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user?s manual target device v850e/ia1 tm IE-703116-MC-EM1 in-circuit emulator option board document no. u14700ej2v0um00 (2nd edition) date published august 2001 n cp(k) printed in japan ? 2001
user?s manual u14700ej2v0um 2 [memo]
user?s manual u14700ej2v0um 3 v850e/ia1 is a trademark of nec corporation. windows is either a registered trademark or a trademark of microsoft corporation in the united states and/or other countries. pc/at is a trademark of international business machines corporation. ethernet is a trademark of xerox corporation. unix is a registered trademark in the united states and/or other countries, licensed exclusively through x/open company limited. m8e 00. 4 the information in this document is current as of july, 2001. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the po ssibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": com puters, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?
user ? s manual u14700ej2v0um 4 regional information some information contained in this document may vary from country to country. before using any nec product in your application, piease contact the nec office in your country to obtain a list of authorized representatives and distributors. they will verify: ? device availability ? ordering information ? product release schedule ? availability of related technical literature ? development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, ac supply voltages, and so forth) ? network requirements in addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. nec electronics inc. (u.s.) santa clara, california tel: 408-588-6000 800-366-9782 fax: 408-588-6130 800-729-9288 nec electronics (germany) gmbh duesseldorf, germany tel: 0211-65 03 02 fax: 0211-65 03 490 nec electronics (uk) ltd. milton keynes, uk tel: 01908-691-133 fax: 01908-670-290 nec electronics italiana s.r.l. milano, italy tel: 02-66 75 41 fax: 02-66 75 42 99 nec electronics (germany) gmbh benelux office eindhoven, the netherlands tel: 040-2445845 fax: 040-2444580 nec electronics (france) s.a. velizy-villacoublay, france tel: 01-3067-5800 fax: 01-3067-5899 nec electronics (france) s.a. madrid office madrid, spain tel: 091-504-2787 fax: 091-504-2860 nec electronics (germany) gmbh scandinavia office taeby, sweden tel: 08-63 80 820 fax: 08-63 80 388 nec electronics hong kong ltd. hong kong tel: 2886-9318 fax: 2886-9022/9044 nec electronics hong kong ltd. seoul branch seoul, korea tel: 02-528-0303 fax: 02-528-4411 nec electronics singapore pte. ltd. novena square, singapore tel: 253-8311 fax: 250-3583 nec electronics taiwan ltd. taipei, taiwan tel: 02-2719-2377 fax: 02-2719-5951 nec do brasil s.a. electron devices division guarulhos-sp, brasil tel: 11-6462-6810 fax: 11-6462-6829 j01.2
user?s manual u14700ej2v0um 5 introduction target readers this manual is intended for users who design and develop application systems using the v850e/ia1 tm . purpose the purpose of this manual is to describe the proper operation of the ie-703116-mc- em1, and its basic specifications. organization this manual is broadly divided into the following parts. overview names and functions of components cautions how to read this manual it is assumed that the reader of this manual has general knowledge of electrical engineering, logic circuits, and microcontrollers. the IE-703116-MC-EM1 is used connected to the ie-v850e-mc in-circuit emulator. this manual explains the basic setup procedure and switch settings of the IE-703116-MC-EM1. for the names and functions, and the connection of parts, refer to the ie-v850e-mc, ie-v850e-mc-a user?s manual (u14487e) , which is sold separately. to understand the basic specifications and operation methods broadly read this manual in the order listed in contents . to know the operation methods and command functions of the ie-v850e-mc, and IE-703116-MC-EM1-a read the user?s manual of the debugger (sold separately) that is used. conventions note : footnote for item marked with note in the text caution : information requiring particular attention remark : supplementary information numerical representation: binary or b decimal hexadecimal h prefix indicating the power of 2 (address space, memory capacity): k (kilo): 2 10 = 1024 m (mega): 2 20 = 1024 2 terminology the meanings of terms used in this manual are listed below. target device this is the device to be emulated. target system the system (user-built system) to be debugged. this includes the target program and hardware configured by the user.
