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PC923X
PC923X
s Features
1. Built-in direct drive circuit for MOS-FET/IGBT drive (IO1P, IO2P:0.4A) 2. High speed response (tPLH, tPHL:MAX.0.5s) 3. Wide operating supply voltage range (VCC:15 to 30V, Ta=-10 to 60C) 4. High noise reduction type (CMH=MIN.-1.5kV/s) (CML=MIN.1.5kV/s) 5. Recognized by UL, file No. E64380 (Model No.PC923) 6. High isolation voltage between input and output (VISO (rms)=5.0kV)
High Speed OPIC Photocoupler for MOS-FET / IGBT Drive
s Outline Dimensions
2.54
8 7 6
0.25
Lead forming type (I type) and taping reel type (P type) are also available. (PC923XI/PC923XP) TUV (VDE0884) approved type is also available as an option. (Unit : mm)
5
Anode mark
1 2 3 4
1.20.3 9.660.3
0.850.2 7.620.3 0.5TYP. 3.50.5
1. Inverter controlled air conditioners
3.40.5
s Applications s Absolute Maximum Ratings
3.050.5
0.50.1
6.50.5
PC923
0.260.1 :0 to 13
Internal connection diagram
8 7 6 5
(Ta=Topr unless otherwise specified) Parameter Symbol Rating Unit IF Forward current 20 mA *1 Reverse voltage 6 V VR 35 Supply voltage VCC V 0.1 O1 output current I1 A *2 0.4 A O1 peak output current IO1P 0.1 O2 output current IO2 A *2 0.4 A O2 peak output current IO2P 35 O1 output voltage VO1 V 500 Power dissipation mW PO 550 Total power dissipation mW Ptot *3 kV 5.0 Isolation voltage Viso (rms) -25 to +80 Operating temperature C Topr -55 to +125 Storage temperature C Tstg *4 260 Tsol C Soldering temperature
Input
Tr1
Interface
Tr2 Amp.
1 1 2 3 4
2
3 5 6 7 8
4
NC Anode Cathode NC
O1 O2 GND VCC
Output
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip.
*1 Ta=25C *2 Pulse width0.15s, Duty ratio:0.01 *3 40 to 60%RH, AC for 1minute, Ta=25C *4 For 10s
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/
PC923X s Electro-optical Characteristics
Parameter Input Forward voltage Reverse current Terminal capacitance Operating supply voltage
*6 *7
Symbol VF1 VF2 IR Ct VCC VO1L VO2H VO2L IO1L IO2L ICCH ICCL IFLH RISO tPLH tPHL tr tf CMH CML
O1 low level output voltage
O2 high level output voltage O2 low level output voltage *9 O1 leak current *10 O2 leak current
*8 *11
High level supply current Low level supply current "LowHigh" threshold input current Isolation resistance *13 "LowHigh" propagation delay time *13 "HighLow" propagation delay time *13 Rise time *13 Fall time Instantaneous common mode rejection voltage "Output:High level" Instantaneous common mode rejection voltage "Output:Low level"
*11
*12
Transfer characteristics Response time
Conditions Ta=25C, IF=10mA Ta=25C, IF=0.2mA Ta=25C, VR=5V Ta=25C, V=0, f=1kHz Ta=-10 to 60C - VCC1=12V, VCC2=-12V IO1=0.1A, IF=5mA VCC=VO1=24V, IO2=-0.1A, IF=5mA VCC=24V, IO2=0.1A, IF=0 Ta=25C, VCC=VO1=35V, IF=0 Ta=25C, VCC=VO2=35V, IF=5mA Ta=25C, VCC=24V, IF=5mA VCC=24V, IF=5mA Ta=25C, VCC=24V, IF=0 VCC=24V, IF=0 Ta=25C, VCC=24V VCC=24V Ta=25C, DC=500V, 40 to 60%RH Ta=25C, VCC=24V, IF=5mA RC=47, CG=3 000pF Ta=25C, VCM=600V (peak) IF=5mA, VCC=24V, VO2H=2.0V Ta=25C, VCM=600V (peak) IF=0, VCC=24V, VO2L=2.0V
*5
(Ta=Topr unless otherwise specified) MIN. TYP. MAX. Unit 1.75 - V 1.6 V 1.5 1.2 - - A - 10 - pF 30 250 15 V - 30 15 V - 24 - 18 - - - - - - - 0.3 0.2 5x1010 - - - - -1.5 1.5 0.2 21 1.2 - - 6 - 8 - 1.5 - 1011 0.3 0.3 0.2 0.2 - - 0.4 - 2.0 500 500 10 14 13 17 3.0 5.0 - 0.5 0.5 0.5 0.5 - - V V V A A mA mA mA mA mA mA s s s s kV/s kV/s
Output
*14
*14
*5 When measuring output and transfer characteristics, connect a by-pass capacitor (0.01F or more) between VCC and GND near the device *6 Refer to Fig.1 *7 Refer to Fig.2 *8 Refer to Fig.3 *9 Refer to Fig.4 *10 Refer to Fig.5 *11 Refer to Fig.6 *12 IFLH represents forward current when output goes from "Low" to "High", Refer to Fig.7 *13 Refer to Fig.8 *14 Refer to Fig.9
s Truth Table
Input ON OFF O2 Output High level Low level Tr.1 ON OFF Tr.2 OFF ON
PC923X s Test Circuit Fig.1
2 5 8
Fig.2
VCC1 V VO1L IO1 VCC2 IF
3 2
8 5 PC923X 6 7 VO2H V IO2 VCC
IF
3
PC923X
6 7
Fig.3
8 2 5
Fig.4
8 2 5
A IO1L PC923X
6
IF
3
PC923X
6
VCC V VO2L
7
IF
3
VCC
IO2
7
Fig.5
8 2 5
Fig.6
8 2
A ICC
A IO2L VCC IF
3
5
IF
3
PC923X
6 7
PC923X
6 7
VCC
Fig.7
8 2 5
Fig.8
8 2
IF Variable
