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| P 17 www..com Heatsink For capsule devices Dimensions in mm P 17 Features Dimensions in mm 1 17-03-2005 ADR (c) by SEMIKRON P 17 www..com Fig.1 Thermal resistance vs. dissipated power Fig.5a Thermal resistance and pressure drop vs. air flow Fig.5b Thermal resistance and pressure drop vs. air flow Fig.9a Transient thermal impedance vs.time Fig.9b Transient thermal impedance vs.time 2 17-03-2005 ADR (c) by SEMIKRON P 17 www..com Fig.11a Transient thermal impedance vs.time Fig.11b Transient thermal impedance vs.time Fig.11c Transient thermal impedance vs.time Fig.11d Transient thermal impedance vs.time Fig.11e Transient thermal impedance vs.time Fig.11f Transient thermal impedance vs.time 3 17-03-2005 ADR (c) by SEMIKRON P 17 www..com Dimensions in mm Dimensions in mm 4 17-03-2005 ADR (c) by SEMIKRON |
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