user?s manual u14700ej2v0um 6 related documents when using this manual, refer to the following manuals. the related documents indicated in this publication may include preliminary versions. however, preliminary versions are not marked as such. { documents related to development tools (user?s manuals) product name document number ie-v850e-mc, ie-v850e-mc-a (in-circuit emulator) u14487e IE-703116-MC-EM1 (in-circuit emulator option board) this manual v800 series tm development tool (tutorial guide) u14218e operation u15024e c language u15025e project manager u15026e ca850 (ver.2.40 or later) (c compiler package) assembly language u15027e id850 (ver.2.40 or later) (integrated debugger) operation windows based u15181e sm850 (ver.2.40 or later) (system simulator) operation windows based u15182e sm850 (ver.2.00 or later) (system simulator) external part user open interface specifications u14873e basics u13430e rx850 (real-time os) installation u13410e basics u13773e rx850 pro (real-time os) installation u13774e rd850 (ver. 3.0) (task debugger) u13737e rd850 pro (ver. 3.0) (task debugger) u13916e az850 (system performance analyzer) u14410e
user?s manual u14700ej2v0um 7 contents chapter 1 overview......................................................................................................... ................10 1.1 hardware configuration ...................................................................................................... .......11 1.2 features (when connected to ie-v850e-mc)...........................................................................12 1.3 function specifications (when connected to ie-v850e-mc) .................................................13 1.4 system configuration........................................................................................................ .........14 1.5 contents in carton.......................................................................................................... ............15 1.6 connection between ie-v850e-mc and IE-703116-MC-EM1...................................................16 chapter 2 names and functions of components ...........................................................18 2.1 component names and functions of IE-703116-MC-EM1 ......................................................18 2.2 clock settings .............................................................................................................. ...............20 2.2.1 clock settings outline.................................................................................................. ....................... 20 2.2.2 clock setting methods ................................................................................................... .................... 21 2.3 operation mode.............................................................................................................. .............27 2.3.1 when emulator is used as stand-alone unit................................................................................. .. 27 2.3.2 when emulator is connected to target system............................................................................... 27 2.4 power supply settings for option board .................................................................................28 2.4.1 jp2 setting when emulator is used as stand-alone unit................................................................. 28 2.4.2 jp2 setting when emulator is connected to target system............................................................. 28 2.5 emulation memory ............................................................................................................ ..........29 2.5.1 wait setting for emulation memory ......................................................................................... ....... 29 2.5.2 cautions related to emulation memory ...................................................................................... .... 30 chapter 3 factory settings................................................................................................ .......31 chapter 4 cautions ......................................................................................................... ................32 4.1 v dd of target system .............................................................................................................. ....32 4.2 x1 signal ................................................................................................................... ...................32 4.3 pin termination during operation of emulator as stand-alone unit....................................33 4.4 internal ram and rom ........................................................................................................ .......34 4.5 bus control pins ............................................................................................................ .............35 appendix a dimensions...................................................................................................... ..............37 appendix b example of use of connector for target connection....................42 appendix c connectors for target connection ............................................................44 c.1 usage ....................................................................................................................... ....................44 c.2 cautions on handling connectors............................................................................................4 6 appendix d mounting plastic spacer.....................................................................................47
user?s manual u14700ej2v0um 8 list of figures figure no. title page 1-1 system configuration ...................................................................................................... .................................14 1-2 contents in carton........................................................................................................ ....................................15 1-3 connection between ie-v850e-mc and IE-703116-MC-EM1....................................................................... ...16 2-1 IE-703116-MC-EM1 .......................................................................................................... ................................18 2-2 clock settings outline .................................................................................................... ..................................20 2-3 outline when using mounted internal clock................................................................................. ...................22 2-4 outline when changing mounted crystal oscillator and using it as internal clock ........................................23 2-5 crystal/ceramic resonator mounting method and connection diagram .........................................................2 4 2-6 outline when using crystal/ceramic resonator as internal clock ............................................................. .....25 2-7 outline when using crystal oscillator on target system as external clock ................................................... 26 2-8 power supply settings (when emulator is used as stand-alone unit and target system power is off) .......28 2-9 power supply setting (when power of target system is on).................................................................. ........28 4-1 schematic diagram of power supply flow.................................................................................... ...................32 4-2 diagram of x1 signal flow ................................................................................................. ..............................33 4-3 circuit diagram of cksel pin .............................................................................................. ............................33 c-1 mounting nqpack144sd ...................................................................................................... ..........................44 c-2 mounting device ........................................................................................................... ....................................45 c-3 nqpack100sd and device pin................................................................................................ .......................45 d-1 mounting method of plastic spacer ......................................................................................... .........................47
user?s manual u14700ej2v0um 9 list of tables table no. title page 2-1 list of hardware settings when setting clock.............................................................................. ................... 21 2-2 settings when using mounted internal clock ................................................................................ .................. 22 2-3 settings when changing mounted internal clock.............................................................................. .............. 23 2-4 settings when using crystal/ceramic resonator as internal clock ........................................................... ..... 24 2-5 settings when using external clock........................................................................................ ........................ 26 4-1 memory capacity limitation list........................................................................................... ............................ 34 4-2 bus control pin operation list ............................................................................................ ............................. 35
user?s manual u14700ej2v0um 10 chapter 1 overview the IE-703116-MC-EM1 is an option board for the in-circuit emulator ie-v850e-mc. by connecting the ie- 703116-mc-em1 to the ie-v850e-mc, hardware and software can be debugged efficiently in system development using the v850e/ia1. in this manual, the basic setup procedures and switch settings of the IE-703116-MC-EM1 when connecting it to the ie-v850e-mc are described. for the names and functions of the parts of the ie-v850e-mc, and for the connection of parts, refer to the ie-v850e-mc, ie-v850e-mc-a user?s manual (u14487e) which is a separate volume.
chapter 1 overview user ? s manual u14700ej2v0um 11 option board (IE-703116-MC-EM1) ie-v850e-mc can be used as in-circuit emulator for v850e/ia1 by adding this board. extension probe note sc-144sdn sc-144sdn/pr general-purpose extension probe made by tokyo eletech corporation. pc interface board ie-70000-pci-if(-a) ie-70000-cd-if-a these boards are used to connect the ie-v850e-mc-a to a personal computer. these boards are inserted in the expansion slot of the personal computer. ie-70000-pci-if(-a): for pci bus ie-70000-cd-if-a: for pcmcia socket power adapter (ie-70000-mc-ps-b) ac adapter dedicated to nec in-circuit emulators separately sold hardware 1.1 hardware configuration note for further information, contact daimaru kogyo co., ltd . tokyo electronics department (tel +81-3-3820-7112) osaka electronics department (tel +81-6-6244-6672) optional hardware separately sold hardware in-circuit emulator (ie-v850e-mc)
chapter 1 overview user ? s manual u14700ej2v0um 12 1.2 features (when connected to ie-v850e-mc) { maximum operation frequency: 50 mhz (v dd = 5 v operation) { extremely lightweight and compact { higher equivalence with target device can be achieved by omitting buffer between signal cables. { the following pins can be masked. reset, nmi, wait, hldrq { two methods of connection to target system: direct connection of the IE-703116-MC-EM1 attach an extension probe (sold separately) to the connection tab of the IE-703116-MC-EM1. { the dimensions of the IE-703116-MC-EM1 are as follows. parameter value power consumption 0.9 w (at 50 mhz operation frequency) note height 15 mm length 206 mm external dimensions (refer to appendix a dimensions ) width 96 mm weight 190 g note the power consumption is 9.1 w for ie-v850e-mc + IE-703116-MC-EM1.
