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CSPEMI204 2 Channel Headset EMI Filter with ESD Protection
Features
* * * * * * * * Two channels of EMI filtering, one for a microphone and one for an earpiece speaker Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Chip Scale Package features extremely low parasitic inductance for optimum filter performance Greater than 30dB relative attenuation in the 8002700MHz range +8kV ESD protection on each channel (IEC 610004-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) 5-bump, 0.950mm X 1.41mm footprint Chip Scale Package (CSP) Lead-free version available
Product Description
The CSPEMI204 is a low-pass filter array designed specifically to reduce EMI/RFI emissions and provide ESD protection for a headset port on a cellular and mobile devices. The CSPEMI204 integrates two high quality, pi-style filters (C-R-C) filters, one for a microphone and one for an earpiece or speaker, each providing more than 30dB attenuation relative to the pass band attenuation in the 800-2700 MHz range. These filters support bidirectional filtering, reducing EMI both to and from the headset port and support bipolar audio signals without distortion. In addition, the CSPEMI204 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI204 protects sensitive components such as CPU and DSPs that have much weaker internal ESD protection circuitry usually only intended for mechanical handling protection. The CSPEMI204 is particularly well suited for portable electronics because of its small package format and low weight. The CSPEMI204 is available in a spacesaving, low-profile Chip Scale Package with optional lead-free finishing.
Applications
* * * * * * EMI filtering and ESD protection for headset microphone and earpiece speaker ports Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders
Electrical Schematic
10 Earpiece A1 Input 100pF 100pF C1 Earpiece Output Microphone A3 Input
68 C3 Microphone Output 47pF GND B2 47pF
(c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
1
CSPEMI204
PACKAGE / PINOUT DIAGRAMS
TOP VIEW (Bumps Down View)
Orientation Marking (see note 2)
BOTTOM VIEW (Bumps Up View)
123 A
A3 A1
EAR_IN
AE
MIC_IN
Orientation Marking
B C
B2
GND
C3
MIC_OUT
C1
EAR_OUT
CSPEMI204
Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN A1 A3 B2 C1 C3 NAME EAR_IN MIC_IN GND EAR_OUT MIC_OUT DESCRIPTION Earpiece Input (from audio circuitry) Microphone Input (from microphone) Device Ground Earpiece Output (to earpiece) Microphone Output (to audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Ordering Part Bumps 5 Package CSP Number1 CSPEMI204 Part Marking AE Lead-free Finish 2 Ordering Part Number1 CSPEMI204G Part Marking AE
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
1A
www.calmicro.com
10/09/03
CSPEMI204
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL R1 R2 C1 C2 ILEAK VSIG PARAMETER Resistance Resistance Capacitance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 6 Cut-off frequency 2; Note 6 VIN=5.0V ILOAD = 10mA 5 -5 Notes 2,4 and 5 15 8 Notes 2,3,4 and 5 +15 -19 R = 10, C = 100pF R = 68, C = 47pF 33 61 V V MHz MHz kV kV 7 -10 15 -15 V V CONDITIONS MIN 9 54 80 38 TYP 10 68 100 47 MAX 11 75 120 57 1.0 UNITS pF pF A
VESD
VCL
fC1 fC2
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. Note 6: ZSOURCE=50, ZLOAD =50
(c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
CSPEMI204
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Microphone Circuit (A3-C3) EMI Filter Performance
(c) 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/09/03
CSPEMI204
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03
Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
5
CSPEMI204
Mechanical Details
CSP Mechanical Specifications CSPEMI204 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B2 B1 C A2 B A B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 0.905 1.365 0.495 0.245 0.430 0.430 0.175 0.220 0.561 0.355 Nom 0.950 1.410 0.500 0.250 0.435 0.435 0.225 0.270 0.605 0.380 Max 0.995 1.455 0.505 0.255 0.440 0.440 0.275 0.320 0.649 0.405 Min Custom CSP 5 Inches Nom Max 0.0356 0.0374 0.0392 0.0537 0.0555 0.0573 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0069 0.0089 0.0108 0.0087 0.0106 0.0126 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces
123
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI204 Chip Scale Package
C2
D1 D2
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 1.52 X 1.07 X 0.72 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7")
10 Pitches cumulative tolerance on tape 0.2 mm
PART NUMBER CSPEMI204
CHIP SIZE (mm) 1.41 X 0.95 X 0.6
QTY PER REEL 3500
P0 4mm
P1 4mm
Po Top Cover Tape
Ao W Bo
Ko
For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User direction of feed
Center lines of cavity
Figure 6. Tape and Reel Mechanical Data
(c) 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/09/03

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