8xx chips. if cache mode is enabled, a read line command is issued on all read cycles, except opcode fetches, when the following conditions are met: pci cache mode 3-9 1. the clse (cache line size enable, bit 7, dma control (dcntl) register) and erl (enable read line, bit 3, dma mode (dmode) register) bit are set. 2. the cache line size register must contain a legal burst size value (2, 4, 8, 16, 32, 64, or 128) and that value is less than or equal to the dma mode (dmode) burst size. 3. the number of bytes to be transferred at the time a cache boundary has been reached is equal to or greater than the dma mode (dmode) burst size. 4. the chip is aligned to a cache line boundary. when these conditions are met, the chip issues a read line command instead of a memory read during all pci read cycles. otherwise, it issues a normal memory read command. 3.2.7 memory read multiple command this command is identical to the memory read command except that it additionally indicates that the master may intend to fetch more than one cache line before disconnecting. the LSI53C875 supports pci read multiple functionality and issues read multiple commands on the pci bus when the read multiple mode is enabled. this mode is enabled by setting bit 2 (ermp) of the dma mode (dmode) register. if cache mode is enabled, a read multiple command is issued on all read cycles, except opcode fetches, when the following conditions are met: 1. the clse bit (cache line size enable, bit 7, dma control (dcntl) register) and the ermp bit (enable read multiple, bit 2, dma mode (dmode) register) are set. 2. the cache line size register contains a legal burst size value (2, 4, 8, 16, 32, 64, or 128) and that value is less than or equal to the dma mode (dmode) burst size. 3. the number of bytes to be transferred at the time a cache boundary is reached must be at least twice the full cache line size. 4. the chip is aligned to a cache line boundary. when these conditions are met, the chip issues a read multiple command instead of a memory read during all pci read cycles. 3-10 pci functional description burst size selection the read multiple command reads in multiple cache lines of data in a single bus ownership. the number of cache lines to be read is a multiple of the cache line size speci?d in revision 2.1 of the pci speci?ation. the logic selects the largest multiple of the cache line size based on the amount of data to transfer, with the maximum allowable burst size being determined from the dma mode (dmode) burst size bits and chip test five (ctest5) , bit 2. read multiple with read line enabled when both the read multiple and read line modes are enabled, the read line command is not issued if the above conditions are met. instead, a read multiple command is issued, even though the conditions for read line are met. if the read multiple mode is enabled and the read line mode is disabled, read multiple commands are issued if the read multiple conditions are met. unsupported pci commands the LSI53C875 does not respond to reserved commands, special cycle, dual address cycle, or interrupt acknowledge commands as a slave. it never generates these commands as a master. con?uration registers 3-11 3.3 con?uration registers the con?uration registers are accessible only by the system bios during pci con?uration cycles. the lower 128 bytes hold con?uration data while the upper 128 bytes hold the LSI53C875 operating registers, which are described in chapter 5, ?csi operating registers. these registers are accessed by scripts or the host processor, if necessary. note: the con?uration register descriptions provide general information only, to indicate which pci con?uration addresses are supported in the LSI53C875. for detailed information, refer to the pci speci?ation. table 3.2 shows the pci con?uration registers implemented by the LSI53C875/875e. all pci-compliant devices, such as the LSI53C875, must support the vendor id , device id , command , and status registers. support of other pci-compliant registers is optional. in the LSI53C875, registers that are not supported are not writable and returns all zeros when read. only those registers and bits that are currently supported by the LSI53C875 are described in this chapter. for more detailed information on pci registers, please see the pci speci?ation. 3-12 pci functional description table 3.2 pci con?uration register map 31 16 15 0 device id vendor id 0x00 status command 0x04 class code revision id 0x08 not supported header type latency timer cache line size 0x0c base address zero (i/o) 1 1. i/o base is supported. 0x10 base address one (memory) 2 2. memory base is supported. 0x14 base address two (memory) scripts ram 3 3. this register powers up enabled and can be disabled by pull-down resistors on the mad5 pin. 0x18 not supported 0x1c not supported 0x20 not supported 0x24 reserved 0x28 subsystem id (ssid) subsystem vendor id (ssvid) 0x2c expansion rom base address 4 4. if expansion memory is enabled through pull-down resistors on the mad[7:0] bus. note: addresses 0x40?x7f are not de?ed for the LSI53C875. addresses 0x48?x7f are not de?ed for the LSI53C875e. all unsupported registers are not writable and return all zeros when read. reserved registers also return zeros when read. 0x30 reserved capabilities pointer 0x34 reserved 0x38 max_lat min_gnt interrupt pin interrupt line 0x3c power management capabilities next item pointer capability id 0x40 data bridge support exten- sions (pmcsr_bse) power management control/status 0x44 con?uration registers 3-13 register: 0x00 vendor id read only vid vendor id [15:0] this 16-bit register identi?s the manufacturer of the device. the vendor id is 0x1000. register: 0x02 device id read only did device id [15:0] this 16-bit register identi?s the particular device. the LSI53C875 device id is 0x000f. register: 0x04 command read/write the command register provides coarse control over a device s ability to generate and respond to pci cycles. when a zero is written to this register, the LSI53C875 is logically disconnected from the pci bus for all accesses except con?uration accesses. in the LSI53C875, bits 3, 5, 7, and 9 are not implemented. bits 10 through 15 are reserved. 