chapter 1 overview user ? s manual u14700ej2v0um 13 1.3 function specifications (when connected to ie-v850e-mc) parameter specification internal rom 256 kb emulation memory capacity external memory 4 mb internal rom 256 kb in romless mode 2 mb execution/pass detection coverage memory capacity external memory when using irom 1 mb trace memory capacity 168 bits 32 kframes time measurement function can be measured with time tag and timers (3 lines) 8 bits external trace is possible external logic probe event setting for trace/break is possible event break step execution break forcible break break function fail-safe break ? illegal access to peripheral i/o ? access to guard space ? writing to rom space caution some of the functions may not be supported depending on the debugger used.
chapter 1 overview user ? s manual u14700ej2v0um 14 1.4 system configuration the system configuration when connecting the IE-703116-MC-EM1 to the ie-v850e-mc, which is then connected to a personal computer (pc-9800 series, pc/at or compatibles) is shown below. figure 1-1. system configuration [magnified drawing: example of use of connector for target connection] target system <12> <13> <11> <5> <6> <7> <4> <3> <1>, <2> <8> <10> <9> target system <9> <10> remark <1> personal computer (pc-9800 series, pc/at or compatibles) <2> debugger (sold separately), device file note <3> pc interface board (ie-70000-pci-if(-a), ie-70000-cd-if-a: sold separately) <4> pc interface cable (included with ie-v850e-mc) <5> in-circuit emulator (ie-v850e-mc: sold separately) <6> in-circuit emulator optional board (IE-703116-MC-EM1) <7> external logic probe <8> extension probe (sc-144sdn, sc-144sdn/pr: sold separately) <9> connector for emulator connection (yqpack144sd: included) <10> connector for target connection (nqpack144sd: included) <11> power adapter (ie-70000-mc-ps-b: sold separately) <12> ac100 v power cable (sold separately: included with ie-70000-mc-ps-b) <13> ac220 v power cable (sold separately: included with ie-70000-mc-ps-b) note obtain the device file from the web site of nec electron devices (http://www.ic.nec.co.jp/micro/).
chapter 1 overview user ? s manual u14700ej2v0um 15 1.5 contents in carton the carton of the IE-703116-MC-EM1 contains a main unit, guarantee card, packing list, and accessory bag. make sure that the accessory bag contains this manual and connector accessories. in case of missing or damaged items, contact an nec sales representative or distributor. figure 1-2. contents in carton <1> IE-703116-MC-EM1 1 <2> accessory bag 1 <3> guarantee card 1 <4> packing list 1 <5> ic socket nqpack144sd 1 <6> ic socket yqpack144sd 1 <7> ic socket hqpack144sd 1 check that the accessory bag contains this manual, a packing list, an external logic probe, and a restriction document. <2> accessory bag <3> guarantee card <4> packing list <1> IE-703116-MC-EM1 <5> ic socket nqpack144sd <6> ic socket yqpack144sd <7> ic socket hqpack144sd
chapter 1 overview user ? s manual u14700ej2v0um 16 1.6 connection between ie-v850e-mc and IE-703116-MC-EM1 the procedure for connecting the ie-v850e-mc and IE-703116-MC-EM1 is described below. caution connect carefully so as not to break or bend connector pins. <1> remove the pod cover (upper and lower) of the ie-v850e-mc. <2> set the pga socket lever of the IE-703116-MC-EM1 to the open position as shown in figure 1-3 (b). <3> connect the IE-703116-MC-EM1 to the pga socket at the rear of the pod (refer to figure 1-3 (c)). when connecting, position the ie-v850e-mc and IE-703116-MC-EM1 so that they are horizontal. spacers can be connected to fix the pod (refer to appendix d mounting plastic spacer ). <4> set the pga socket lever of the IE-703116-MC-EM1 to the close position as shown in figure 1-3 (b). <5> fix the IE-703116-MC-EM1 between the pod covers (upper and lower) with the nylon rivets supplied with the ie-v850e-mc. <6> fix the pod cover (upper) end with nylon rivets. figure 1-3. connection between ie-v850e-mc and IE-703116-MC-EM1 (1/2) (a) overview ie-v850e-mc nylon rivets upper cover IE-703116-MC-EM1 lower cover nylon rivets nylon rivets
chapter 1 overview user ? s manual u14700ej2v0um 17 figure 1-3. connection between ie-v850e-mc and IE-703116-MC-EM1 (2/2) (b) pga socket lever of IE-703116-MC-EM1 (c) connecting part (IE-703116-MC-EM1) close open pin a1 position : insertion guide : ie-v850e-mc insertion area
user?s manual u14700ej2v0um 18 chapter 2 names and functions of components this chapter describes the names, functions, and switch settings of components comprising the ie-703116-mc- em1. for the details of the pod, jumper, and switch positions, etc., refer to the ie-v850e-mc , ie-v850e-mc-a user?s manual (u14487e) . 2.1 component names and functions of IE-703116-MC-EM1 figure 2-1. IE-703116-MC-EM1 (a) top view (b) bottom view tp1 tp2 tp3 tp4 tp5 tp6 jp1 direct pll sw1 ld1 cn1 ld2 1 2 7 8 1 2 3 4 jp2 osc1 1 6 cn2 direction of pin 1 of the connector for target connection connector for ie-v850e-mc connection connector for target connection v850e/ia1 i/o chip emulation memory
chapter 2 names and functions of components user?s manual u14700ej2v0um 19 (1) test pin (tp1 to tp6) to leave the dma cycle or refresh cycle in the tracer, or break these cycles, connect these pins to the external logic probe. ? tp1: gnd ? tp2: test pin for product shipment inspection ? tp3: dmaak0 ? tp4: dmaak1 ? tp5: dmaak2 ? tp6: dmaak3 (2) sw1 this is a switch for clock mode switching (for details, refer to 2.2 clock settings ). (3) jp1 this is a jumper for switching the clock supply source (for details, refer to 2.2 clock settings ). (4) jp2 this is a jumper for switching the power supply (for details, refer to 2.4 power supply settings for option board ). (5) cn1 connects the external logic probe (included). (6) cn2 this is the socket for connecting a crystal/ceramic resonator (for details, refer to 2.2 clock settings ). (7) ld1 (cksel: green) led status when used as stand-alone unit when used in target system connection lit sw1 = direct the cksel signal from the target system is high extinguished sw1 = pll the cksel signal from the target system is low (8) ld2 (run: yellow) led status lit user program is being executed. extinguished user program is halted. (9) connector for ie-v850e-mc connection this is a connector for connecting the ie-v850e-mc. (10) connector for target connection this is a connector for connecting the target system or the extension probe. (11) emulation memory this is a memory that replaces the memory/memory mapped i/o on the target system (for details, refer to 2.5 emulation memory ).
