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prepared by: date: zj-dtx /t6 /?7? t. cleda electronic components group sharp corporation s pec~cation 1 opto-electronic devices division model no. 1 device specification for light emitting diode i GL6ZJ27 i 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharps consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas; l * oa equipment * audio visual equipment * home appliance * telecommunication equipment (terminal) * measuring equipment * tooling machines * computers 1 if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; c * transportation control and safety equipment (aircraft, train, automobile etc.) * traffic signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment 1 (3) please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; c * space equipment * telecommunication equipment (for trunk lines) * nuclear power control equipment * medical equipment 1 (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. customer?s approval. date: presented by: date: mkatoh, department general manager of engineering dept.,ih ooto-electronic devices division by: eiectronic components group sharp corporation
dg996048 jun/16/99 model no. page gl6zl27 l/10 _ gl6zt27 snecification 1. application this specification applies to the light emitting diode device model no. GL6ZJ27. [algalnp (dicing or scribe/brake type) grange led device] 2. outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . ..*................ refer to the attached sheet page 3-4. 3- 1. absolute maximum ratings 3-2. electra-optical characteristics 3-3. derating curve 3-4. characteristics diagram 4. reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............ refer to the attached sheet page 5. 4- 1. test items and test conditions 4-2. measurement items and failure judgement criteria 5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*......... refer to the attached sheet page 6. 5- 1. applied standard 5-2. sampling method and level 5-3. test items, judgement criteria and classifica of defect 54. test items the surface is be applied for flat type, judgement criteria and classifica of defect 6. supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............... refer to the attached sheet page 7-8. 6-l. packing 6-2. luminous intensity rank 6-3. dominant wavelength rank 6-4. environnient 7. precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 9- 10. 7- 1. lead forming method 7-2. notice of installation 7-3. soldering conditions .7-4. for cleaning
ix996048 jun/16/99 model no. page 2 ~the dimensions and pin comections i i 2. 54 om colorless transparency pin comections 0. anode 0. cathode iote) unspecified tol. to be +0&m rote) cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. unit mm material lead : (fe) cold rolled steel package : epoxy resin fiih drawing no. lead : sn plated or wave soldering 51106029
dg996048 junl16l99 model no. page GL6ZJ27 3110 3. ratings and characteristics \ (note 1) duty ratb=l/lo,pulse tidth=o. lms (note 2) at the position of 1.6mm from the bottom resin package (note 3) refer to the suplement item 6. regarding the standard of rank classification. 3-3. derating curve peak forward current derating curve forward current derating curve 120 5 - 100 e -25 0 25 50 1585100 125 ambient temperature ta?c) 01 i i i i 1 -25 0 25 50 795 i 100 125 ambient temperature ta("c)
dg996048 .jun/16/99 model no. page GL6ZJ27 4110 peak forward current vs. duty ratio (ta=25%) l/100 l/10 1 10 duty raito dr 3-4. characteristics diagram(typ) (note 11 forward current vs.forward voltage (ta=25?c) o.l"!"'ir""""' j 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 forward voltage vfw) relative luminous intensity vs. froward voltage (ta=25"c) 1000 :: .- 2 100 2 10 2 oh .e e 5 1 -j 2 .- 0. 1 + 2 d 0.01 0. 1 1 10 100 forward current ifw) 1000 relative luminous intensity vs. ambient temperature s .- t e 2 100 o- .f e 5 2 e .- ?fl z 10 ( i f=2oma) -60 -40 -20 0 20 40 60 80 100 120 ambient temprature ta(oc)- (note l)above characteristicdataaretypicaldata andnotagumtteeddata.
dg996048 jun/16/99 model no. page GL6ZJ27 5/10 4. reliability the reliability of products shall be satisfied with items listed below. t-1. test items and test conditions test items test conditions solderability 23or+5'=c. 5s prior disposition : dip in rosin flux soldering temperature 26025c. 5s mechanical shock 15 ooom/s*, 0.5ms, 3tirnes / s,fy,iz direction variabie frequency 2olh/s*, 100 to 2 000 to looh&weep for 4min. vibration ,4times/&iy ,ez direction terminal strength (tension) weight:lon. ss/each terminal terminal strength weight:sn, 0? -90? -+ oq -90? -+ 0? (bending) /each terminai temperature cycling -40~(3omin)~+l~?c(3~in),30 cycles high temp* and high humidity storage ta=+60?c, 9o%rh, t=loooh tigh temperature storage ta=loo?c, t=loooh ow temperature storage ta=-40=, t=loooh operation life ta=25?c, irmax, t=loooh *3 confidence level: 904 samples (n) ltpd defective (cl (%) n=ll. c=o 20 n=ll, c=o 20 n=ll, c=o 20 n=ll, c=o 20 n=ll, c=o 20 n=ll, c=o 20 n=22, c=o 10 n=22, c=o 10 n=22,c=-o 10 n=22, c=o 10 n=22, c=o 10 4-2. measurement items and failure judgement criteria * 1 measurement qillbol failure judgement criteria *2 forward voltage vf v,>u.s.l.x 1.2 reverse current ir i,>u.s.l.x 2.0 j.mninous intensity iv iv > the first stage value x 2.0 or the first stage value x 0.5 > iv s solderability : sol&r shall be adhere at the area of 95% or more of dipped portion. z terminal strength : package is not destroyed, and terminal is not slack. *l: measuring condition is in accordance with specification. *2: u.s.l. is shown by upper specification limit. *3: lr max.is shown by forward current of absolute maximum ratings.