15 0 vid 1111000000000000 15 0 did 0000000000000000 15 9 8 7 6 5 4 3 2 1 0 rse r eper r wie r ebm ems eis 0 0 0 0 0 0 00 00 00 00 00 3-14 pci functional description r reserved [15:9] serr/ enable 8 this bit enables the serr/ driver. serr/ is disabled when this bit is cleared. the default value of this bit is zero. this bit and bit 6 must be set to report address parity errors. r reserved 7 enable parity error response 6 this bit allows the LSI53C875 to detect parity errors on the pci bus and report these errors to the system. only data parity checking is enabled. the LSI53C875 always generates parity for the pci bus. r reserved 5 wie write and invalidate mode 4 this bit allows the LSI53C875 to generate memory write and invalidate commands on the pci bus. the wie bit in the dma control (dcntl) register must also be set for the device to generate write and invalidate commands. for more information on these conditions, refer to the section section 3.2.5, ?emory write and invalidate command. to enable write and invalidate mode, set bit 0 in the chip test three (ctest3) register (operating register set). r reserved 3 ebm enable bus mastering 2 this bit controls the ability of the LSI53C875 to act as a master on the pci bus. a value of zero disables this device from generating pci bus master accesses. a value of one allows the LSI53C875 to behave as a bus master. the LSI53C875 must be a bus master in order to fetch scripts instructions and transfer data. ems enable memory space 1 this bit controls the ability of the LSI53C875 to respond to memory space accesses. a value of zero disables the device response. a value of one allows the LSI53C875 to respond to memory space accesses at the address spec- i?d by base address one (memory) . con?uration registers 3-15 eis enable i/o space 0 this bit controls the LSI53C875 response to i/o space accesses. a value of zero disables the device response. a value of one allows the LSI53C875 to respond to i/o space accesses at the address speci?d in base address zero (i/o) . register: 0x06 status read/write the status register records status information for pci bus related events. in the LSI53C875, bits 0 through 3 are reserved and bits 5, 6, 7, and 11 are not implemented by the LSI53C875. reads to this register behave normally. writes are slightly different in that bits can be cleared, but not set. a bit is reset whenever the register is written, and the data in the corresponding bit location is a one. for instance, to clear bit 15 and not affect any other bits, write the value 0x8000 to the register. dpe detected parity error (from slave) 15 this bit is set by the LSI53C875 whenever it detects a data parity error, even if parity error handling is disabled. sse signaled system error 14 this bit is set whenever a device asserts the serr/ signal. rma master abort (from master) 13 a master device should set this bit whenever its transaction (except for special cycle) is terminated with master abort. all master devices should implement this bit. rta received target abort (from master) 12 a master device should set this bit whenever its transaction is terminated by target abort. all master devices should implement this bit. 15 14 13 12 11 10 9 8 7 5 4 3 0 dpe sse rma rta r dt[1:0] dpr rnc r 0000 0000 0 0 01 0 0 0 0 3-16 pci functional description r reserved 11 dt[1:0] devsel/timing [10:9] these bits encode the timing of devsel/. these are encoded as these bits are read only and should indicate the slowest time that a device asserts devsel/ for any bus command except con?uration read and con?uration write. the LSI53C875 supports a value of 0b01. dpr data parity reported 8 this bit is set when the following conditions are met: ? the bus agent asserted perr/ itself or observed perr/ asserted. ? the agent setting this bit acted as the bus master for the operation in which the error occurred. ? the parity error response bit in the command register is set. r reserved [7:5] nc new capabilities 4 this bit is set to indicate a list of extended capabilities such as pci power management. this bit is read only. r reserved [3:0] 0b00 fast 0b01 medium 0b10 slow 0b11 reserved con?uration registers 3-17 register: 0x08 revision id read only rid revision id [7:0] this register speci?s device and revision identi?rs. the value of the LSI53C875e is 0x26 and 0x0 for the LSI53C875. register: 0x09 class code read only cc class code [23:0] this 24-bit register is used to identify the generic function of the device. the upper byte of this register is a base class code, the middle byte is a subclass code, and the lower byte identi?s a speci? register level programming interface. the value of this register is 0x010000, which indicates a scsi controller. 7 0 rid LSI53C875e 00100110 LSI53C875 00000100 23 0 cc 000011110000000000000000 3-18 pci functional description register: 0x0c cache line size read/write cls cache line size [7:0] this register speci?s the system cache line size in units of 32-bit words. cache mode is enabled and disabled by the cache line size enable (clse) bit, bit 7 in the dma control (dcntl) register. setting this bit causes the LSI53C875 to align to cache line boundaries before allowing any bursting, except during memory moves in which the read and write addresses are not aligned to a burst size boundary. for more information on this regis- ter, see the section section 3.2.1, ?upport for pci cache line size register. register: 0x0d latency timer read/write lt latency timer [7:0] the latency timer register speci?s, in units of pci bus clocks, the value of the latency timer for this pci bus master. the LSI53C875 supports this timer. all eight bits are writable, allowing latency values of 0?55 pci clocks. use the following equation to calculate an optimum latency value for the LSI53C875: latency = 2 + (burst size x (typical wait states +1)) values greater than optimum are also acceptable. 7 0 cls 00000000 7 0 lt 00000000 con?uration registers 3-19 register: 0x0e header type read only ht header type [7:0] this register identi?s the layout of bytes 0x10 through 0x3f in con?uration space and also whether or not the device contains multiple functions. the value of this register is 0x00. register: 0x10 base address zero (i/o) read/write bar0 base address register zero (i/o) [31:0] this 32-bit register has bit zero hardwired to one. bit 1 is reserved and must return a zero on all reads, and the other bits are used to map the device into i/o space. register: 0x14 base address one (memory) read/write bar1 base address register one [31:0] this register has bit 0 hardwired to zero. for detailed information on the operation of this register, refer to the pci speci?ation. 7 0 ht 00000000 31 0 bar0 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx1 31 0 bar1 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx0 3-20 pci functional description register: 0x18 ram base address two (memory) scripts ram read/write bar2 base address register two [31:0] this register holds the memory base address of the 4 kbyte internal ram. read this register through the scratch register b (scratchb) register in the operating register set when bit 3 of the chip test two (ctest2) register is set. register: 0x2c subsystem vendor id (ssvid) read only ssvid subsystem vendor id [15:0] this register supports subsystem identi?ation, which has a default value of 0x0000 in the LSI53C875 and 0x1000 in the LSI53C875e (see section 4.1, ?ad bus program- ming ). to write to this register, connect a 4.7 k ? resistor between the mad[6] pin and v ss and leave the mad[4] pin unconnected. the mad[6] and mad[4] pins have internal pull-up resistors and are sensed shortly after the deassertion of chip reset. in revisions before revision g of the LSI53C875, the mad[6] and mad[4] pins do not support the ssid and ssvid con?urations, and only values of 0x0000 can be found in the subsystem data register. 