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| www..com T2035H Series SnubberlessTM high temperature 20 A Triacs Main features Symbol IT(RMS) VDRM/VRRM IGT (Q1) Tj MAX Value 20 600 35 150 Unit A V mA C G A1 A2 A2 Description Specifically designed to operate at 150 C, the new 20 A T2035H Triacs provide an enhanced performance in terms of power loss and thermal dissipation. This facilitates the optimization of heatsink dimensioning, leading to improved space and cost effectiveness when compared to electromechanical solutions. Based on ST SnubberlessTM technology, the T2035H series offers high commutation switching capabilities and high noise immunity levels on the full range of Tj. The T2035H series facilitates the optimization of the control of universal motors and inductive loads found in appliances such as vacuum cleaners, and washing machines. The T2035H Triacs are also suitable for use in high temperature environment found in hot appliances such as cookers, ovens, hobs, electric heaters, and coffee machines. A2 G A1 A2 TO-220AB T2035H-T D2PAK T2035H-G Order code Part number T2035H-600G T2035H-600G-TR T2035H-600TRG Marking T2035H-600G T2035H-600G T2035H-600T TM: Snubberless is a trademark of STMicroelectronics July 2006 Rev 1 1/10 www.st.com 10 www..com Characteristics T2035H Series 1 Table 1. Symbol IT(RMS) ITSM It dI/dt VDSM/VRSM IGM PG(AV) Tstg Tj TI Characteristics Absolute maximum ratings Parameter RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle sine wave, Tj initial = 25 C) It Value for fusing Critical rate of rise of on-state current IG = 2xIGT, tr 100 ns Non repetitive surge peak off state voltage Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range Maximum leads soldering temperature during 10 s tp = 20 s F = 60 Hz F = 50 Hz Tc = 127 C t = 16.7 ms t = 20 ms tp = 10 ms F = 120 Hz Tj = 125 C Tj = 25 C Tj = 150 C Tj = 150 C Value 20 210 A 200 283 50 700 4 1 -40 to +150 -30 to +150 260 A2s A/s V A W C C Unit A Table 2. Symbol IGT (1) VGT VGD IH (2) Electrical characteristics (Tj = 25 C, unless otherwise specified) Test conditions VD = 12 V, RL = 33 VD = VDRM, RL =3.3 k, Tj = 150 C IT = 100 mA I - III IG = 1.2 x IGT VD = 67% VDRM, gate open, Tj = 150 C Without snubber, Tj = 150 C Quadrant I - II - III I - II - III I - II - III MAX MAX MIN MAX MAX II MIN MIN 80 300 8.9 Value 35 1.3 0.15 35 50 Unit mA V V mA mA IL dV/dt (2) (dI/dt)c (2) V/s A/ms 1. minimum IGT is guaranteed at 5% of IGT max 2. for both polarities of A2 referenced to A1 2/10 www..com T2035H Series Table 3. Symbol VTM (1) VTO RD (1) (1) Characteristics Static electrical characteristics Test conditions ITM= 28 A, tp = 380 s Tj = 25 C Tj = 150 C Tj = 150 C Tj = 25 C VDRM = VRRM VD/VR = 400 V (at peak mains voltage) MAX MAX MAX Value 1.5 0.80 21 5 MAX 7.4 mA Tj = 150 C 4.8 Unit V V m A IDRM IRRM Tj = 150 C 1. for both polarities of A2 referenced to A1 Table 4. Symbol Rth (j-c) Rth (j-a) Thermal resistance Parameter Junction to case for full (AC) S = 1 cm Junction to ambient TO-220AB 60 D2PAK TO-220AB D2PAK Value 1 45 C/W Unit Figure 1. P(W) 24 22 20 18 16 14 12 10 8 6 4 2 0 0 2 =180 Maximum power dissipation vs RMS on-state current (full cycle) Figure 2. IT(RMS) (A) 22 20 18 16 14 12 10 8 6 RMS on-state current versus case temperature =180 180 4 2 0 TC(C) 0 25 50 75 100 125 150 IT(RMS)(A) 4 6 8 10 12 14 16 18 20 3/10 www..com Characteristics T2035H Series Figure 3. RMS on-state current vs ambient temperature (epoxy printed circuit board FR4 ecu = 35 m) =180 SCU=1cm Figure 4. Relative variation of thermal impedance vs pulse duration IT(RMS) (A) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 50 75 100 125 150 Tamb(C) 1.E-02 1.E-01 1.E+00 K=[Zth/Rth] Zth(j-c) Zth(j-a) tP(s) 