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WS512K32-XXX
FEATURES
n Packaging
512Kx32 SRAM MODULE, SMD 5962-94611
n 5 Volt Power Supply n Low Power CMOS n Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation n Weight WS512K32-XH1X - 13 grams typical WS512K32-XG2TX1 - 8 grams typical WS512K32-XG1UX - 5 grams typical WS512K32-XG1TX - 5 grams typical WS512K32-XG4TX1 - 20 grams typical
*15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. Note 1: Package Not Recommended For New Design
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns * 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). * 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1, Package to be developed. * 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3). * 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square (Package 519) 3.57mm (0.140") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3). * 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940") square (Package 524) 4.06mm (0.160") height. n Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8 n Commercial, Industrial and Military Temperature Ranges n TTL Compatible Inputs and Outputs
FIG. 1
PIN CONFIGURATION FOR WS512K32N-XH1X TOP VIEW PIN DESCRIPTION
I/O0-31 A0-18 WE1-4 CS1-4 OE VCC GND NC
Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
November 2001 Rev. 9
1
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
WS512K32-XXX
FIG. 2
PIN CONFIGURATION
FOR
WS512K32-XG4TX
1
TOP VIEW
PIN DESCRIPTION
I/O0-31 A0-18 WE CS1-4 OE VCC GND NC
BLOCK DIAGRAM
Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
Note 1: Package Not Recommended For New Design
FIG. 3
PIN CONFIGURATION FOR WS512K32-XG2TX , WS512K32-XG1TX AND WS512K32-XG1UX TOP VIEW PIN DESCRIPTION
1
I/O0-31 A0-18 WE1-4 CS1-4 OE VCC
Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
The White 68 lead CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But it has the TCE and lead inspection advantage of the CQFP form.
GND NC
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
2
WS512K32-XXX
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Min Max Unit CS OE WE
TRUTH TABLE
Mode Data I/O Power
Operating Temperature Storage Temperature Signal Voltage Relative to GND Junction Temperature Supply Voltage
TA TSTG VG TJ VCC
-55 -65 -0.5
+125 +150 Vcc+0.5 150
C C V C V
H L L L
X L H X
X H H L
Standby Read Out Disable Write
High Z Data Out High Z Data In
Standby Active Active Active
-0.5
7.0
CAPACITANCE RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Max Unit Parameter
(TA = +25C)
Symbol Conditions Max Unit
Supply Voltage Input High Voltage Input Low Voltage Operating Temp (Mil)
VCC VIH VIL TA
4.5 2.2 -0.5 -55
5.5 VCC + 0.3 +0.8 +125
V V V C
OE capacitance WE1-4 capacitance HIP (PGA) CQFP G4T CQFP G2T/G1U/G1T CS1-4 capacitance Data I/O capacitance Address input capacitance
COE CWE
VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz
50 20 50 20
pF pF
CCS CI/O CAD
VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz
20 20 50
pF pF pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55C
Parameter Symbol Conditions Min Max TO
+125C)
Units
Input Leakage Current Output Leakage Current Operating Supply Current x 32 Mode Standby Current Output Low Voltage Output High Voltage ICC
ILI ILO
x 32
VCC = 5.5, VIN = GND to VCC CS = VIH, OE = VIH, VOUT = GND to VCC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 IOL = 8mA for 15 - 35ns, IOL = 2.1mA for 45 - 55ns, Vcc = 4.5 IOH = -4.0mA for 15 - 35ns, IOH = -1.0mA for 45 - 55ns, Vcc = 4.5 2.4
10 10 660 80 0.4
A A mA mA V V
ISB VOL VOH
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V
DATA RETENTION CHARACTERISTICS (TA = -55C
Parameter Symbol TO
+125C)
Units Min Max
Conditions
Data Retention Supply Voltage Data Retention Current Low Power Data Retention Current (WS512K32L-XXX)
VDR ICCDR1 ICCDR2
CS VCC 0.2V VCC = 3V VCC = 3V
2.0
5.5 28 16
V mA mA
3
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WS512K32-XXX
AC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55C
Parameter Read Cycle Symbol -15* Min Max Min -17 Max Min -20 Max Min TO
+125C)
-35 Min Max Min -45 Max -55 Min Max Units
-25 Max
Read Cycle Time Address Access Time Output Hold from Address Change Chip Select Access Time Output Enable to Output Valid Chip Select to Output in Low Z Output Enable to Output in Low Z Chip Disable to Output in High Z Output Disable to Output in High Z
tRC tAA tOH tACS tOE tCLZ 1 tOLZ 1 tCHZ 1 tOHZ1
15 15 0 15 8 2 0 12 12
17 17 0 17 9 2 0 12 12
20 20 0 20 10 2 0 12 12
25 25 0 25 12 2 0 12 12
35 35 0 35 25 4 0 15 15
45 45 0 45 25 4 0 20 20
55 55 0 55 25 4 0 20 20
ns ns ns ns ns ns ns ns ns
*15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. 1. This parameter is guaranteed by design but not tested.
