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| MAC4DLM Sensitive Gate Triacs Silicon Bidirectional Thyristors Designed for high volume, low cost, industrial and consumer applications such as motor control; process control; temperature, light and speed control. * Small Size Surface Mount DPAK Package * Passivated Die for Reliability and Uniformity * Four-Quadrant Triggering * Blocking Voltage to 600 V * On-State Current Rating of 4.0 Amperes RMS at 93C * Low Level Triggering and Holding Characteristics * Device Marking: Device Type with "M'' truncated, e.g., MAC4DLM: AC4DLM, Date Code http://onsemi.com Preferred Device TRIACS 4.0 AMPERES RMS 600 VOLTS MT2 G MT1 MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Peak Repetitive Off-State Voltage (1) (TJ = -40 to 110C, Sine Wave, 50 to 60 Hz, Gate Open) MAC4DLM On-State RMS Current (Full Cycle Sine Wave, 60 Hz, TC = 93C) Peak Non-Repetitive Surge Current (One Full Cycle, 60 Hz, TJ = 110C) Circuit Fusing Consideration (t = 8.3 msec) Peak Gate Power (Pulse Width 10 msec, TC = 93C) Average Gate Power (t = 8.3 msec, TC = 93C) Peak Gate Current (Pulse Width 10 msec, TC = 93C) Peak Gate Voltage (Pulse Width 10 msec, TC = 93C) Operating Junction Temperature Range Storage Temperature Range Symbol VDRM, VRRM 600 IT(RMS) 4.0 Amps Value Unit Volts 4 1 2 12 4 3 3 ITSM I2t PGM PG(AV) IGM VGM TJ Tstg 40 6.6 0.5 0.1 0.2 5.0 - 40 to 110 - 40 to 150 Amps A2sec Watts Watts Amps Volts C C D-PAK CASE 369 STYLE 6 D-PAK CASE 369A STYLE 6 PIN ASSIGNMENT 1 2 3 4 Main Terminal 1 Main Terminal 2 Gate Main Terminal 2 ORDERING INFORMATION Device MAC4DLMT4 Package DPAK 369A Shipping 16mm Tape and Reel (2.5K/Reel) 75 Units/Rail (1) VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the device are exceeded. MAC4DLM-1 DPAK 369 Preferred devices are recommended choices for future use and best overall value. (c) Semiconductor Components Industries, LLC, 2000 1 May, 2000 - Rev. 1 Publication Order Number: MAC4DLM/D MAC4DLM THERMAL CHARACTERISTICS Characteristic Thermal Resistance -- Junction to Case Thermal Resistance -- Junction to Ambient Thermal Resistance -- Junction to Ambient (1) Maximum Lead Temperature for Soldering Purposes (2) (1) Surface mounted on minimum recommended pad size. (2) 1/8 from case for 10 seconds. Symbol RqJC RqJA RqJA TL Max 3.5 88 80 260 Unit C/W C ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted; Electricals apply in both directions) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Blocking Current (VD = Rated VDRM, VRRM; Gate Open) TJ = 25C TJ = 110C IDRM, IRRM mA -- -- -- -- 0.01 2.0 ON CHARACTERISTICS Peak On-State Voltage (1) (ITM = 6.0 A) Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 W) MT2(+), G(+) MT2(+), G(-) MT2(-), G(-) MT2(-), G(+) Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 W) MT2(+), G(+) MT2(+), G(-) MT2(-), G(-) MT2(-), G(+) Gate Non-Trigger Voltage (VD = 12 V, RL = 100 W, TJ = 110C) MT2(+), G(+); MT2(+), G(-); MT2(-), G(-); MT2(-), G(+) Holding Current (VD = 12 V, Gate Open, Initiating Current = 200 mA) Latching Current MT2(+), G(+) MT2(+), G(-) MT2(-), G(-) MT2(-), G(+) (VD = 12 V, IG = 5.0 mA) (VD = 12 V, IG = 5.0 mA) (VD = 12 V, IG = 5.0 mA) (VD = 12 V, IG = 10 mA) VTM -- IGT -- -- -- -- VGT 0.5 0.5 0.5 0.5 VGD 0.1 IH -- IL -- -- -- -- 1.75 5.2 2.1 2.2 10 10 10 10 1.5 15 mA 0.4 -- mA 0.62 0.57 0.65 0.74 1.3 1.3 1.3 1.3 Volts 1.8 2.1 2.4 4.2 3.0 3.0 3.0 5.0 Volts 1.3 1.6 mA Volts DYNAMIC CHARACTERISTICS Characteristic Rate of Change of Commutating Current (VD = 200 V, ITM = 1.8 A, Commutating dv/dt = 1.0 V/msec, TJ = 110C, f = 250 Hz, CL = 5.0 mfd, LL = 80 mH, RS = 56 W, CS = 0.03 mfd) With snubber see Figure 11 Critical Rate of Rise of Off-State Voltage (VD = 0.67 X Rated VDRM, Exponential Waveform, Gate Open, TJ = 110C) (1) Pulse Test: Pulse Width 2.0 msec, Duty Cycle 2%. Symbol di/dt(c) -- 3.0 -- Min Typ Max Unit A/ms dv/dt 10 -- -- V/ms http://onsemi.com 2 MAC4DLM Voltage Current Characteristic of Triacs (Bidirectional Device) + Current Quadrant 1 MainTerminal 2 + Symbol VDRM IDRM VRRM IRRM VTM IH Parameter Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current Maximum On State Voltage Holding Current IH Quadrant 3 VTM MainTerminal 2 - IRRM at VRRM on state VTM IH off state + Voltage IDRM at VDRM Quadrant Definitions for a Triac MT2 POSITIVE (Positive Half Cycle) + (+) MT2 (+) MT2 Quadrant II (-) IGT GATE MT1 REF (+) IGT GATE MT1 REF Quadrant I IGT - (-) MT2 (-) MT2 + IGT Quadrant III (-) IGT GATE MT1 REF (+) IGT GATE MT1 REF Quadrant IV - MT2 NEGATIVE (Negative Half Cycle) All polarities are referenced to MT1. With in-phase signals (using standard AC lines) quadrants I and III are used. http://onsemi.com 3 MAC4DLM TC , MAXIMUM ALLOWABLE CASE TEMPERATURE ( C) P(AV) , AVERAGE POWER DISSIPATION (WATTS) 110 6.0 180 5.0 4.0 3.0 2.0 60 90 120 dc 105 a = 30 60 90 a = CONDUCTION ANGLE 100 95 120 180 90 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 IT(RMS), RMS ON-STATE CURRENT (AMPS) a = CONDUCTION ANGLE dc 4.0 a = 30 1.0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 IT(RMS), RMS ON-STATE CURRENT (AMPS) Figure 1. RMS Current Derating Figure 2. On-State Power Dissipation I T, INSTANTANEOUS ON-STATE CURRENT (AMPS) TYPICAL @ TJ = 25C 10 MAXIMUM @ TJ = 110C r(t) , TRANSIENT RESISTANCE (NORMALIZED) 100 1.0 0.1 ZqJC(t) = RqJC(t)Sr(t) 1.0 MAXIMUM @ TJ = 25C 0.1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) 0.01 0.1 1.0 10 100 1000 10 K t, TIME (ms) Figure 3. On-State Characteristics Figure 4. Transient Thermal Response 8.0 VGT, GATE TRIGGER VOLTAGE (VOLTS) I GT, GATE TRIGGER CURRENT (mA) 7.0 6.0 5.0 4.0 Q2 3.0 Q1 2.0 1.0 0 -40 -25 -10 5.0 20 35 50 65 80 95 110 Q3 Q4 1.0 Q4 Q1 0.8 Q2 0.6 Q3 0.4 0.2 -40 -25 -10 5.0 20 35 50 65 80 95 110 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 5. Typical Gate Trigger Current versus Junction Temperature Figure 6. Typical Gate Trigger Voltage versus Junction Temperature http://onsemi.com 4 MAC4DLM 5.0 12 10 8.0 6.0 4.0 IH , HOLDING CURRENT (mA) IL, LATCHING CURRENT (mA) 4.0 3.0 MT2 NEGATIVE 2.0 MT2 POSITIVE 1.0 0 -40 -25 Q2 Q4 Q3 2.0 Q1 0 -10 5.0 20 35 50 65 80 95 110 -40 -25 -10 5.0 20 35 50 65 80 95 110 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 7. Typical Holding