chapter 2 names and functions of components user ? s manual u14700ej2v0um 20 2.2 clock settings 2.2.1 clock settings outline the following 4 clock setting methods are available. for details, refer to 2.2.2 clock setting methods . (1) use the crystal oscillator mounted on osc1 of the IE-703116-MC-EM1 as the internal clock (4.000 mhz). (2) change the crystal oscillator mounted on osc1 of the IE-703116-MC-EM1 and use it as the internal clock (other than 4.000 mhz). (3) mount a crystal/ceramic resonator and capacitor on cn2 of the IE-703116-MC-EM1 and use it as the internal clock (other than 4.000 mhz). (4) use the crystal oscillator on the target system as the external clock (clock input from target system). caution when using an external clock, input the clock generated by the crystal oscillator to the x1 pin. when a clock generated by a crystal/ceramic resonator is used, the emulator does not operate normally. figure 2-2. clock settings outline osc1 jp1 v850e/ia1 i/o chip x1 IE-703116-MC-EM1 cn2 ie-v850e-mc ic20 clkout cksel sw1 pll/direct mode switching crystal oscillator (can be changed) switching with debugger oscillator/ resonator switch target system crystal oscillator eva chip crystal/ceramic resonator can be mounted
chapter 2 names and functions of components user?s manual u14700ej2v0um 21 2.2.2 clock setting methods a list of the hardware settings when setting the clock is shown below. table 2-1. list of hardware settings when setting clock type of clock used clock source selection note 1 osc1 crystal oscillator cn2 crystal/ ceramic resonator jp1 setting clock mode sw1 cksel pin note 2 pll direct pll low-level input (1) use crystal oscillator (osc1) mounted on IE-703116-MC-EM1 as internal clock. internal factory settings (4.000 mhz) mounting prohibited 1 2 7 8 direct direct pll high-level input pll direct pll low-level input (2) change crystal oscillator (osc1) mounted on IE-703116-MC-EM1 and use it as the internal clock. internal change (to other than 4.000 mhz) mounting prohibited 1 2 7 8 direct direct pll high-level input pll direct pll low-level input (3) mount a crystal/ceramic resonator on IE-703116-MC-EM1 and use it as the internal clock. internal crystal oscillator can be either mounted or not mounted mount 1 2 7 8 direct direct pll high-level input pll direct pll low-level input (4) use the crystal oscillator on the target system as an external clock. external crystal oscillator can be either mounted or not mounted mounting prohibited 1 2 7 8 direct direct pll high-level input notes 1. select the clock source in the clock source selection area in the configuration dialog box on the debugger. 2. the input setting to the cksel pin is made only when a target system is connected. leave this pin open when operating the emulator on a standalone basis. caution settings other than those described above are prohibited.