3
PC923X
6
VCC V
7
VIN
tr=tf=0.01s Pulse width 5s Duty ratio 50%
3
5
PC923X
6
RG VOUT
7
VCC CG
Fig.9
8
50% VIN waveform
A
SW B
2 5
PC923X
6 3 7
VCC V VO2
tPLH
tPHL 90%
+
-
VOUT waveform tr tf
50% 10%
VCM VCM (Peak) VCM waveform CMH, VO2 waveform SW at A, IF=5mA VO2H VO2L VO2L GND GND VO2H
CML, VO2 waveform SW at B, IF=0mA
PC923X Fig.10 Forward Current vs. Ambient Temperature
60
Fig.11 Power Dissipation vs. Ambient Temperature
600 550 Power dissipation PO, Ptot (mW)
50 Forward current IF (mA)
500 Ptot 400 PO
40
30
300
20
200
10 0 -25
100 0 -40
0
25
50
75 80
100
125
0
25
50
75 80
100
125
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.12 Forward Current vs. Forward Voltage
100
Fig.13 "LowHigh" Relative Threshold Input Current vs. Supply Voltage
1.2 Ta=25C IFLH=1 at VCC=24V
Forward current IF (mA)
10
Relative threshold input current
1.1
1.0
1
Ta=0C 25C 50C 70C
0.9
0.1
0.8
0.01 1.0
1.2
1.4
1.6
1.8
2.0
2.2
0.7 15
18
21
24
27
30
Forward voltage VF (V)
Supply voltage VCC (V)
Fig.14 "LowHigh" Relative Threshold Input Current vs. Ambient Temperature
1.6 VCC=24V IFLH=1 at Ta=25C
Fig.15 O1 Low Level Output Voltage vs. O1 Output Current
0.4 O1 low level output voltage VO1L (V) 0.2 0.1 VCC1=12V VCC2=-12V IF=5mA Ta=25C
Relative threshold input current
1.4
1.2
0.05
1.0
0.02 0.01
0.8
0.6 -25
0
25
50
75
100
0.005 0.01
0.02
0.05
0.1
0.2
0.5
1.0
Ambient temperature Ta (C)
O1 output current IO1 (A)
PC923X Fig.16 O1 Low Level Output Voltage vs. Ambient Temperature
0.5 O1 low level output voltage VO1L (V) VCC1=12V VCC2=-12V IF=5mA
Fig.17 O2 High Level Output Voltage vs. Supply Voltage
30 O2 high level output voltage VO2H (V) Ta=25C IF=5mA
0.4
27
24
0.3 IO1=0.1A 0.2
21
18
0.1
15 12 15
0 -25
0
25
50
75
100
18
21
24
27
30
Ambient temperature Ta (C)
Supply voltage VCC (V)
Fig.18 O2 High Level Output Voltage vs. Ambient Temperature
24 O2 high level output voltage VO2H (V) VCC=24V IF=5mA IO2 Nearly=0A 22 -0.1A 21
Fig.19 O2 Low Level Output Voltage vs. O2 Output Current
4 O2 low level output voltage VO2L (V) 2 1 VCC=6V Ta=25C
23
0.5
20
0.2 0.1
19 18 -25
0.05 0 25 50 75 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0
Ambient temperature Ta (C)
O2 output current IO2 (A)
Fig.20 O2 Low Level Output Voltage vs. Ambient Temperature
1.5 O2 low level output voltage VO2L (V) VCC=24V IF=0 1.4
Fig.21 High Level Supply Current vs. Supply Voltage
12 High level supply current ICCH (mA)
10
1.3 IO2=0.1A 1.2
8
Ta=-25C 25C 80C
6
1.1
4
1.0 -25
0
25
50
75
100
2 15
18
21
24
27
30
Ambient temperature Ta (C)
Supply voltage VCC (V)
PC923X Fig.22 Low Level Supply Current vs. Supply Voltage
14 Propagation delay time tPHL, tPLH (s)
Fig.23 Propagation Delay Time vs. Forward Current
1.0 VCC=24V RG=47 CG=3 000pF Ta=75C 25C
Low level supply current ICCL (mA)
12
0.8 tPHL 0.6
10
Ta=-25C 25C 80C
-25C 0.4
8
6
0.2 75C tPLH 0 Ta=-25C 15 20 25C 25
4 15
18
21
24
27
30
0
5
10
Supply voltage VCC (V)
Forward current IF (mA)
Fig.24 Propagation Delay Time vs. Ambient Temperature
1.0 Propagation delay time tPHL, tPLH (s) VCC=24V RG=47 CG=3 000pF IF=5mA
0.8
0.6 tPLH 0.4 tPHL
0.2
0 -25
0
25
50
75
100
Ambient temperature Ta (C)
s Application Circuit (Foe Power MOS-FET Driving Inverter)
VCC Anode PC923X O1 O2 GND TTL, microcomputer, etc. + VCC2=12V U V W Power supply + VCC1=12V (+)
Cathode
(-)
NOTICE
G
The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: - - - Personal computers - -- Office automation equipment - -- Telecommunication equipment [terminal] - - - Test and measurement equipment - - - Industrial control - -- Audio visual equipment - -- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: - -- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) - - - Traffic signals - - - Gas leakage sensor breakers - - - Alarm equipment - -- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: - - - Space applications - -- Telecommunication equipment [trunk lines] - -- Nuclear power control equipment - -- Medical and other life support equipment (e.g., scuba).
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If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
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