doc. no : qw0905-la16b/dgl-s3 rev. : a date : 16 - aug - 2005 led array la16b/dgl-s3 data sheet ligitek electronics co.,ltd. property of ligitek only
package dimensions part no. la16b/dgl-s3 note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without not ice. ligitek electronics co.,ltd. property of ligitek only page 1/4 ldgl2641 4.3 3.3 1.5 max 0.5 typ 1.0min 25.0min 2.54typ 3.1 2.9 5.08 r 3.5 ?? 0.5 typ 7.4 + - 3.50.5 2.540.25 4.750.5 4.6 2.00.5 6.5
typical electrical & optical characteristics (ta=25 j ) note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. dominant wave length f dnm emitted green la16b/dgl-s3 ingan/gan lens 505 part no material color viewing angle 2 c 1/2 (deg) 32 max. 3.5 1100 4.0 1800 min. typ. 40 forward voltage @20ma(v) spectral halfwidth ??f nm luminous intensity @20ma(mcd) absolute maximum ratings at ta=25 j part no. la16b/dgl-s3 dgl -30 ~ +100 -20 ~ +80 max 260 j for 5 sec max (2mm from body) esd electrostatic discharge soldering temperature storage temperature operating temperature tsol t opr tstg power dissipation reverse current @5v peak forward current duty 1/10@10khz forward current ir pd i fp i f v 150 j j g a 50 120 mw 100 30 ma ma ratings ligitek electronics co.,ltd. property of ligitek only parameter symbol unit page 2/4 typ. green transparent
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 dgl chip page 3/4 part no. la16b/dgl-s3 450 0.0 0.5 1.0 500 550 600
page 4/4 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. solderability test solder resistance test this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 reference standard 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles low temperature storage test high temperature high humidity test thermal shock test 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs high temperature storage test operating life test jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test condition reliability test: part no. la16b/dgl-s3 test item ligitek electronics co.,ltd. property of ligitek only description
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