chapter 2 names and functions of components user ? s manual u14700ej2v0um 22 (1) using the crystal oscillator (osc1) mounted on the IE-703116-MC-EM1 as the internal clock <1> if a crystal/ceramic resonator is mounted in the cn2 socket, remove it. <2> mount the 4.000 mhz crystal oscillator mounted at factory shipment in the osc1 socket of the ie-703116- mc-em1 (with the default settings). <3> change jp1 as indicated in table 2-2 (with the default settings). <4> set the sw1 and cksel pins according to the clock mode to be used, as shown in table 2-2. <5> to start up the integrated debugger (id850), select ? internal ? in the clock source selection area in the configuration dialog box (clock selection in emulator). table 2-2. settings when using mounted internal clock type of clock used clock source selection osc1 crystal oscillator cn2 crystal/ceramic resonator jp1 setting clock mode sw1 cksel pin note pll direct pll low-level input use crystal oscillator (osc1) mounted on IE-703116-MC-EM1 as internal clock. internal factory setting (4.000 mhz) mounting prohibited 1 2 7 8 direct direct pll high-level input note the input setting to the cksel pin is made only when a target system is connected. leave this pin open when operating the emulator on a standalone basis. figure 2-3. outline when using mounted internal clock x1 clkout osc1 4 mhz jp1 IE-703116-MC-EM1 cn2 ic20 1-2 shorted 3-4 shorted 5-6 open 7-8 open cksel ie-v850e-mc eva chip select ? internal ? on id850 mounted crystal oscillator crystal oscillator target system sw1 pll/direct mode switching crystal/ceramic resonator mounting prohibited v850e/ia1 i/o chip
chapter 2 names and functions of components user?s manual u14700ej2v0um 23 (2) changing the crystal oscillator (osc1) mounted on the IE-703116-MC-EM1 and using it as the internal clock <1> if a crystal/ceramic resonator is mounted in the cn2 socket, remove it. <2> remove the crystal oscillator (osc1) that is mounted on the option board and mount the oscillator to be used. <3> set jp1 as shown in table 2-3 (factory settings). <4> set the sw1 and cksel pins according to the clock mode to be used, as shown in table 2-3. <5> select ?internal? in the clock source selection area in the configuration dialog box on the integrated debugger (id850). table 2-3. settings when changing mounted internal clock type of clock used clock source selection osc1 crystal oscillator cn2 crystal/ceramic resonator jp1 setting clock mode sw1 cksel pin note pll direct pll low-level input change the crystal oscillator mounted on IE-703116-MC-EM1 and use it as the internal clock. internal change (to other than 4.000 mhz) mounting prohibited 1 2 7 8 direct direct pll high-level input note the input setting to the cksel pin is made only when a target system is connected. leave this pin open when operating the emulator on a standalone basis. figure 2-4. outline when changing mounted crystal oscillator and using it as internal clock IE-703116-MC-EM1 osc1 other than 4 mhz ic20 jp1 ie-v850e-mc clkout cksel x1 eva chip 1-2 shorted 3-4 shorted 5-6 open 7-8 open select on id850 crystal oscillator target system sw1 pll/direct mode switching crystal/ceramic resonator mounting prohibited cn2 v850e/ia1 i/o chip ? internal ? change crystal oscillator
chapter 2 names and functions of components user?s manual u14700ej2v0um 24 (3) mounting a crystal/ceramic resonator on the IE-703116-MC-EM1 and using it as the internal clock <1> mount the crystal/ceramic resonator and capacitor to be used in the cn2 socket as shown below (when selecting the crystal/ceramic resonator, refer to the v850e/ia1 standards table). <2> set jp1 as shown in table 2-4. <3> set the sw1 and cksel pins according to the clock mode to be used, as shown in table 2-4. <4> select ?internal? in the clock source selection area in the configuration dialog box on the integrated debugger (id850). figure 2-5. crystal/ceramic resonator mounting method and connection diagram (a) mounting method (b) connection diagram cn2 of IE-703116-MC-EM1 crystal/ceramic resonator capacitor capacitor 16 x2 v850e/ia1 i/o chip 3 4 eva chip clock to eva chip x1 1 2 5 6 : pin no. of cn2 connector on IE-703116-MC-EM1 table 2-4. settings when using crystal/ceramic resonator as internal clock type of clock used clock source selection osc1 crystal oscillator cn2 crystal/ceramic resonator jp1 setting clock mode sw1 cksel pin note 1 pll direct pll low-level input mount crystal/ceramic resonator on IE-703116-MC-EM1 and use as internal clock internal crystal oscillator can be either mounted or not mounted mount note 2 1 2 7 8 direct direct pll high-level input notes 1. the input setting to the cksel pin is made only when a target system is connected. leave this pin open when operating the emulator on a standalone basis. 2. when selecting the crystal/ceramic resonator, refer to the v850e/ia1 standards table.
chapter 2 names and functions of components user?s manual u14700ej2v0um 25 figure 2-6. outline when using crystal/ceramic resonator as internal clock IE-703116-MC-EM1 ie-v850e-mc osc1 jp1 ic20 cn2 mount crystal/ceramic resonator x1 cksel clkout eva chip v850e/ia1 i/o chip sw1 pll/direct mode switching crystal oscillator target system can be either mounted or not mounted select on id850 1-2 shorted 3-4 open 5-6 open 7-8 open ? internal ?
chapter 2 names and functions of components user?s manual u14700ej2v0um 26 (4) using the target system crystal oscillator as an external clock <1> if a crystal/ceramic resonator is mounted in the cn2 socket, remove it. <2> set jp1 as shown in table 2-5 (factory setting). <3> set the sw1 and cksel pins according to the clock mode to be used, as shown in table 2-5. <4> select ?external? in the clock source selection area in the configuration dialog box on the integrated debugger (id850). table 2-5. settings when using external clock type of clock used clock source selection osc1 crystal oscillator cn2 crystal resonator jp1 setting clock mode sw1 cksel pin note pll direct pll low-level input use crystal oscillator on target system as external clock. external crystal oscillator can be either mounted or not mounted mounting prohibited 1 2 7 8 direct direct pll high-level input note the input setting to the cksel pin is made only when a target system is connected. leave this pin open when operating the emulator on a standalone basis. caution be sure to input a clock generated by a crystal oscillator to the x1 pin. when a clock generated by a crystal/ceramic resonator is used, the emulator does not operate normally. figure 2-7. outline when using crystal oscillator on target system as external clock IE-703116-MC-EM1 osc1 ic20 ? external ? cn2 jp1 ie-v850e-mc v850e/ia1 i/o chip clkout x1 cksel eva chip crystal/ceramic resonator mounting prohibited sw1 pll/direct mode switching select on id850 1-2 shorted 3-4 shorted 5-6 open 7-8 open crystal oscillator target system can be either mounted or not mounted
chapter 2 names and functions of components user?s manual u14700ej2v0um 27 2.3 operation mode the IE-703116-MC-EM1 supports single-chip mode 0, single-chip mode 1, romless mode 0, and romless mode 1 similar to the v850e/ia1. set these as follows. 2.3.1 when emulator is used as stand-alone unit only operation in single-chip mode 0 is supported. when the integrated debugger (id850) is activated, be sure to select ?mode02? in the configuration dialog box mask setting area. 2.3.2 when emulator is connected to target system set as follows in the configuration dialog box mask setting area when the integrated debugger (id850) is activated in accordance with the operation mode used. operation in romless mode 0: select mode00 operation in romless mode 1: select mode01 operation in single-chip mode 0: select mode02 operation in single-chip mode 1: select mode03 emulation of the mode pin cannot be performed since the input level to the mode pin is implemented using the debugger pin mask function in the IE-703116-MC-EM1. for the settings of the pins on the target system, refer to the v850e/ia1 hardware user?s manual (u14492e).