31 0 bar2 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx0 15 0 ssvid LSI53C875e 1111000000000000 LSI53C875 0000000000000000 con?uration registers 3-21 register: 0x2e subsystem id (ssid) read only ssid subsystem id [15:0] this register supports subsystem identi?ation, which has a default value of 0x0000 in the LSI53C875 and 0x1000 in the LSI53C875e (see section 4.1, ?ad bus program- ming ). to write to this register, connect a 4.7 k ? resistor between the mad[6] pin and v ss and leave the mad[4] pin unconnected. the mad[6] and mad[4] pins have internal pull-up resistors and are sensed shortly after the deassertion of chip reset. in revisions before revision g of the LSI53C875, the mad[6] and mad[4] pins do not support the ssid and ssvid con?urations, and only values of 0x0000 can be found in the subsystem data register. register: 0x30 expansion rom base address read/write erba expansion rom base address [31:0] this four-byte register handles the base address and size information for expansion rom. it functions exactly like the base address zero (i/o) and base address one (memory) registers, except that the encoding of the bits is different. the upper 21 bits correspond to the upper 21 bits of the expansion rom base address. 15 0 ssid LSI53C875e 1111000000000000 LSI53C875 0000000000000000 31 0 erba 00000000000000000000000000000000 3-22 pci functional description the expansion rom enable bit, bit 0, is the only bit de?ed in this register. this bit is used to control whether or not the device accepts accesses to its expansion rom. when the bit is set, address decoding is enabled, and a device can be used with or without an expansion rom depending on the system con?uration. to access the external memory interface, also set the memory space bit in the command register. the host system detects the size of the external memory by ?st writing the expansion rom base address register with all ones and then reading back the register. the LSI53C875 responds with zeros in all don? care locations. the ones in the remaining bits represent the binary version of the external memory size. for example, to indicate an external memory size of 32 kbytes, this register, when written with ones and read back, returns ones in the upper 17 bits. register: 0x34 capabilities pointer read only cp capabilities pointer [7:0] this register provides an offset into the function s pci con?uration space for the location of the ?st item in the capabilities linked list. only the LSI53C875e sets this register to 0x40. the capability pointer replaces the general purpose pin control (gpcntl) register in earlier revisions of the LSI53C875. 7 0 cp 01000000 con?uration registers 3-23 register: 0x3c interrupt line read/write il interrupt line [7:0] this register is used to communicate interrupt line routing information. post software writes the routing information into this register as it con?ures the system. the value in this register tells which input of the system interrupt controller(s) the device s interrupt pin is connected to. values in this register are speci?d by system architecture. register: 0x3d interrupt pin read only ip interrupt pin [7:0] this register tells which interrupt pin the device uses. its value is set to 0x01, for the inta/ signal. 7 0 il 00000000 7 0 ip 00000001 3-24 pci functional description register: 0x3e min_gnt read only mg min_gnt [7:0] this register is used to specify the desired settings for latency timer values. min_gnt is used to specify how long a burst period the device needs. the value speci?d in these registers is in units of 0.25 microseconds. the LSI53C875 sets this register to 0x11. register: 0x3f max_lat read only ml max_lat [7:0] this register is used to specify the desired settings for latency timer values. max_lat is used to specify how often the device needs to gain access to the pci bus. the value speci?d in this register is in units of 0.25 microseconds. values of zero indicate that the device has no major requirements for the settings of latency timers. the LSI53C875 sets this register to 0x40. 7 0 mg 00010001 7 0 ml 01000000 con?uration registers 3-25 register: 0x40 capability id read only cid cap_id [7:0] this register indicates the type of data structure currently being used. it is set to 0x01, indicating the power management data structure. only the LSI53C875e sets this register to 0x01. register: 0x41 next item pointer read only nip next_item_ptr [7:0] bits [7:0] contain the offset location of the next item in the controller capabilities list. the default value for this register is 0x00, indicating that power management is the last capability in the linked list of extended capabilities. this register applies to the LSI53C875e only. register: 0x42 power management capabilities read only this register applies to the LSI53C875e only and indicates the power management capabilities. 7 0 cid 00000001 7 0 nip 00000000 15 11 10 9 8 6 5 4 3 2 0 pmes[4:0] d2s d1s r dsi aps pmec ver[2:0] 0 000 0 0 0 0 0 000 0 111 3-26 pci functional description pmes pme support [15:11] this ?ld is always set to 00000b because the LSI53C875e does not provide a pme signal. d2s d2 support 10 this device does not support the d2 power management state, and this bit is set to zero. d1s d1 support 9 this device does not support the d1 power management state, and this bit is set to zero. r reserved [8:6] dsi device speci? initialization 5 this bit is set to 0 to indicate that the device requires no special initialization before the generic class device driver is able to use it. aps auxiliary power source 4 because the device does not provide a pme signal, this bit always returns a 0. this indicates that no auxiliary power source is required to support the pme signal in the d3cold power management state. pmec pme clock 3 this bit always returns a zero value because the devices do not provide a pme signal. ver version [2:0] this ?ld is set to 001b to indicate that the device complies with revision 1.0 of the pci power management interface speci?ation. register: 0x44 power management control/status read/write this register applies to the LSI53C875e only and indicates the power management control and status descriptions. 15 14 13 12 9 8 7 2 1 0 pst dscl dslt pen r pws 00000000 0 0 0 0 0 000 con?uration registers 3-27 pst pme status 15 the device always returns a zero for this bit, indicating that pme signal generation is not supported from d3cold. dscl data scale [14:13] this device does not support the data register. therefore, this ?ld is always set to 00b. dslt data select [12:9] this device does not support the data register. therefore, this ?ld is always set to 0000b. pen pme enable 8 this device always returns a zero for this bit to indicate that pme assertion is disabled. r reserved [7:2] pws power state [1:0] this two bit ?ld determines the current power state for the function and is used to set the function to a new power state. the de?ition of the ?ld values are: register: 0x46 bridge support extensions (pmcsr_bse) read only bse bridge support extensions [7:0] this register applies to the LSI53C875e only and can support pci bridge speci? functionality, if required. the default value always returns 0x00. 0b00 d0 0b01 reserved 0b10 reserved 0b11 d3 hot 7 0 bse 00000000 3-28 pci functional description register: 0x47 data read only data data [7:0] this register applies to the LSI53C875e only and provides an optional mechanism for the function to report state dependent operating data. the LSI53C875e returns 0x00 as the default value. 