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DB-499D-470
RF power amplifier using 1 x START499D NPN RF silicon transistor
Preliminary Data
Features

Excellent thermal stability Frequency: 430 - 470 MHz Supply voltage: 3.6 V Output power: 29 dBm Power gain: 19 dB Efficiency: 52 % BeO free amplifier
Mechanical specification: L = 60 mm, W = 30 mm
Description
The DB-499D-470 is a NPN silicon RF power amplifier designed for UHF 2-way radio applications Table 1.
Device summary
Order codes DB-499D-470
February 2009
Rev 1
1/11
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This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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Contents
DB-499D-470
Contents
1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 VCC = 3.6, ICQ = 400 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 5
Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 5.2 Thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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DB-499D-470
Electrical data
1
1.1
Electrical data
Maximum ratings
Table 2.
Symbol VCEO VEBO IC PDISS TJ TSTG
Absolute maximum ratings (TCASE = +25 C)
Parameter Collector - emitter voltage Emitter - base voltage Collector - current Power dissipation Max. operating junction temperature Storage temperature Value 4.5 1.5 1.0 1.7 150 -65 to +150 Unit V V A W C C
2
Electrical characteristics
TA = +25 C, VCC = 3.6 V, Icq = 400 mA, unless otherwise specified Table 3.
Symbol f Pout Gp ND H2 H3
RF data
Parameters Frequency range Output power Power gain Efficiency 2nd harmonic 3rd harmonic PIN = 10 dBm POUT = 29 dBm POUT = 29 dBm PIN = 10 dBm PIN = 10 dBm Test conditions Min 430 29 19 51 - 54 -30 -50 Typ Max 470 Unit MHz dBm dB % dBc dBc
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Typical performance
DB-499D-470
3
3.1
Figure 1.
Typical performance
VCC = 3.6, ICQ = 400 mA
Gain vs output power Figure 2. Efficiency vs Pout
Figure 3.
Harmonics
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DB-499D-470
Test circuit
4
Test circuit
Table 4. Test circuit schematic
Table 5.
Components part list for DB-499D-470
Description Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Inductor Inductor Inductor Inductor Ferrite Bead Resister Potentiometer Resister 470 10 k 4.7 L = 14 mm L = 2 mm Transmission line L = 3.6 mm L = 12.5 mm BJT 0603 W=0.9 mm W=0.9 mm W=0.9 mm W=0.9 mm STMicroelectronics FR4 Er=4.5 THk = 0.020" 1 OZ Cu both sides START499D Value 10 F 10 nF 100 nF 1000 pF 100 pF 12 pF 15 pF 47 nH 22 nH 8.2 nH 2.55 nH Case size 0603 0603 0603 0603 0603 0603 0603 0603 1812 0603 0906 0603 0603 Bourns electronics 3214W-1-103E Manufacturer MURATA MURATA MURATA MURATA MURATA MURATA MURATA Coilcraft Coilcraft Coilcraft Coilcraft PANASONIC Part code GRM188R60J106ME47 GRM188R71H103KA01 GRM188R71H104KA01 GRM188R71H102KA01 GRM1885C1H101JA01 GRM1885C1H120JA01 GRM1885C1H150JA01 0603HP-47NXJL 1812SMS-22NJLB 0603HP-8N2XJL 0906-3JLB EXCELDRC35C
Component ID C1 C2 C3 C5, C7 C4,C6,C8,C11 C9 C10 L1 L2 L3 L4 B1, B2 R1 R2 R3 TL1 TL2 TL3 TL4 BJT1 Board
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Package mechanical data
DB-499D-470
5
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 6.
Dim. Min A B B1 C C1 D D1 E e e1 H L 1.4 0.44 0.36 0.35 0.35 4.4 1.62 2.29 1.42 2.92 3.94 0.89
SOT-89 mechanical data
mm. Typ Max 1.6 0.56 0.48 0.44 0.44 4.6 1.83 2.6 1.57 3.07 4.25 1.2 Min 55.1 17.3 14.2 13.8 13.8 173.2 63.8 90.2 55.9 115.0 155.1 35.0 Inch Typ Max 63.0 22.0 18.9 17.3 17.3 181.1 72.0 102.4 61.8 120.9 167.3 47.2
Figure 4.
Package dimensions
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DB-499D-470
Package mechanical data
5.1
Thermal pad and via design
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 5. Pad layout details
SOT-89
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Package mechanical data
DB-499D-470
5.2
Soldering profile
Figure 6 shows the recommended solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 6. Recommended solder profile
Figure 7 shows the recommended solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 7. Recommended solder profile for leaded devices
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DB-499D-470 Figure 8. Reel information
Package mechanical data
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Revision history
DB-499D-470
6
Revision history
Table 7.
Date 23-Feb-2009
Document revision history
Revision 1 First release Changes
10/11
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DB-499D-470
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