chapter 2 names and functions of components user?s manual u14700ej2v0um 28 2.4 power supply settings for option board using the jp2 setting, the IE-703116-MC-EM1 can switch between operation using the emulator as a stand-alone unit (using the power of the emulator) and operation using the emulator connected to the target system (using the power of the target system). 2.4.1 jp2 setting when emulator is used as stand-alone unit the IE-703116-MC-EM1 operates using the emulator?s power supply when the emulator operates as a stand- alone unit and target system power is off. figure 2-2 shows the jp2 setting. caution if the jp2 setting is incorrect, the emulator may be damaged. figure 2-8. power supply settings (when emulator is used as stand-alone unit and target system power is off) 1 2 3 4 jp2 set both 1 and 2, and 3 and 4 as open 2.4.2 jp2 setting when emulator is connected to target system the IE-703116-MC-EM1 operates using the target system?s power supply when the power of the target system is on. figure 2-3 shows the jp2 setting. caution if the jp2 setting is incorrect, the emulator may be damaged. figure 2-9. power supply setting (when power of target system is on) 1 2 3 4 jp2 set 1 and 2 as open, and 3 and 4 as shorted
chapter 2 names and functions of components user?s manual u14700ej2v0um 29 2.5 emulation memory this is a substitute memory used to emulate the memory or memory mapped i/o on the target system (capacity: 4 mb). the emulation memory is mounted on the IE-703116-MC-EM1. 2.5.1 wait setting for emulation memory the data wait, address wait, and idle state for the emulation memory are set as follows. (1) id850 select from the following three types on the configuration screen. selection wait type emulation memory access external memory access data wait fixed to 0 waits depends on dwc register setting wait signal masked address wait fixed to 0 waits depends on asc register setting wait mask idle state fixed to 0 cycles d epends on bcc register setting data wait fixed to 1 wait depends on dwc register setting and wait signal status address wait fixed to 0 waits depends on asc register setting 1 wait access idle state fixed to 0 cycles d epends on bcc register setting data wait depends on dwc register setting however, 1 wait when set to 0 waits depends on dwc register setting and wait signal status address wait fixed to 0 waits depends on asc register setting target wait idle state depends on bcc register setting depends on bcc register setting (2) multi select mask or unmask for wait and emwait using the ?pinmask? command. selection wait type emulation memory access external memory access data wait fixed to 0 waits depends on dwc register setting wait signal masked address wait fixed to 0 waits depends on asc register setting wait: mask emwait: mask idle state fixed to 0 cycles d epends on bcc register setting data wait fixed to 1 wait depends on dwc register setting and wait signal status address wait fixed to 0 waits depends on asc register setting wait: unmask emwait: mask idle state fixed to 0 cycles d epends on bcc register setting data wait depends on dwc register setting however, 1 wait when set to 0 waits depends on dwc register setting and wait signal status address wait fixed to 0 waits depends on asc register setting wait: unmask emwait: unmask idle state depends on bcc register setting depends on bcc register setting
chapter 2 names and functions of components user?s manual u14700ej2v0um 30 2.5.2 cautions related to emulation memory (1) number of data waits required for emulation memory access the number of data waits required to be inserted for emulation memory access varies depending on the operating frequency of the emulator. 4 mhz operating frequency < 25 mhz 0 waits 25 mhz operating frequency 40 mhz 1 wait 40 mhz < operating frequency 2 waits (2) bus sizing make the bus sizing 16 bits (set bsc register bsn0 to 1). an 8-bit bus cannot be used. (3) wait pin the number of data waits for the emulation memory is not affected by the wait pin. (4) address wait address waits cannot be inserted in the emulation memory. when address waits need to be inserted, set as follows. this setting is effective to make the access speed to the emulation memory equal to that of the external memory or external i/o to measure the performance, etc. for how to insert waits in the emulation memory, refer to 2.5.1 wait setting for emulation memory . number of data waits for cs space of emulation memory number of address waits for external memory or external i/o number of data waits for external memory or external i/o = +
user?s manual u14700ej2v0um 31 chapter 3 factory settings item setting remark jp1 1 2 7 8 setting that uses a crystal resonator as an internal/external clock. jp2 1 2 3 4 setting that supplies the IE-703116-MC-EM1 with the power of the emulator (when the emulator operates as a stand-alone unit and target system power is off). sw1 direct pll set to pll mode. osc1 4.000 mhz crystal oscillator is mounted. the frequency can be changed by changing the crystal resonator.
user?s manual u14700ej2v0um 32 chapter 4 cautions 4.1 v dd of target system (1) v dd in the target system is used to operate the circuit in the emulator. (2) when jp2 is set as ?1 and 2 open? and ?3 and 4 shorted?, the evaluation chip in the emulator operates on v dd from the target system. (3) when jp2 is set as ?1 and 2 open? and ?3 and 4 open?, the emulator recognizes the target system power is off and operates with the 3.3 v power supply. figure 4-1. schematic diagram of power supply flow IE-703116-MC-EM1 i/o chip target system cv dd v dd relay power supply circuit eva chip ie-v850e-mc 1 2 3 4 jp2 1 2 3 4 jp2 4.2 x1 signal the input signal (x1 signal) from the target system is delayed (for t plh = t phl = 13.2 ns (max.)) because it passes through vhc157 before it is input to the i/o chip of the emulator. the input voltage becomes v ih = 2.31 v (min.) and v il = 0.99 v (max.). the input current becomes i in = 1.0 a (max.).
