doc. no : qw0905-l rev. : date : a209b-1/2xyxg2x-pf - 2005 29 - nov. b data sheet led array ligitek electronics co.,ltd. property of ligitek only la209b-1/2xyxg2x-pf pb lead-free parts
la209b-1/2xyxg2x-pf 0.5 typ package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. - + ly45840/f181-pf lg45840/f181-pf 2.54 g 1.5 y 4.6 part no. 6.8 0.5 3.8typ 2.1 3.2 0.3 ligitek electronics co.,ltd. property of ligitek only 2.2 0.5 18.3 17.3 page 1/6 29.5 0.5 1.0min 2.54typ + - 0.5 typ 3.2 1.9 4.0 1.5 max 1.9 1.0
yellow diffused green diffused typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. la209b-1/2xyxg2x-pf part no yellow emitted green gap gaasp/gap lens material color 8.0 8.0 min. luminous intensity @10ma(mcd) peak wave length pnm 30 565 58535 2.6 1.7 1.7 2.6 min.max. spectral halfwidth nm forward voltage @ ma(v) 20 viewing angle 2 1/2 (deg) 78 12 12 78 typ. absolute maximum ratings at ta=25 power dissipation reverse current @5v storage temperature operating temperature peak forward current duty 1/10@10khz forward current t opr tstg ir i fp pd i f parameter part no. symbol ligitek electronics co.,ltd. property of ligitek only -40 ~ +85 10 -40 ~ +100 120 100 30 80 60 20 a ma mw ma ratings g y unit page 2/6 la209b-1/2xyxg2x-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip part no. 3/6 page la209b-1/2xyxg2x-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 500 0.0 0.5 wavelength (nm) 650 550 600 -40 fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -40 60 ambient temperature( ) 40 20 0 -20100 80 0.0 ambient temperature( ) 02040 -20 60100 80 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 1.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 10 1.0 1000 g chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 0.5 4.0 forward voltage(v) 2.03.05.0 0.0 1.5 1.0 2.0 100 forward current(ma) 101000 fig.2 relative intensity vs. forward current 2.5 3.0 ligitek electronics co.,ltd. property of ligitek only 3.5 part no. page4/6 la209b-1/2xyxg2x-pf
ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) part no. page 5/6 260 c3sec max 260 temp( c) 2 /sec max 100 50 0 preheat 150 time(sec) 120 25 0 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 60 seconds max la209b-1/2xyxg2x-pf
the purpose of this test is the resistance of the device under tropical for hous. high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202:103b jis c 7021: b-11 thermal shock test solder resistance test solderability test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. ligitek electronics co.,ltd. property of ligitek only high temperature storage test operating life test low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) reliability test: test item part no. test condition the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description reference standard 6/6 page la209b-1/2xyxg2x-pf
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