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| 3& 0LFURSURFHVVRU 0%\WH /&DFKH 0XOWL&KLS 0RGXOH )DFW 6KHHW 0DLQ )HDWXUHV * PC755B RISC microprocessor * 8 Mbit of Synchronous Pipelined Burst SRAM configured as 128Kx72 (L2-Cache) * Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications 0XOWL&KLS 0RGXOH %HQHILWV * * * * * * * * * 60% space savings Reduced ball count from 560 down to 255; reduced PWB density, reduced PWB cost Eliminates high-speed memory board design Suitable for hi-rel applications Reliability data available upon request Reduced part count Scalable and expandable Footprint compatible with PCX745BVZFUxxxLE Upgradeable to PC7410M16MGxxxLE 3HUIRUPDQFH )HDWXUHV * Core Frequency: 300 MHz, 350 MHz * L2 Cache Frequency: 150 MHz, 175 MHz * 60x Bus Frequency: 66 MHz 'LVFUHWH $SSURDFK 3&%00*[[[ 6SDFH 6DYLQJV 3URFHVVRU 74)3 %*$ 74)3 $UHD ,2 &RXQW PP!AA [ PP! %*$ 74)3 PP! PP! PC755B8MCMFS - Rev.4 - 0503 * 3DFNDJLQJ - 25x21mm, 255-pin Ceramic BGA - 21mm x 25mm CI-CGA (optional/developmental) - 525mm2 Multilayer ceramic interposer, Al2O3 - High reliability flip-chip die attach: C4 process on 755 & SSRAM - JEDEC level 2 underfill optimized for ceramic bond - Same technology used reliability in automotive industry for over 30 years - Lowest possible inductance chip interconnect technology - Highest possible chip density for reduced interposer dimension * %DOO DWWDFK - Ball diameter/height: 0.80mm before reflow - 1.27mm pitch - 255 balls in 16x16 array (minus one - for optical) - Module height: 3.90 mm max * 6FUHHQLQJ - Full Military temperature range: - Industrial temperature range: Tj = -55C to +125C Tj = -40C to +110C 3&% Device Type (PCX755B if prototype) M = MULTICHIP PACKAGE / &DFKH 'HQVLW\ 8: 8Mbit 128K x 72 SSRAM 0 0 * / ( 5HYLVLRQ OHYHO E: Rev 2.8 %XV )UHTXHQF\ 'LYLGHU L: Any valid PLL configuration 0D[ LQWHUQDO SURFHVVRU VSHHG 3DFNDJH G: CBGA 300 MHz 350 MHz 7HPSHUDWXUH UDQJH 7M M: -55, +125C V: -40, +110C For availability of the different versions, please contact your Atmel sales office or visit our web site at http://www.atmel.com You may also contact the PowerPC technical hotline at std.hotline@gfo.atmel.com Specifications and information herein are subject to change without notice. BP123 - 38521 Saint-Egreve Cedex - France - Tel: +33 (0)4 76 58 30 00 - Fax: +33 (0)4 76 58 34 80 |
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