chapter 4 cautions user ? s manual u14700ej2v0um 33 figure 4-2. diagram of x1 signal flow 4.3 pin termination during operation of emulator as stand-alone unit (1) mode0 to mode2 pins when the emulator operates as a stand-alone unit, the operation mode of the emulator is single-chip mode 0. the mode0 to mode2 pins are connected as follows. ? mode0: connected to v ss via a resistor (33 k ? ) (pull-down). ? mode1: connected to v dd via a resistor (33 k ? ) (pull-up). ? mode2: connected to v ss via a resistor (33 k ? ) (pull-down). (2) reset pin this pin is connected to v dd via a resistor (33 k ? ) (pull-up). (3) cksel pin pull-up/pull-down switching is possible with sw1. figure 4-3. circuit diagram of cksel pin vhct541 i/o chip sw1 cksel cksel pin 33 k ? 33 k ? v d d IE-703116-MC-EM1 x1 pin target system x1 signal vhc157 i/o chip
chapter 4 cautions user ? s manual u14700ej2v0um 34 4.4 internal ram and rom because the internal ram (iram) and internal rom (irom) capacities of the emulator are set in steps, the memory capacity is different from that of the target device. if addresses that exceed the target device capacity are accessed, the memory of the emulator is accessed. the memory capacities are as follows. table 4-1. memory capacity limitation list (a) iram capacity (unit: byte) (b) irom capacity (unit: byte) target device emulator target device emulator (emulation memory) 1 k to 4 k 4 k 1 k to 32 k 32 k 5 k to 12 k ( pd70f3116, pd703117) 12 k 33 k to 64 k 64 k 13 k to 28 k 28 k 65 k to 128 k ( pd703117) 128 k 29 k to 60 k 60 k 129 k to 256 k ( pd70f3116) 256 k 257 k to 512 k 512 k
chapter 4 cautions user ? s manual u14700ej2v0um 35 4.5 bus control pins there are the following differences between the emulator and the target device in the operation of the pins for bus control. table 4-2. bus control pin operation list (1/2) (a) during break internal memory external memory internal rom internal ram on-chip peripheral i/o emulation ram target system pin name waiting for emulator command rrwrwrwrw ad0 to ad15 hi-z hi-z note note a16 to a23 address accessed last is held address accessed last is held note note cs0 to cs7 h h h note rd h h h note astb h h note note lwr, uwr h h h note wait invalid invalid maskable maskable hldrq maskable maskable maskable maskable hldak note note note note note performs the same operation as the cycle that is generated by the target device program execution. remarks 1. r: read w: write 2. h: high-level output hi-z: high-impedance
chapter 4 cautions user ? s manual u14700ej2v0um 36 table 4-2. bus control pin operation list (2/2) (b) during user program execution internal memory external memory internal rom internal ram on-chip peripheral i/o emulation ram target system pin name frfrwrwfrwfrw ad0 to ad15 hi-z note note a16 to a23 address accessed last is held note note cs0 to cs7 h h note rd h h note astb h note note lwr, uwr h h note wait invalid maskable maskable hldrq maskable maskable maskable hldak note note note note performs the same operation as the cycle that is generated by the target device program execution. remarks 1. f: fetch r: read w: write 2. h: high-level output hi-z: high-impedance
user?s manual u14700ej2v0um 37 appendix a dimensions (1) ie-v850e-mc + IE-703116-MC-EM1 (unit: mm) 448 55 166 58.8 46 90 27 227 top view side view IE-703116-MC-EM1 ie-v850e-mc bottom view top view 15.88 206.6 29.0 96 37.5 29.0 pin 1 direction
appendix a dimensions user ? s manual u14700ej2v0um 38 (2) sc-144sd (unit: mm) 109 144 72 37 108 1 73 36 43 13 13 40 130 43 213 46
appendix a dimensions user ? s manual u14700ej2v0um 39 (3) nqpack144sd (unit: mm) [top view] [side view] [bottom view] 73 72 109 144 1 37 36 108 7.0 27.0 0.5 20.1 3 r 1.5 c 1.5 0.3 0.5 35 = 17.5 26.2 18.9 7.0 3 2.5 2.5 22.65 1.0 21.05 0.5 0.5 0.18 0.2 1.85 5.5 1.2 3.7 3.9 9.45 1 36 73 108 37 72 144 109 23.0 12.0 20.1 0.2 4 2.0 height of projection1.8
appendix a dimensions user ? s manual u14700ej2v0um 40 (4) yqpack144sd (unit: mm) [top view] [side view] [bottom view] 109 144 7.0 2 2.65 0.5 c 2 .0 108 73 72 37 4 r 1.5 3 r 2.5 1 36 0.5 35 = 17.5 4 2.2 29.0 27.0 7.0 16.4 18.8 21.2 23.6 3 19.4 1.0 144 109 108 73 72 37 1 36 22.8 19.6 c1.5 20.8 0.2 0.3 0.25 0.25 0.3 7.4 1.2 1.2 3.9 9.0 2.2 3.1 2.5 3.7
appendix a dimensions user ? s manual u14700ej2v0um 41 (5) hqpack144sd (unit: mm) [top view] [side view] 0.25 3.1 1.6 2.25 7.4 3.9 2.3 1.2 [bottom view] 22.65 0 .1 5 0.5 35 = 17.5 c 2.0 4 r 1.5 3 r 2.5 109 144 108 73 72 37 1 36 0 .1 7.0 0 .1 4 2.2 29.0 27.0 19.4 7.0 3 18.4 16.0 23.9 2.75 3.95 2.75 3.95 1.0 c 1.5 144 109 108 73 72 37 1 36 22.8 19.6 21.4 0 .2 0.2
user?s manual u14700ej2v0um 42 appendix b example of use of connector for target connection (1) when directly connecting device to target system (connector for target connection is not used) (2) when using device using connector for target connection fastening screws hqpack144sd nqpack144sd target system device (3) connection between emulator and target system (a) when extension probe is not used target system nqpack144sd yqpack144sd note note the connector for emulator connection (yqsocket144sdn) can be inserted at this position for height adjustment. target system device
appendix b example of use of connector for target connection user ? s manual u14700ej2v0um 43 (b) when extension probe is used target system nqpack144sd yqpack144sd note extension probe note the connector for emulator connection (yqsocket144sdn) can be inserted at this position for height adjustment.
