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| CHIP THERMISTOR Chip thermistors are specially processed, highly reliable thermistors with electrodes of silver and palladium alloy. They can be face bonded to act as thermal compensators for ICs and they are manufactured in sizes down to 1 square mm, they can also be used to detect temperature with relatively small time constants. EIAJ type Part number 10K C 1 5 -2125 - 1P 1% R25 Dimension 2125 : Fig1 1608: Fig2 Chip thermistor Rated zero-power resistance at 25 C 10K:10k Precautions Taping Dimensions Glass coating 5 1.2 0.2 2.0 0.2 0.8 1.5 1.6 0.15 0.95 max. 1.2 max. 0.2 0.5 0.2 0.2 0.5 0.5 Recommended land dimensions for PCB 1.5 Electrode (Soldered) 0.2 0.5 Electrode (Soldered) (1.2max.) 2.0max. ( ):1608type 4.0 0.1 2.0 0.05 Unit(mm) Minimum quantity:4000pcs/reel Recommended land dimensions for PCB 1.2 1.3 1.1 1.3 1.0 1.0 1.0 Unit(mm) Reflow soldering profile Preheat(air) Temperature 225 235 C 130 160 C Soldering Cooling 1 3 C/s 60s max. 1 2 10s C/s max. Time Specifications Part No. 10KC15-2125-1P 10KC15-2125-2P 10KC15-2125-3P 10KC15-1608-1P 10KC15-1608-2P 10KC15-1608-3P R25*1 10k 10k 10k 10k 10k 10k 1% 2% 3% 1% 2% 3% B value*2 3435K 3435K 3435K 3435K 3435K 3435K 1% 1% 1% 1% 1% 1% Dissipation factor (mW/ C) 1.0 1.0 1.0 0.9 0.9 0.9 Thermal time constant(s)*3 7.5 7.5 7.5 5.0 5.0 5.0 Rated power at 25 C(mW) 5.0 5.0 5.0 4.5 4.5 4.5 Operating temp. range( C) 40 125 40 125 40 125 40 125 40 125 40 125 *1 R25 : Rated zero-power resistance value at 25 C. *2 B value : determined by rated zero-power resistance at 25 C and 85 C. *3 Time when thermistor temperature reaches 63.2% of the temperature difference. The value is measured in the air. 12 (1.85 0.1) 2.4 0.2 Glass coating 8.0 0.3 Fig1 2125 type Fig2 1608 type 3.5 0.05 1.75 0.1 Do not expose the thermistors to high soldering heat for too long. (260 C for not longer than 10s is recommened) 0.6max. 1.5 0.1 0 4.0 0.1 (1.0 0.1) 1.65 0.2 CHIP THERMISTOR Chip thermistors are specially processed, highly reliable thermistors with electrodes of silver and palladium alloy. They can be face bonded to act as thermal compensators for ICs and they are manufactured in sizes down to 1 square mm, they can also be used to detect temperature with relatively small time constants. Part number Dimensions A Type Dimension a b (2.0mm 4.0mm) Dimension d (0.5mm) Chip thermistor Rated zero-power resistance at 25 C 10K:10k b Electrode Taping Some types can be taped in the following shape : 1K C 5 -2040 a 1.75 0.1 3.5 0.05 1 0.2 1.5 0.1 0 4.0 0.1 4.0 0.1 0.2 0.05 Precautions 2 0.05 a b Electrode d : 1.0 0.1 0.2 c : 1 0.2 The thermistors are not moisture proof, so store them in a dry place. Do not expose the thermistors to high soldering heat for too long.(220 C for not longer than 5 sec. is recommended) B Type b Electrode d : 0.5 0.05 0.15 8.0 0.3 Unit (mm) Minimum quantity: 3000pcs/reel a Specifications Part No 500C0-1717 1KC0-1717 2KC0-1212 5KC0-1111 10KC0-1717 20KC0-1212 A Type R25*1 0.5k 10% 1.0k 10% 2.0k 10% 5.0k 10% 10.0k 10% 20.0k 10% B value*2 3250K 5% 3400K 5% 3500K 5% 3850K 5% Part No 500C5-2039 1KC5-2040 2KC5-2020 5KC5-2012 10KC5-2038 20KC5-2019 B Type(d 0.5) R25*1 0.5k 10% 1.0k 10% 2.0k 10% 5.0k 10% 10.0k 10% 20.0k 10% B value*2 3250K 5% 3400K 5% 3500K 5% 3850K 5% Part No 1KC10-3239 2KC10-3220 5KC10-3224 10KC10-3212 20KC10-3238 B Type(d 1.0) R25*1 1.0k 2.0k 5.0k 10.0k 20.0k 10% 10% 10% 10% 10% B value*2 3250K 5% 3500K 5% 3850K 5% : Rated zero-power 25 C. *1 R25value : determined by resistance value atresistance rated *1 B temp. range: 30 110 C zero-power Operating at 25 C and 85 C. c : 1 0.2 Unit (mm) 13 |
Price & Availability of 10KC0-1717
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