1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 5. ITM(A) 100 On-state characteristics (maximum values) Figure 6. ITSM(A) 220 200 180 Surge peak on-state current vs number of cycles Tj=150C 160 140 Tj=25C Non repetitive Tj initial=25C t=20ms One cycle 10 120 100 80 60 Tj max. : VT0 = 0.80 V RD = 21 mW Repetitive Tc=127C 40 20 0 1 10 Number of cycles 100 1000 VTM(V) 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Figure 7. Non repetitive surge peak on-state current (sinusoidal pulse width tp<10 ms) and value of It Figure 8. Relative variation of gate trigger current, holding current and latching current vs junction temperature (typical values) ITSM(A), It (As) 10000 Tj initial=25C IGT, IH, IL [T j] / IGT, IH, IL [T j=25C] 2.5 dI/dt limitation: 50A/s 2.0 IGT 1.5 1000 ITSM IH & IL 1.0 It 0.5 Tj(C) -40 -20 0 20 40 60 80 100 120 140 160 tP(ms) 100 0.01 0.0 0.10 1.00 10.00 4/10 www..com T2035H Series Characteristics Figure 9. Relative variation of critical rate of Figure 10. Relative variation of critical rate of decrease of main current (di/dt)c vs decrease of main current (di/dt)c reapplied (dV/dt)c versus junction temperature 8 7 (dI/dt)c [T j] / (dI/dt)c [T j=125C] 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 (dI/dt)c [ (dV/dt) c ] / Specified (dI/dt) c 6 5 4 3 2 dV/dt (V/s) 1 Tj(C) 0.1 1.0 10.0 100.0 0 25 50 75 100 125 150 Figure 11. Leakage current versus junction temperature for different values of blocking voltage (typical values) IDRM/IRRM(mA) Figure 12. Acceptable repetitive peak off-state voltage versus case-ambient thermal resistance Rth(c-a) (C/W) 10 9 1.E+01 VDRM=VRRM=600 V 1.E+00 VDRM=VRRM=400 V 8 7 6 Rth(j-c)=1C/W TJ=150C 1.E-01 VDRM=VRRM=200 V 5 4 1.E-02 3 2 1.E-03 T j(C) 1 0 300 VDRM/VRRM(V) 350 400 450 500 550 600 1.E-04 50 75 100 125 150 Figure 13. D2PAK junction to ambient thermal resistance versus copper surface under tab (PCB FR4, copper thickness 35 m) Rth(j-a) (C/W) 80 DPAK 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 SCU(cm) 5/10 www..com Ordering information scheme T2035H Series 2 Ordering information scheme T Triac series Current 20 = 20 A Sensitivity 35 = 35 mA High temperature Voltage 600 = 600 V Package G = D2PAK T = TO-220AB Packing mode Blank = Tube (D2PAK) -TR = Tape and reel (D2PAK) RG = Tube (TO-220AB) 20 35 H - 600 T (-TR) 6/10 www..com T2035H Series Package information 3 Package information Table 5. TO-220AB dimensions DIMENSIONS REF. Millimeters Min. A B OI L F b2 C Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.90 0.598 a1 a2 B b1 14.00 0.511 10.40 0.393 0.88 0.024 1.32 0.048 4.60 0.173 0.70 0.019 2.72 0.094 2.70 0.094 6.60 0.244 3.85 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 A I4 l3 a1 l2 c2 b2 C c1 c2 e M a2 b1 e c1 F OI I4 L l2 l3 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 0.104 1.70 0.044 1.70 0.044 0.102 0.116 0.066 0.066 7/10 www..com Package information Table 6. D2PAK dimensions T2035H Series DIMENSIONS REF. Millimeters Min. A A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D B2 C L L3 A1 B2 B G A2 2mm min. FLAT ZONE R C2 C D E G L L2 V2 L3 M R V2 0.40 typ. 0 8 0.016 typ. 0 8 Figure 14. D2PAK Footprint 16.90 10.30 1.30 5.08 8.90 3.70 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 www..com T2035H Series Ordering information 4 Ordering information Part number T2035H-600G T2035H-600G-TR T2035H-600TRG Marking T2035H-600G T2035H-600G T2035H-600T Package D2PAK D PAK TO-220AB 2 Weight 1.5 g 1.5 g 2.3 g Base Qty 50 1000 50 Packing mode Tube Tape and Reel Tube 5 Revision history Date 13-Jul-2006 Revision 1 Initial release. Changes 9/10 www..com T2035H Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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