user?s manual u14700ej2v0um 44 appendix c connectors for target connection c.1 usage (1) when mounting nqpack144sd on target system <1> coat the tip of the four projections (points) at the bottom of the nqpack144sd with two-component type epoxy adhesive (cure time longer than 30 min.) and bond the nqpack144sd to the target system. if not bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the target system. if the lead of the nqpack144sd is not aligned with the pad of the target system easily, perform step <2> to adjust the position. <2> to adjust the position, insert the guide pins for position adjustment (nqguide) provided with nqpack144sd into the pin holes on the upper side of nqpack144sd (refer to figure c-1). the diameter of a hole is = 1.0 mm. there are three non-through holes (refer to appendix a dimensions ). <3> after setting the hqpack144sd, solder the nqpack144sd to the target system. by following this sequence, adherence of flux or solder sputtering to contact pins of the nqpack144sd can be avoided. recommended soldering conditions? reflow: 240 c, 20 seconds max. partial heating: 240 c, 10 seconds max. (per pin row) <4> remove the guide pins. figure c-1. mounting nqpack144sd remark nqpack144sd: connector for target connection hqpack144sd: cover for device installation nqpack144sd guide pins (nqguide) hqpack144sd target system
appendix c connectors for target connection user ? s manual u14700ej2v0um 45 (2) when mounting device caution check for abnormal conditions such as resin burr or bent pins before mounting a device on the nqpack144sd. moreover, check that the hold pins of the hqpack144sd are not broken or bent before mounting the hqpack144sd. if there are broken or bent pins, fix them with a thin, flat plate such as a blade. <1> make sure that the nqpack144sd is clean and the device pins are parallel (flat) before mounting a device on the nqpack144sd. then, after mounting the nqpack144sd on the target board, fix the device and the hqpack144sd (refer to figure c-2). <2> using the screws provided with the hqpack144sd (four locations: m2 6 mm), secure the hqpack144sd, device, and nqpack144sd. tighten the screws in a crisscross pattern with the screwdriver provided or a driver with a torque gauge (avoid tightening only one screw strongly). tighten the screws with 0.55 kg ? f ? cm (0.054 n ? m) max. torque. excessive tightening may diminish conductivity. at this time, each pin is fixed inside the plastic dividers by the contact pin of the nqpack144sd and the hold pin of the hqpack144sd (refer to figure c-3). thus, pins cannot cause a short with pins of neighboring devices. figure c-2. mounting device fastening screws hqpack144sd nqpack144sd target system device figure c-3. nqpack100sd and device pin hold pin of hqpack144sd divider device pin contact pin of nqpack144sd
appendix c connectors for target connection user ? s manual u14700ej2v0um 46 c.2 cautions on handling connectors (1) when taking connectors out of the case, remove the sponge while holding the main unit. (2) when soldering the nqpack144sd to the target system, cover it with the hqpack144sd for protection against splashing flux. recommended soldering conditions ? reflow: 240 c, 20 seconds max. partial heating: 240 c, 10 seconds max. (per pin row) (3) check for abnormal conditions such as resin burr or bent pins before mounting a device on the nqpack144sd. moreover, when covering with the hqpack144sd, check that the hold pins of the hqpack144sd are not broken or bent before mounting the hqpack144sd. if there are broken or bent pins, fix them with a thin, flat plate such as a blade. (4) when securing the yqpack144sd (connector for emulator connection) or hqpack144sd to the nqpack144sd with screws, tighten the four screws temporarily with the screwdriver provided or a driver with a torque gauge, then tighten the screws in a crisscross pattern (with 0.054 n ? m max. torque). excessive tightening of only one screw may diminish conductivity. if the conductivity is diminished after screw-tightening, stop tightening, remove the screws and make sure the nqpack144sd is clean and the device pins are parallel (flat). (5) device pins do not have high strength. repeatedly connecting to the nqpack144sd may cause pins to bend. when mounting a device on nqpack144sd, check and adjust bent pins.
user?s manual u14700ej2v0um 47 appendix d mounting plastic spacer this chapter describes the mounting method for the plastic spacer supplied with the ie-v850e-mc. when using the emulator connected to the target system, mount the plastic spacer as shown in figure d-1 to fix the pod horizontally. (1) mounting plastic spacer on ie-v850e-mc <1> remove the nylon rivet from the rear part of the pod. <2> tighten the plastic spacer with the plastic screw supplied. <3> to adjust the height, use your own spacer or a stand. figure d-1. mounting method of plastic spacer target system plastic spacer
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user?s manual u14700ej2v0um 50 [memo]
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