Current versus Junction Temperature Figure 8. Typical Latching Current versus Junction Temperature 40 35 STATIC dv/dt (V/ ms) 30 25 20 15 10 5.0 100 1000 RGK, GATE-MT1 RESISTANCE (OHMS) 10 K MAC4DLM dv/dt(c), CRITICAL RATE OF RISE OF COMMUTATING VOLTAGE (V/ m s) VD = 400 V TJ = 110C 10 VPK = 400 V TJ = 110C 100C 90C 1.0 tw VDRM f= 1 2 tw 6f I (di/dt)c = TM 1000 0.1 0 1.0 2.0 3.0 4.0 5.0 6.0 di/dt(c), RATE OF CHANGE OF COMMUTATING CURRENT (A/ms) Figure 9. Minimum Exponential Static dv/dt versus Gate-MT1 Resistance Figure 10. Critical Rate of Rise of Commutating Voltage LL 200 VRMS ADJUST FOR ITM, 60 Hz VAC TRIGGER CHARGE CONTROL TRIGGER CONTROL MEASURE I RS 1N4007 - CS 1N914 51 W MT2 MT1 G ADJUST FOR + di/dt(c) CHARGE 200 V NON-POLAR CL Note: Component values are for verification of rated (di/dt)c. See AN1048 for additional information. Figure 11. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt)c http://onsemi.com 5 MAC4DLM MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.165 4.191 0.100 2.54 0.118 3.0 0.063 1.6 0.190 4.826 0.243 6.172 inches mm DPAK http://onsemi.com 6 MAC4DLM PACKAGE DIMENSIONS D-PAK CASE 369-07 ISSUE L B V R 4 C E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G H J K R S V INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.090 BSC 0.034 0.040 0.018 0.023 0.350 0.380 0.175 0.215 0.050 0.090 0.030 0.050 MT1 MT2 GATE MT2 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 2.29 BSC 0.87 1.01 0.46 0.58 8.89 9.65 4.45 5.46 1.27 2.28 0.77 1.27 A 1 2 3 S -T- SEATING PLANE K F D G 3 PL M J H 0.13 (0.005) T STYLE 6: PIN 1. 2. 3. 4. D-PAK CASE 369A-13 ISSUE Z -T- B V R 4 SEATING PLANE C E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --- 0.030 0.050 0.138 --- MT1 MT2 GATE MT2 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --- 0.77 1.27 3.51 --- A S 1 2 3 Z U K F L D G 2 PL J H 0.13 (0.005) T DIM A B C D E F G H J K L R S U V Z M STYLE 6: PIN 1. 2. 3. 4. http://onsemi.com 7 MAC4DLM ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION NORTH AMERICA Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com Fax Response Line: 303-675-2167 or 800-344-3810 Toll Free USA/Canada N. American Technical Support: 800-282-9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor - European Support German Phone: (+1) 303-308-7140 (M-F 1:00pm to 5:00pm Munich Time) Email: ONlit-german@hibbertco.com French Phone: (+1) 303-308-7141 (M-F 1:00pm to 5:00pm Toulouse Time) Email: ONlit-french@hibbertco.com English Phone: (+1) 303-308-7142 (M-F 12:00pm to 5:00pm UK Time) Email: ONlit@hibbertco.com EUROPEAN TOLL-FREE ACCESS*: 00-800-4422-3781 *Available from Germany, France, Italy, England, Ireland CENTRAL/SOUTH AMERICA: Spanish Phone: 303-308-7143 (Mon-Fri 8:00am to 5:00pm MST) Email: ONlit-spanish@hibbertco.com ASIA/PACIFIC: LDC for ON Semiconductor - Asia Support Phone: 303-675-2121 (Tue-Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: 001-800-4422-3781 Email: ONlit-asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2745 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 8 MAC4DLM/D |
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