doc. no : qw0905-la38w-128/eg-pf rev. : a date : 07 - nov. - 2008 data sheet la38w-128/eg-pf led array ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
leg4192-pf part no. la38w-128/eg-pf package dimensions page 1/6 ligitek electronics co.,ltd. property of ligitek only 1 23 e g 1.anode green 2.common cathode 3.anode orange note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1 2 3 0.5 typ 12.5min 2.0min 2.54typ 2.0min 2.54typ 3.1 3.8 5.7 6.7 5.0 2.0min 2.0min 2.54typ 2.54typ 5.7 6.7 18.0min 0.5 typ 1 2 3 3.8 3.1 7.9 0.5 1.anode green 2.common cathode 3.anode orange 3 2 1 g e 5.5 black dot note : the black dot stand for the anode orange side.
-40 ~ +100 tstg storage temperature viewing angle 2 1/2 (deg) spectral halfwidth nm peak wave length pnm material part no la38w-128/eg-pf note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. 565 gap green orange emitted gaasp/gap white diffused 635 lens 116 2.6 1.7 30 typ. 451.72.6 min. max. min. 116 typical electrical & optical characteristics (ta=25 ) color luminous intensity @10ma(mcd) forward voltage @20ma(v) page 2/6 forward current absolute maximum ratings at ta=25 power dissipation reverse current @5v operating temperature peak forward current duty 1/10@10khz 30 ma i f t opr ir pd i fp -40 ~ +85 10 a 100 120 mw ma parameter e symbol ratings g unit ligitek electronics co.,ltd. property of ligitek only 30 120 100 10 6.5 5.0 4.0 3.0 part no. la38w-128/eg-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 wavelength (nm) 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 10 1.0 1000 e chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 0.5 forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 700750 page 3/6 part no. la38w-128/eg-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip page 4/6 part no. la38w-128/eg-pf
dip soldering preheat: 120 xc max preheat time: 120seconds max ramp-up 2 xc/sec(max) ramp-down:-5 xc/sec(max) solder bath:265 xc max dipping time:5 seconds max distance:2mm min(from solder joint to case) temp( xc) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 xc max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 5/6 100 0 preheat 25 0 120 2 x/sec max 250 200 time(sec) 265 5 x/sec max 265 xc5sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 120 seconds max part no. la38w-128/eg-pf
the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test reliability test: test condition test item mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 page 6/6 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard part no. la38w-128/eg-pf
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