7 0 data 00000000 LSI53C875/875e pci to ultra scsi i/o processor 4-1 chapter 4 signal descriptions this chapter presents the LSI53C875 pin con?uration and signal de?itions using tables and illustrations. figure 4.1 through figure 4.4 are the pin diagrams for all versions of the LSI53C875 and figure 4.5 is the functional signal grouping. the pin de?itions are presented in table 4.1 through table 4.12 . the LSI53C875 is a pin-for-pin replacement for the lsi53c825. 4-2 signal descriptions figure 4.1 LSI53C875 pin diagram c_be3/ ad23 ad22 v dd-i ad18 c_be2/ irdy/ v ss stop/ par/ v ss ad15 ad11 v ss ad8 c_be0/ 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 36 37 38 39 40 ad17 v ss v ss v dd-i 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 idsel v ss ad20 v ss ad16 frame/ v dd-i v ss c_be1/ ad13 ad12 ad9 ad21 ad19 trdy/ devsel/ perr/ ad14 ad10 ad7 sdir7 v dd sd13/ sd15/ sd1/ sd4/ v ss-s sd6/ v ss-s srst/ ssel/ v ss-s sd9/ v dd sdir8 sdir9 120 118 116 114 112 110 108 106 104 102 100 98 96 94 92 90 88 86 85 84 83 82 81 v ss-s sd3/ si_o/ v ss-s 119 117 115 113 111 109 107 105 103 101 99 97 95 93 91 89 87 sdirp0 sd12/ v ss-s sd0/ sd2/ sd5/ satn/ sbsy/ smsg/ sreq/ sd8/ sd11/ sd14/ sdp1/ sd7/ sdp0/ sack/ sc_d/ sd10/ sdir10 ad6 ad5 v dd-i v ss v dd-c v ss-c testin mac/_testout mad4 mad2 mad0 gpio2_mas2/ v dd rstdir bsydir v ss irq/ gpio1_master/ gpio4 tgs v ss ad4 ad2 ad0 gpio0_fetch/ sclk mad5 v dd mad1 gpio3 diffsens seldir ad3 ad1 mad7 mad6 mad3 v ss igs v ss sdir3 sdir2 sdirp1 v ss sdir12 mas1/ big_lit/ clk v ss-c gnt/ v dd-c ad31 ad30 ad28 121 123 125 127 129 131 133 135 137 139 141 143 144 145 146 147 148 150 152 154 156 158 sdir5 mwe/ mce/ v ss ad29 ad27 ad26 ad24 160 ad25 122 124 126 128 130 132 134 136 138 140 142 149 151 153 155 157 159 sdir6 sdir4 sdir0 sdir15 sdir13 v dd moe/ rst/ sdir1 v dd sdir14 mas0/ serr/ req/ v dd-i v ss 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 76 77 78 79 80 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 sdir11 note: the decoupling capacitor arrangement shown above is recommended to maximize the bene?s of the internal split ground system. capacitor values between 0.01 and 0.1 f should provide adequate noise isolation. because of the number of high current drivers on the LSI53C875, a multilayer pc board with power and ground planes is required. LSI53C875 pci to scsi i/o processor 160-pin quad flat pack (top view) 4-3 figure 4.2 LSI53C875j pin diagram c_be3/ ad23 ad22 v dd-i ad18 c_be2/ irdy/ v ss stop/ par/ v ss ad15 ad11 v ss ad8 c_be0/ 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 36 37 38 39 40 ad17 v ss v ss v dd-i 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 idsel v ss ad20 v ss ad16 frame/ v dd-i v ss c_be1/ ad13 ad12 ad9 ad21 ad19 trdy/ devsel/ perr/ ad14 ad10 ad7 sdir7 v dd sd13/ sd15/ sd1/ sd4/ v ss-s sd6/ v ss-s srst/ ssel/ v ss-s sd9/ v dd sdir8 sdir9 120 118 116 114 112 110 108 106 104 102 100 98 96 94 92 90 88 86 85 84 83 82 81 v ss-s sd3/ si_o/ v ss-s 119 117 115 113 111 109 107 105 103 101 99 97 95 93 91 89 87 sdirp0 sd12/ v ss-s sd0/ sd2/ sd5/ satn/ sbsy/ smsg/ sreq/ sd8/ sd11/ sd14/ sdp1/ sd7/ sdp0/ sack/ sc_d/ sd10/ sdir10 ad6 ad5 v dd-i v ss v dd-c v ss-c tms tdo mad4 mad2 mad0 gpio2_mas2/ v dd rstdir bsydir v ss irq/ gpio1_master/ gpio4 tgs v ss ad4 ad2 ad0 gpio0_fetch/ sclk mad5 v dd mad1 gpio3 diffsens seldir ad3 ad1 mad7 mad6 mad3 v ss igs v ss sdir3 sdir2 tck v ss sdir12 mas1/ tdi clk v ss-c gnt/ v dd-c ad31 ad30 ad28 121 123 125 127 129 131 133 135 137 139 141 143 144 145 146 147 148 150 152 154 156 158 sdir5 mwe/ mce/ v ss ad29 ad27 ad26 ad24 160 ad25 122 124 126 128 130 132 134 136 138 140 142 149 151 153 155 157 159 sdir6 sdir4 sdir0 sdir15 sdir13 v dd moe/ rst/ sdir1 v dd sdir14 mas0/ serr/ req/ v dd-i v ss 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 76 77 78 79 80 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 sdir11 LSI53C875j (jtag) pci to scsi i/o processor 160-pin quad flat pack (top view) note: the decoupling capacitor arrangement shown above is recommended to maximize the bene?s of the internal split ground system. capacitor values between 0.01 and 0.1 f should provide adequate noise isolation. because of the number of high current drivers on the LSI53C875, a multilayer pc board with power and ground planes is required. 4-4 signal descriptions figure 4.3 LSI53C875n pin diagram nc nc nc bytepar2 ad22 ad19 ad18 ad17 frame/ trdy/ v dd-i stop/ bytepar1 ad13 v ss ad12 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 36 37 38 39 40 ad21 v dd-i pa r v ss 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 nc nc idsel v ss ad20 v ss c_be2/ irdy/ devsel/ perr/ c_be1/ ad14 c_be3/ ad23 ad16 v ss v ss v ss ad15 v dd-i nc nc nc sdirp0 sd13 sdp1/ sd1/ v ss-s sd5/ sd7/ satn/ v ss-s v ss-s si_0/ sd8/ v ss-s 156 154 152 150 148 146 144 142 140 138 136 134 132 130 128 126 124 122 121 120 119 118 117 sd14/ sd15/ srst/ ssel/ 155 153 151 149 147 145 143 141 139 137 135 133 131 129 127 125 123 nc nc sdir7 sd12/ v ss-s sd0/ sd4/ v ss-s sdp0/ sack/ smsg/ sreq/ nc v dd sd2/ sd3/ sd6/ sbsy/ sc_d/ sd9/ nc nc nc ad5 ad3 ad0 irq/ gpio0_fetch testin td0 mad6 mad5 mad0 gpio3 gpio4 diffsens ad2 ad1 mad3 mad1 nc nc v ss v dd-i v ss v dd-c sclk tms mad7 v dd mad2 v ss ad6 ad4 gpio1_master/ v ss-c mac/_testout mad4 gpio2_mas2/ sdirp1 sdir15 sdir14 mas1 mwe/ mce/ big_lit/ gnt/ bytepar3 ad31 ad30 ad29 ad28 v dd-i v ss 169 171 173 175 177 179 181 183 185 187 189 191 192 193 194 195 196 198 200 202 204 206 sdir0 rst/ v ss-c ad27 ad26 ad24 nc nc 208 nc 170 172 174 176 178 180 182 184 186 188 190 197 199 201 203 205 207 v dd tck sdir12 mas0/ moe/ serr/ clk v dd-c v ss sdir13 v dd tdi req/ v ss ad25 nc 53 55 57 59 61 63 65 67 69 71 73 75 77 79 81 83 85 87 88 89 90 91 92 54 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86 LSI53C875n pci to scsi i/o processor 208-pin quad flat pack 156 154 152 150 148 146 144 142 140 138 136 134 132 130 128 126 124 122 121 120 119 118 117 155 153 151 149 147 145 143 141 139 137 135 133 131 129 127 125 123 116 114 112 110 108 106 115 113 111 109 107 105 sd10/ v dd sdir9 nc nc nc sd11/ sdir8 nc nc sdir10 nc 41 43 45 47 48 49 50 51 52 42 44 46 c_be0/ nc nc nc ad9 ad8 ad10 v ss ad7 ad11 bytepar0 nc 93 95 97 99 100 101 102 103 104 94 96 98 tgs v dd sdir11 nc nc nc rstdir v ss seldir bsydir nc igs nc nc nc sdir6 sdir3 157 159 161 163 165 167 nc 158 160 162 164 166 168 nc nc sdir4 sdir2 sdir5 v ss sdir1 note: the decoupling capacitor arrangement shown in figures 4.1 and 4.2 is recom- mended to maximize the bene?s of the internal split ground system. capacitor val- ues between 0.01 and 0.1 f should provide adequate noise isolation. because of the number of high current drivers on the LSI53C875, a multilayer pc board with power and ground planes is required. 