AC CHARACTERISTICS (VCC = 5.0V, VS S = 0V, TA = -55C
Parameter Write Cycle Symbol -15* Min Max -17 Min Max -20 Min Max Min TO -25 Max Min
+125C)
-35 Max -45 Min Max -55 Min Max Units
Write Cycle Time Chip Select to End of Write Address Valid to End of Write Data Valid to End of Write Write Pulse Width Address Setup Time Address Hold Time Output Active from End of Write Write Enable to Output in High Z Data Hold Time
tWC tCW tAW tDW tWP tAS tAH tOW 1 tWHZ 1 tDH
15 13 13 10 13 2 0 2 8 0
17 15 15 11 15 2 0 2 9 0
20 15 15 12 15 2 0 3 11 0
25 17 17 13 17 2 0 4 13 0
35 25 25 20 25 2 0 4 15 0
45 35 35 25 35 2 5 5 20 0
55 50 50 25 40 2 5 5 20 0
ns ns ns ns ns ns ns ns ns ns
*15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. 1. This parameter is guaranteed by design but not tested. 2. The Address Setup Time of minimum 2ns is for the G2T, G1U and H1 packages. tAS minimum for the G4T package is 0ns.
FIG. 4
AC TEST CIRCUIT
Parameter
AC TEST CONDITIONS
Typ Unit
Input Pulse Levels Input Rise and Fall Input and Output Reference Level Output Timing Reference Level
VIL = 0, VIH = 3.0 5 1.5 1.5
V ns V V
Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 y. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance.
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
4
WS512K32-XXX
FIG. 5
TIMING WAVEFORM - READ CYCLE
FIG. 6 WRITE CYCLE - WE CONTROLLED
FIG. 7
WRITE CYCLE - CS CONTROLLED
WS32K32-XHX
5
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
WS512K32-XXX
PACKAGE 400:
66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
1
PACKAGE 502:
68 LEAD, CERAMIC QUAD FL AT PACK, LOW PROFILE CQFP (G4T)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Design
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6
WS512K32-XXX
PACKAGE 509:
68 LEAD, CERAMIC QUAD FL AT PACK, CQFP (G2T)
1
The White 68 lead G2T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended For New Design
7
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
WS512K32-XXX
PACKAGE 519:
68 LEAD, CERAMIC QUAD FL AT PACK, LOW PROFILE CQFP (G1U)
The White 68 lead G1U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G1U has the TCE and lead inspection advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
8
WS512K32-XXX
PACKAGE 524:
68 LEAD, CERAMIC QUAD FL AT PACK, LOW PROFILE CQFP (G1T)
The White 68 lead G1T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G1T has the TCE and lead inspection advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
9
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
WS512K32-XXX
ORDERING INFORMATION
WS 512K 32 X - XXX X X X
LEAD FINISH:
Blank = Gold plated leads A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant M = Military Screened I = Industrial C = Commercial
PACKAGE TYPE:
-55C to +125C -40C to 85C 0C to +70C
H1 = Ceramic Hex-In-line Package, HIP (Package 400) G2T1 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509) G4T1 = 40mm Low Profile CQFP (Package 502) G1U = 23.9mm Low Profile CQFP (Package 519) G1T = 23.9mm Low Profile CQFP (Package 524)
ACCESS TIME (ns) IMPROVEMENT MARK:
Blank = Standard Power N = No Connect at pin 21 and 39 in HIP for Upgrades L = Low Power Data Retention
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM WHITE ELECTRONIC DESIGNS CORP.
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
10
WS512K32-XXX
DEVICE TYPE
SPEED
PACKAGE
SMD NO.
512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module 512K x 32 SRAM Module
55ns 45ns 35ns 25ns 20ns 17ns 55ns 45ns 35ns 25ns 20ns 17ns 55ns 45ns 35ns 25ns 20ns 17ns 55ns 45ns 35ns 25ns 20ns 17ns
66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 68 lead CQFP Low Profile (G4T)1 68 lead CQFP Low Profile (G4T)1 68 lead CQFP Low Profile (G4T)1 68 lead CQFP Low Profile (G4T)1 68 lead CQFP Low Profile (G4T)1 68 lead CQFP Low Profile (G4T) 68 lead CQFP (G2T)1 68 lead CQFP (G2T)1 68 lead CQFP (G2T)1 68 lead CQFP (G2T)
1 1
5962-94611 05HTX 5962-94611 06HTX 5962-94611 07HTX 5962-94611 08HTX 5962-94611 09HTX 5962-94611 10HTX 5962-94611 05HYX 5962-94611 06HYX 5962-94611 07HYX 5962-94611 08HYX 5962-94611 09HYX 5962-94611 10HYX 5962-94611 05HMX 5962-94611 06HMX 5962-94611 07HMX 5962-94611 08HMX 5962-94611 09HMX 5962-94611 10HMX 5962-94611 05H9X 5962-94611 06H9X 5962-94611 07H9X 5962-94611 08H9X 5962-94611 09H9X 5962-94611 10H9X
Note 1: Package Not Recommended For New Design
68 lead CQFP (G2T)1 68 lead CQFP (G2T)1 68 lead CQFP (G1U) 68 lead CQFP (G1U) 68 lead CQFP (G1U) 68 lead CQFP (G1U) 68 lead CQFP (G1U) 68 lead CQFP (G1U)
11
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