dg996048 i jun/16/9! model no. 1 page i gl62j27 6110 5. incoming inspection 5-l. applied standard : is0 2859-l 5-2. sampling method and level : a single sampling phn,normal inspection level ii : aql major defect : 0.065% minor defect : 0.4% classifica of defer exceed 9 0.3mm or o.lmm x 1. 9 void exceed @ 0.3mm (on top view) 10 uneven density of material for scattering extremely uneven density 11 unbalanced center exceed m.25mm from package center 12 bult exceed +0.2mm againstprovided dimension 13 insertion position of terminal insertion position of terminal 5-4. test items the surface is be applied for flat type, judgement criteria and classifica of defect no. test items judgement criteria classifica of defect 14 chapped the surface the surface chapped is striking for see the lamp top minor defect 15 hollow the surface the surface hollow is striking for see the lamp top
dg996048 model no. .tunll61w page i gl6z27 i 7110 6. supplement 6-l. packing 6-l-l. inner package put 25opcs the same luminous intensity rank products into pack and put following label by pack. product weight : 0.28g (one prodwt,typ.) (indication label sample) shipment table part no. GL6ZJ27 + mcdel number quanxty 250 - quantity of products *cl cl 00000 lot no. ka99b19 * lot number * 0 0 -5-g 0 o-0 t- luminous intensity rank sharp? dominant wavelength rank afade in japan + production country 0 production plant ccxie(to be indicated alphabetically) @ support code @ year of prcduction(the last two figures of the year) @ month of production (to be indicated alphabetically with january corresponding to a) @ date of production(ol-31) 6-l-2. outer package put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. outer package out line dimension width: 14omm. depth: 225mm. hight: 90mm (note 1) tolerance:fls% in regard to luminous intensity , the following ranking shall be carried however the quantity of each rank shall not be pre scribed. in case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. out. 6-3.dominant wavelength rank (note 2) (ta=25?c) rank dominant wavelength unit condition t 613.5 - 617.0 u 616.0 - 619.5 v 618.5 - 622.0 nm if2oma w 621.0 - 624.5 x 623.5 - 627.0 (note 2) the condition of measurement : the measurement of the light emission from the front side of lamp. this rank value is the setting value of when that classifies it the rank and be not a guarantee value. also i shall not ask the delivery ratio of each rank.
. do996048 junl16/99 modelno. page i GL6ZJ27 1 8/10 64. environment 6-4-l. ozonosphere destructive chemicals. (1) the &vice doesn?t contain following substance. (2) the &vice doesn?t have a production line whose process nquires following substance. restricted part: cfcsjlalones,ccb,trichloroethane(methych) i 642. bromic non-burning materials the &vice doesn?t contain bromic non-burning materials(pbbos,pbbs)
dg996048 i jud16/99 model no. ( page GL6ZJ27 g/10 7. precautions for use 7 - 1. lead forming method avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. lead pins should be forsed before soldering. - y)&+fjjp- 7 - 2. notice of installation d~cn formint c 7-2-l installation on a p w b vhen mounting an led lamp on a pw. do not apply physical stress to the lead pins. *the lead pin pitch should match the pllb pin-hole pitch:absolutely avoid widening or narrowing the lead pins. l bhen positioning an led lamp,basically employ an led with tie-bar cut or use a spacer. 7-2-2 !yhen an led 1 is mounted directly on a p wb if the bottom face of an led lamp is mounted directly on single-sided pve$the base of the lead pins may be subjected to physical stress due to pwb warp,cutting or clinching of lead pins. prior to? use, be sure to check that no disconnection inside of the resin or damage to resin etc.,is found.yhen an led lamp is mounted on a double-sided ptbthe heat during soldering affects the resin;therefore,keep the led lamp more that 1.6mm afloat above the pwb. 7-2-3 installation using a holder during an led lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (note)pay attention to the thermal expansion coefficient of the material used for the holder.since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 installation to the case do not fix part c with adhesives when fixed to the case as shown in figure.a hole of the case should ide of resin be designed not to subject the ins to any undue stress. ng good 0 i c !. 6mm i
do48 junhy99 modelno. page GL6ZJ27 lo/lo 7 - 3. s oldering conditions solder the lead pins under the following conditions type of soldering conditions 1. manual soldering 295c *s?c. within 3 seconds 2. wave soldering 260c k 5c. within 5 seconds 3. auto soldering preheating 70c to 8oc, within 30 seconds s oldering 245c f yc, within 5 seconds (note) avoid dinning resin into soldering bath. avoid applying stress to lead pins while they are heated-for example , when the led lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur. i ton 7 - 4. for cleaning ( 1) solvent cleaning : solvent temperature 45c or less immersion for 3 min or less (2 > ultrasonic cleaning : the effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,pm size or device mounting condition etc. please test it in actual using condition and confirm that doesn?t occur any defect before starting the ultrasonic cleaning. ( 3 > applicable solvent : ethyl alcohol, methyl alcohol, isopropyl alcohol in case when the other solvent -is used, there are cases that the packaging resin is eroded. please use the other solvent after thorough confirmation is performed in actual using condition.

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