4-5 figure 4.4 LSI53C875jb pin diagram (top view) note: pins f7, g6, g7, g8, and h7 are connected to the die pad. a1 a2 a3 a4 a5 a6 a7 a8 a9 a10 a11 a12 a13 c_be3/ ad24 ad27 ad29 vdd-c clk mce/ mas0/ vss tck sdir2 sdir5 sdir6 b1 b2 b3 b4 b5 b6 b7 b8 b9 b10 b11 b12 b13 idsel nc vss ad28 ad31 rst/ mde/ mas1/ sdir14 vdd vss nc sdir7 c1 c2 c3 c4 c5 c6 c7 c8 c9 c10 c11 c12 c13 ad21 ad23 vss ad26 ad30 vss-c mwe/ sdir12 sdir15 sdir1 sdir4 vdd-s sd13/ d1 d2 d3 d4 d5 d6 d7 d8 d9 d10 d11 d12 d13 vss vdd-1 ad20 ad25 vdd-1 gnt/ tdi sdir13 sdir0 sdirp0 sd12 vss-s sd15/ e1 e2 e3 e4 e5 e6 e7 e8 e9 e10 e11 e12 e13 ad16 ad17 ad18 ad19 ad22 req/ serr/ vdd sdir3 sd14/ sd0/ sd1/ vss-s f1 f2 f3 f4 f5 f6 f7 f8 f9 f10 f11 f12 f13 irdy/ frame/ c_be2/ vss vss vss nc sdp1/ sd2/ sd3/ sd4/ vss-s sd5/ g1 g2 g3 g4 g5 g6 g7 g8 g9 g10 g11 g12 g13 vdd devsel/ trdy/ stop/ vss nc nc nc sd6/ sd7/ vss-s satn/ sdp0/ h1 h2 h3 h4 h5 h5 h7 h8 h9 h10 h11 h12 h13 par perr/ c-be1/ vss ad15 ad12 nc diffsens sbsy/ ssel/ smsg/ srst/ sack/ j1 j2 j3 j4 j5 j6 j7 j8 j9 j10 j11 j12 j13 ad14 ad13 vss ad10 vdd-1 td0 vdd gpio_ mas2/ sd11/ sd8/ sreq/ sc_d/ vss-s k1 k2 k3 k4 k5 k6 k7 k8 k9 k10 k11 k12 k13 vdd-1 ad11 vss c_be0/ ad1 gpio1_ master/ mad4 mad0 igs vss sd9/ vss-s si_0/ l1 l2 l3 l4 l5 l6 l7 l8 l9 l10 l11 l12 l13 ad9 ad8 ad4 ad2 vdd-c vss-c mad7 mad1 gpio4 rstdir vdd-s sdir8 sd10/ m1 m2 m3 m4 m5 m6 m7 m8 m9 m10 m11 m12 m13 ad7 nc ad5 vss irq/ sclk mad6 mad3 gpio3 vdd bsydir nc sdir9 n1 n2 n3 n4 n5 n6 n7 n8 n9 n10 n11 n12 n13 ad6 vss ad3 ad0 gpio_ fetch/ tms mad5 mad2 vss tgs seldir sdir11 sdir10 4-6 signal descriptions the pci/scsi pin de?itions are organized into the following functional groups: system, address/data, interface control, arbitration, error reporting, scsi, and optional interface. a slash (/) at the end of the signal name indicates that the active state occurs when the signal is at a low voltage. when the slash is absent, the signal is active at a high voltage. there are four signal type de?itions: i input, a standard input-only signal. o output, a standard output driver (typically a totem pole output). t/s 3-state, a bidirectional, 3-state input/output signal. s/t/s sustained 3-state, an active low 3-state signal owned and driven by one and only one agent at a time. 4-7 table 4.1 describes the LSI53C875, LSI53C875j, LSI53C875e, and LSI53C875je power and ground signals group. table 4.2 describes the LSI53C875n power and ground signals group. table 4.1 LSI53C875, LSI53C875j, LSI53C875e, and LSI53C875je power and ground signals name pin no. description v ss 4, 10, 14, 18, 23, 27, 31, 37, 42, 48, 69, 79, 123, 133, 152, 158 ground to the pci i/o pins. v dd 63, 74, 84, 118, 128, 138 power supplies to the standard i/o pins. v dd-i 1 1. these pins can accept a v dd source of 3.3 v or 5 v. all other v dd pins must be supplied 5 v. 8, 21, 33, 45, 155 v dd pad for pci i/o pins. v ss -s 88, 93, 99, 104, 109, 114 ground to the scsi bus i/o pins. v ss -c 55, 146 ground to the internal logic core. v dd -c 51, 149 power supplies to the internal logic core. table 4.2 LSI53C875n power and ground signals name pin no. description v ss 10, 16, 20, 24, 29, 33, 38, 44, 59, 65, 88, 98, 164, 175, 196, 202 ground to the pci i/o pins. v dd 82, 93, 148, 169, 180 power supplies to the standard i/o pins. v dd-i 1 1. these pins can accept a v dd source of 3.3 v or 5 v. all other v dd pins must be supplied 5 v. 14, 27, 62, 199 v dd pad for pci i/o pins. v ss -s 118, 123, 129, 134, 139, 144 ground to the scsi bus i/o pins. v ss -c 72, 189 ground to the internal logic core. v dd -c 68, 192 power supplies to the internal logic core. 4-8 signal descriptions table 4.3 describes the LSI53C875jb and LSI53C875jbe power and ground signals group. table 4.3 LSI53C875jb and LSI53C875jbe power and ground signals name pin no. description v ss a9, b3, b11, c3, d1, f4, f5, f6, g5, h4, j3, k3, k10, m4, n2, n9 ground to the pci i/o pins. v dd b10, e8, j7, m10 power supplies to the standard i/o pins. v dd-i 1 1. these pins can accept a v dd source of 3.3 v or 5 v. all other v dd pins must be supplied 5 v. d2, d5, g1, j5, k1 v dd pad for pci i/o pins. v dd -s c12, l11 ground to the scsi bus i/o pins. v ss -c l6, c6 ground to the internal logic core. v dd -c a5, l5 power supplies to the internal logic core. 4-9 figure 4.5 is the functional signal grouping for the LSI53C875. figure 4.5 LSI53C875 functional signal grouping LSI53C875 clk rst ad[31:0] c_be[3:0]/ pa r frame/ trdy/ irdy/ stop/ devsel/ idsel req/ gnt/ serr/ perr/ tgs gpio3 gpio0_fetch/ gpio1_master/ mac/_testout irq/ big_lit/ diffsens gpio2_mas2/ mwe/ mce/ moe/ mas0/ system address and data interface control arbitration error reporting scsi mas1/ bsydir rstdir seldir igs sdirp[1:0] sdir[15:0] sclk sd[15:0] sdp[1:0] sctrl additional interface mad[7:0] testin/ external memory interface memory 4-10 signal descriptions table 4.4 describes the system signals group. table 4.4 system signals name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb typ e description clk 145/188/a6 i clock provides timing for all transactions on the pci bus and is an input to every pci device. all other pci signals are sampled on the rising edge of clk, and other timing parameters are de?ed with respect to this edge. clock can optionally serve as the scsi core clock, but this may effect the fast scsi transfer rates. rst/ 144/187/b6 i reset forces the pci sequencer of each device to a known state. all t/s and s/t/s signals are forced to a high impedance state, and all internal logic is reset. the rst/ input is synchronized internally to the rising edge of clk. the clk input must be active while rst/ is active to properly reset the device. 4-11 table 4.5 describes the address and data signals group. table 4.5 address and data signals name pin no. typ e description ad[31:0] LSI53C875 LSI53C875j: 150, 151, 153, 154, 156, 157, 159, 160, 3, 5, 6, 7, 9, 11, 12, 13, 28, 29, 30, 32, 34, 35, 36, 38, 40, 41, 43, 44, 46, 47, 49, 50 LSI53C875n: 194, 195, 197, 198, 200, 201, 203, 204, 9, 11, 12, 13, 15, 17, 18, 19, 35, 36, 37, 39, 41, 42, 43, 45, 48, 58, 60, 61, 63, 64, 66, 67 LSI53C875jb: b5, c5, a4, b4, a3, c4, d4, a2, c2, e5, c1, d3, e4, e3, e2, e1, h5, j1, j2, h6, k2, j4, l1, l2, m1, n1, m3, l3, n3, l4, k5, n4 t/s physical longword address and data are multiplexed on the same pci pins. during the ?st clock of a transaction, ad[31:0] contain a physical address. during subsequent clocks, ad[31:0] contain data. a bus transaction consists of an address phase, followed by one or more data phases. pci supports both read and write bursts. ad[7:0] de?e the least signi?ant byte, and ad[31:24] de?e the most signi?ant byte. c_be[3:0]/ LSI53C875 LSI53C875j: 1, 15, 26, 39 LSI53C875n: 6, 21, 32, 46 LSI53C875jb: a1,f3, h3, k4 t/s bus command and byte enables are multiplexed on the same pci pins. during the address phase of a transaction, c_be[3:0]/ de?e the bus command. during the data phase, c_be[3:0]/ are used as byte enables. the byte enables determine which byte lanes carry meaningful data. c_be[0]/ applies to byte 0, and c_be[3]/ to byte 3. 4-12 signal descriptions table 4.6 describes the interface control signals group. par LSI53C875, LSI53C875j: 25 LSI53C875n: 31 LSI53C875jb: h1 t/s parity is the even parity bit that protects the ad[31:0] and c_be[3:0]/ lines. during address phase, both the address and command bits are covered. during data phase, both data and byte enables are covered. bytepar[3:0] (LSI53C875n only) 193, 8, 34, 47 t/s when the pci byte parity pins are enabled, the LSI53C875n checks each byte of incoming data on the pci bus against its corresponding parity line, in addition to the normal parity checking against the pci par signal. this extra parity checking/generation is always enabled for the LSI53C875n. is not register selectable. a parity error on any byte parity pin for pci master read or slave write operation causes a fatal dma interrupt and scripts stops running. mask this interrupt with the extended byte parity enable bit, bit 1 of the dma interrupt enable (dien) register. table 4.5 address and data signals (cont.) name pin no. typ e description table 4.6 interface control signals name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description frame/ 16/22/f2 s/t/s cycle frame is driven by the current master to indicate the beginning and duration of an access. frame/ is asserted to indicate a bus transaction is beginning. while frame/ is asserted, data transfers continue. when frame/ is deasserted, the transaction is in the ?al data phase or the bus is idle. trdy/ 19/25/g3 s/t/s target ready indicates the target agent s (selected device s) ability to complete the current data phase of the transaction. trdy/ is used with irdy/. a data phase is completed on any clock when both trdy/ and irdy/ are sampled asserted. during a read, trdy/ indicates that valid data is present on ad[31:0]. during a write, it indicates the target is prepared to accept data. wait cycles are inserted until both irdy/ and trdy/ are asserted together. 4-13 table 4.7 describes the arbitration signals group. irdy/ 17/23/f1 s/t/s initiator ready indicates the initiating agent s (bus master s) ability to complete the current data phase of the transaction. irdy/ is used with trdy/. a data phase is completed on any clock when both irdy/ and trdy/ are sampled asserted. during a write, irdy/ indicates that valid data is present on ad[31:0]. during a read, it indicates that the master is prepared to accept data. wait cycles are inserted until both irdy/ and trdy/ are asserted together. stop/ 22/28/g4 s/t/s stop indicates that the selected target is requesting the master to stop the current transaction. devsel/ 20/26/g2 s/t/s device select indicates that the driving device has decoded its address as the target of the current access. as an input, it indicates to a master whether any device on the bus has been selected. idsel 2/7/b1 i initialization device select is used as a chip select in place of the upper 24 address lines during con?uration read and write transactions. table 4.6 interface control signals (cont.) name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description table 4.7 arbitration signals name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb typ e description req/ 148/191/e6 o request indicates to the system arbiter that this agent desires use of the pci bus. this is a point-to-point signal. every master has its own req/ signal. gnt/ 147/190/d6 i grant indicates to the agent that access to the pci bus has been granted. this is a point-to-point signal. every master has its own gnt/ signal. 4-14 signal descriptions table 4.8 describes the error reporting signals group. table 4.8 error reporting signals name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description perr/ 24/30/h2 s/t/s parity error may be pulsed active by an agent that detects a data parity error. perr/ can be used by any agent to signal data corruptions. serr/ 143/186/e7 o system error is an open drain output used to report address parity errors. on detection of a perr/ pulse, the central resource generates a nonmaskable interrupt to the host cpu, which often implies the system is unable to continue operation once error processing completes. 4-15 table 4.9 describes the scsi signals group. table 4.9 scsi signals name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description sclk 56/73/m6 i scsi clock is used to derive all scsi-related timings. the speed of this clock is determined by the application s requirements. in some applications sclk may be sourced internally from the pci bus clock (clk). if sclk is internally sourced, then the sclk pin should be tied low. sd[15:0]/, sdp[1:0]/ LSI53C875, LSI53C875j: 113, 115, 116, 117, 85, 86, 87, 89, 102, 103, 105, 106, 107, 108, 110, 111, 112, 101 LSI53C875n: 143, 145, 146, 147, 115, 116, 117, 119, 132, 133, 135, 136, 137, 138, 140, 141, 142, 131 LSI53C875jb: d13, e10, c13, d11, j9, l13 k11, j10, g10, g9, f13, f11, f10, f9, e12, e11, f8, g13 i/o scsi data includes the following data lines and parity signals: sd[15:0]/ (16-bit scsi data bus), and sdp[1:0]/ (scsi data parity bits). 4-16 signal descriptions sctrl/ LSI53C875, LSI53C875j: 92, 90, 95, 91, 97, 98, 100, 96, 94 LSI53C875n: 122, 120, 125, 121, 127, 128, 130, 126, 124 LSI53C875jb: j12, k13, h11, j11, h13, h9, g12, h12, h10 i/o scsi control includes the following signals: sc_d/ scsi phase line, command/data si_o/ scsi phase line, input/output smsg/ scsi phase line, message sreq/ data handshake signal from target device sack/ data handshake signal from initiator device sbsy/ scsi bus arbitration signal, busy satn/ scsi attention, the initiator is requesting a message out phase srst/ scsi bus reset ssel/ scsi bus arbitration signal, select device sdir[15:0] LSI53C875, LSI53C875j: 131, 132, 134, 135, 80, 81, 82, 83, 120, 121, 122, 124, 125, 126, 127, 129 LSI53C875n: 173, 174, 176, 177, 99, 111, 112, 113, 150, 162, 163, 165, 166, 167, 168, 170 LSI53C875jb: c9, b9, d8, c8, n12, n13, m13, l12, b13, a13, a12, c11, e9, a11, c10, d9 o driver direction control for scsi data lines. table 4.9 scsi signals (cont.) name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description 4-17 sdirp[1:0] (sdipr1 is not available on LSI53C875j, LSI53C875jb) 130, 119; na, 119/171, 149/na, d10 o driver direction control for scsi parity signals. in the LSI53C875j and LSI53C875jb, this pin is replaced by the tck jtag signal. if the device is used in a wide differential system, use the sdirp0 pin to control the direction of the differential transceiver for both the sp0 and sp1 signals. the sdirp0 signal is capable of driving both direction inputs from a transceiver. seldir 76/95/n11 o driver enable control for scsi sel/ signal. rstdir 77/96/l10 o driver enable control for scsi rst/ signal. bsydir 78/97/m11 o driver enable control for scsi bsy/ signal. igs 75/94/k9 o direction control for initiator driver group. tgs 73/92/n10 o direction control for target driver group. table 4.9 scsi signals (cont.) name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description 4-18 signal descriptions table 4.10 describes the additional interface signals group. table 4.10 additional interface signals name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description testin (not available on LSI53C875j, LSI53C875jb) 57, na/74/na i test in . when this pin is driven low, the LSI53C875 connects all inputs and outputs to an ?nd tree. the scsi control signals and data lines are not connected to the ?nd tree. the output of the ?nd tree is connected to the test out pin. this allows manufacturers to verify chip connectivity and determine exactly which pins are not properly attached. when the testin pin is driven low, internal pull-ups are enabled on all input, output, and bidirectional pins, all outputs and bidirectional signals will be 3-stated, and the mac/_testout pin will be enabled. connectivity can be tested by driving one of the LSI53C875 pins low. the mac/_testout pin should respond by also driving low. gpio0_ fetch/ 53/70/n5 i/o general purpose i/o pin. optionally, when driven low, this pin indicates that the next bus request will be for an opcode fetch. this pin powers up as a general purpose input. this pin has two speci? purposes in the lsi logic sdms software. sdms software uses it to toggle scsi device leds, turning on the led whenever the LSI53C875 is on the scsi bus. sdms software drives this pin low to turn on the led, or drives it high to turn off the led. this signal can also be used as data i/o for serial eeprom access. in this case it is used with the gpio0 pin, which serves as a clock, and the pin can be controlled from pci con?uration register 0x35 or observed from the general purpose (gpreg) operating register, at address 0x07. gpio1_ master/ 54/71/k6 i/o general purpose i/o pin. optionally, when driven low, indicates that the LSI53C875 is bus master. this pin powers up as a general purpose input. lsi logic sdms software supports use of this signal in serial eeprom applications, when enabled, in combination with the gpio0 pin. when this signal is used as a clock for serial eeprom access, the gpio1 pin serves as data, and the pin is controlled from pci con?uration register 0x35. 4-19 gpio[4:3] 71, 70/90, 89/l9, m9 i/o general purpose i/o pins. gpio4 powers up as an output. it can be used as the enable line for v pp , the 12 v power supply to the external flash memory interface. gpio3 powers up as an input. lsi logic sdms software uses gpio3 to detect a differential board. if the pin is pulled low externally, the board is con?ured by sdms software as a differential board. if it is pulled high or left ?ating, sdms software con?ures it as an se board. the lsi logic pci to scsi host adapters use the gpio4 pin in the process of ?shing a new sdms software rom. diffsens 72/91/h8 i the differential sense pin detects the presence of an se device on a differential system. when external differential transceivers are used and a zero is detected on this pin, all chip scsi outputs will be 3-stated to avoid damage to the transceivers. this pin should be tied high during se operation. the normal value of this pin is 1. mac/_ testout (not available on LSI53C875, LSI53C875jb) 58, na/76/na t/s memory access control . this pin can be programmed to indicate local or system memory accesses (non-pci applications). it is also used to test the connectivity of the LSI53C875 signals using an ?nd tree scheme. the mac/_testout pin is only driven as the test out function when the testin/ pin is driven low. irq/ 52/69/m5 o interrupt . this signal, when asserted low, indicates that an interrupting condition has occurred and that service is required from the host cpu. the output drive of this pin is programmed as either open drain with an internal weak pull-up or, optionally, as a totem pole driver. refer to the description of dma control (dcntl) register, bit 3, for additional information. table 4.10 additional interface signals (cont.) name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description 4-20 signal descriptions big_lit/ (not available on LSI53C875j, LSI53C875jb) 142, na/184/na i big_little endian select . when this pin is driven low, the LSI53C875 routes the ?st byte of an aligned scsi to pci transfer to byte lane zero of the pci bus and subsequent bytes received are routed to ascending lanes. an aligned pci to scsi transfer routes pci byte lane zero onto the scsi bus ?st, and transfers ascending byte lanes in order. when this pin is driven high, the LSI53C875 routes the ?st byte of an aligned scsi-to-pci transfer to byte lane three of the pci bus and subsequent bytes received are routed to descending lanes. an aligned pci-to-scsi transfer routes pci byte lane three onto the scsi bus ?st and transfers descending byte lanes in order. this mode of operation also applies to the external memory interface. when this pin is driven in little endian mode and the chip is performing a read from external memory, the byte of data accessed at location 0x00000 is routed to pci byte lane zero and the data accessed at location 0x00003 is routed to pci byte lane three. when the chip is performing a write to flash memory, pci byte lane zero is routed to location 0x00000 and ascending byte lanes are routed to subsequent memory locations. when this pin is driven in big endian mode and the chip is performing a read from external memory, the byte of data accessed at location 0x00000 is routed to pci byte lane three and the data accessed at location 0x00003 is routed to byte lane zero. when the chip is performing a write to flash memory, pci byte lane three is routed to location 0x00000 and descending byte lanes are routed to subsequent memory locations. table 4.10 additional interface signals (cont.) name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb type description 4-21 table 4.11 describes the external memory interface signals group. table 4.11 external memory interface signals name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb typ e description mas0/ 137/179/a8 o memory address strobe 0 . this pin is used to latch in the least signi?ant address byte of an external eprom or flash memory. since the LSI53C875 moves addresses eight bits at a time, this pin connects to the clock of an external bank of ?p-?ps which are used to assemble up to a 20-bit address for the external memory. mas1/ 136/178/b8 o memory address strobe 1 . this pin is used to latch in the address byte corresponding to address bits [15:8] of an external eprom or flash memory. since the LSI53C875a moves addresses eight bits at a time, this pin connects to the clock of an external bank of ?p-?ps which assemble up to a 20-bit address for the external memory. mad[7:0] LSI53C875, LSI53C875e, LSI53C875j, LSI53C875je: 59, 60, 61, 62, 64, 65, 66, 67 59, 60, 61, 62, 64, 65, 66, 67 LSI53C875n: 78, 79, 80, 81, 83, 84, 85, 86 LSI53C875jb, LSI53C875jb e: l7, m7, n7, k7, m8, n8, l8, k8 i/o memory address/data bus . this bus is used in conjunction with the memory address strobe pins and external address latches to assemble up to a 20-bit address for an external eprom or flash memory. this bus will put out the most signi?ant byte ?st and ?ish with the least signi?ant bits. it is also used to write data to a flash memory or read data into the chip from external eprom/flash memory. see section 4.1, ?ad bus programming, for more details. mwe/ 139/181/c7 o memory write enable . this pin is used as a write enable signal to an external flash memory. moe/ 140/182/b7 o memory output enable . this pin is used as an output enable signal to an external eprom or flash memory during read operations. mce/ 141/183/a7 o memory chip enable . this pin is used as a chip enable signal to an external eprom or flash memory device. 4-22 signal descriptions table 4.12 describes the jtag signals group for the LSI53C875j, LSI53C875n, and LSI53C875jb. 4.1 mad bus programming the mad[7:0] pins, in addition to serving as the address/data bus for the local memory interface, are also used to program power-up options for the chip. a particular option is programmed by connecting a 4.7 k ? resistor between the appropriate mad[x] pin and vss. the pull-down resistors require that hc or hct external components are used for the memory interface. ? mad[7] has no functionality. do not place a pull-down resistor on this pin. gpio2_ mas2/ 68 /87/j8 i/o general purpose i/o pin. optionally, this pin is used as a memory address strobe 2 if an external memory with more than 16 bits of addressing is speci?d by the pull-down resistors at power-up and bit 0 in the expansion rom base address register is set. table 4.11 external memory interface signals (cont.) name pin no. LSI53C875, LSI53C875j, LSI53C875n, LSI53C875jb typ e description table 4.12 jtag signals (LSI53C875j/LSI53C875n/LSI53C875jb only) name pin no. LSI53C875j, LSI53C875n, LSI53C875jb type description tck 130/172/a10 test clock pin for jtag boundary scan. tms 57/75/n6 test mode select pin for jtag boundary scan. tdi 142/185/d7 test data in pin for jtag boundary scan. tdo 58/77/j6 test data out pin for jtag boundary scan. mad bus programming 4-23 ? mad[6] subsystem data con?uration. refer to table 4.13 and table 4.14 for the different con?urations. ? mad[5] scripts ram disable. connecting a 4.7 k ? resistor between mad[5] and vss disables scripts ram. ? mad[4] subsystem data con?uration. refer to table 4.13 and table 4.14 for the different con?urations. note: the chip revisions before revision g of the LSI53C875 (pci rev id 0x04) do not support different subsystem data con?urations. the subsystem id (ssid) and subsystem vendor id (ssvid) registers are hard wired to zero values. ? mad[3:1] used to set the size of the external expansion rom device attached. encoding for these pins are listed in table 4.15 . table 4.13 subsystem data con?uration table for the LSI53C875e (pci rev id 0x26) mode mad pins offset normal 4-hi, 6-hi read/write 4-hi, 6-lo reserved 4-low, 6-hi lsi logic 4-low, 6-lo vendor id 0x00 0x1000 0x1000 0x1000 device id 0x02 0x000f 0x000f 0x000f subsystem vendor id 0x2c 0x1000 0x0000 0x0000 subsystem id 0x2e 0x1000 0x0000 0x0000 table 4.14 subsystem data con?uration table for the LSI53C875 (pci rev id 0x04), revision g only mode mad pins offset normal 4-hi, 6-hi read/write 4-hi, 6-lo reserved 4-low, 6-hi lsi logic 4-low, 6-lo vendor id 0x00 0x1000 0x1000 0x1000 device id 0x02 0x000f 0x000f 0x000f subsystem vendor id 0x2c 0x1000 0x0000 0x0000 subsystem id 0x2e 0x1000 0x0000 0x0000 4-24 signal descriptions ? mad[0] slow rom pin. when pulled down, it enables two extra clock cycles of data access time to allow use of slower memory devices. note: all mad pins have internal pull-up resistors. table 4.15 external memory support mad[3:1] available memory space 000 16 kbytes 001 32 kbytes 010 64 kbytes 011 128 kbytes 100 256 kbytes 101 512 kbytes 110 1024 kbytes 111 no external memory present LSI53C875/875e pci to ultra scsi i/o processor 5-1 chapter 5 scsi operating registers this section contains descriptions of all LSI53C875 operating registers. table 5.1 lists registers by operating and con?uration addresses. the terms ?et and ?ssert are used to refer to bits that are programmed to a binary one. similarly, the terms ?eassert, ?lear, and ?eset are used to refer to bits that are programmed to a binary zero. any bits marked as reserved should always be written to zero; mask all information read from them. reserved bit functions may be changed at any time. unless otherwise indicated, all bits in registers are active high, that is, the feature is enabled by setting the bit. the bottom row of every register diagram shows the default register values, which are enabled after the chip is powered on or reset. note: the only register that the host cpu can access while the LSI53C875 is executing scripts is the interrupt status (istat) register. attempts to access other registers interferes with the operation of the chip. however, all operating registers are accessible with scripts. all read data is synchronized and stable when presented to the pci bus. the LSI53C875 cannot fetch scripts instructions from the operating register space. instructions must be fetched from system memory or the internal scripts ram. 5-2 scsi operating registers . table 5.1 LSI53C875 register map 31 16 15 0 mem i/o con? scntl3 scntl2 scntl1 scntl0 0x00 0x80 gpreg sdid sxfer scid 0x04 0x84 sbcl ssid socl sfbr 0x08 0x88 sstat2 sstat1 sstat0 dstat 0x0c 0x8c dsa 0x10 0x90 reserved istat 0x14 0x94 ctest3 ctest2 ctest1 reserved 0x18 0x98 temp 0x1c 0x9c ctest6 ctest5 ctest4 dfifo 0x20 0xa0 dcmd dbc 0x24 0xa4 dnad 0x28 0xa8 dsp 0x2c 0xac dsps 0x30 0xb0 scratch a 0x34 0xb4 dcntl sbr dien dmode 0x38 0xb8 adder 0x3c 0xbc sist1 sist0 sien1 sien0 0x40 0xc0 gpcntl macntl swide slpar 0x44 0xc4 respid1 respid0 stime1 stime0 0x48 0xc8 stest3 stest2 stest1 stest0 0x4c 0xcc reserved sidl 0x50 0xd0 reserved sodl 0x54 0xd4 reserved sbdl 0x58 0xd8 scratch b 0x5c 0xdc scratch c 0x60 0xe0 scratch d 0x64 0xe4 scratch e 0x68 0xe8 scratch f 0x6c 0xec scratch g 0x70 0xf0 scratch h 0x74 0xf4 scratch i 0x78 0xf8 scratch j 0x7c 0xfc 5-3 register: 0x00 (0x80) scsi control zero (scntl0) read/write arb1[1:0] arbitration mode bits 1 and 0 [7:6] simple arbitration 1. the LSI53C875 waits for a bus free condition to occur. 2. it asserts sbsy/ and its scsi id (contained in the scsi chip id (scid) register) onto the scsi bus. if the ssel/ signal is asserted by another scsi device, the LSI53C875 deasserts sbsy/, deasserts its id, and sets the lost arbitration bit (bit 3) in the scsi status zero (sstat0) register. 3. after an arbitration delay, the cpu should read the scsi bus data lines (sbdl) register to check if a higher priority scsi id is present. if no higher priority id bit is set, and the lost arbitration bit is not set, the LSI53C875 wins arbitration. 4. once the LSI53C875 wins arbitration, ssel/ must be asserted using the scsi output control latch (socl) for a bus clear plus a bus settle delay (1.2 s) before a low level selection is performed. full arbitration, selection/reselection 1. the LSI53C875 waits for a bus free condition. 76543210 arb[1:0] start watn epc r aap trg 11000 x00 arb1 arb0 arbitration mode 0 0 simple arbitration 0 1 reserved 1 0 reserved 1 1 full arbitration, selection/reselection 5-4 scsi operating registers 2. it asserts sbsy/ and its scsi id (the highest priority id stored in the scsi chip id (scid) register) onto the scsi bus. 3. if the ssel/ signal is asserted by another scsi device or if the LSI53C875 detects a higher priority id, the LSI53C875 deasserts bsy, deasserts its id, and waits until the next bus free state to try arbitration again. 4. the LSI53C875 repeats arbitration until it wins control of the scsi bus. when it wins, the won arbitration bit is set in the scsi status zero (sstat0) register, bit 2. 5. the LSI53C875 performs selection by asserting the following onto the scsi bus: ssel/, the target s id (stored in the scsi destination id (sdid) register), and the LSI53C875 |