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IRF6715MPbF IRF6715MTRPbF
l RoHs Compliant and Halogen Free l Low Profile (<0.6 mm) l Dual Sided Cooling Compatible l Ultra Low Package Inductance l Optimized for High Frequency Switching l Ideal for CPU Core DC-DC Converters l Optimized for Sync. FET socket of Sync. Buck Converter l Low Conduction and Switching Losses l Compatible with existing Surface Mount Techniques l 100% Rg tested
PD - 96117B
Typical values (unless otherwise specified)
DirectFET Power MOSFET RDS(on) Qrr
37nC
VDSS
tot
VGS
RDS(on) Vgs(th)
1.9V
25V max 20V max 1.3m@ 10V 2.1m@ 4.5V
Qg
Qgd
12.0nC
Qgs2
5.3nC
Qoss
26nC
40nC
MX
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ SX ST MQ MX MT MP
DirectFET ISOMETRIC
Description
The IRF6715MPbF combines the latest HEXFET(R) Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF6715MPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6715MPbF has been optimized for parameters that are critical in synchronous buck including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6715MPbF offers particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications.
Absolute Maximum Ratings
Parameter
VDS VGS ID @ TA = 25C ID @ TA = 70C ID @ TC = 25C IDM EAS IAR
4
Typical RDS(on) (m)
Max.
Units
V
Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Single Pulse Avalanche Energy Avalanche CurrentAg
g
e e f
h
VGS, Gate-to-Source Voltage (V)
25 20 34 27 180 270 200 27
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 0 20 40 60 80 100 ID= 27A VDS= 20V VDS= 13V
A
mJ A
ID = 34A 3 2 1 T J = 25C 0 2 4 6 8 10 12 14 16 18 20
T J = 125C
120
VGS, Gate -to -Source Voltage (V)
Notes: Click on this section to link to the appropriate technical paper. Click on this section to link to the DirectFET Website. Surface mounted on 1 in. square Cu board, steady state.
Fig 1. Typical On-Resistance Vs. Gate Voltage
QG Total Gate Charge (nC)
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
TC measured with thermocouple mounted to top (Drain) of part. Repetitive rating; pulse width limited by max. junction temperature. Starting TJ = 25C, L = 0.56mH, RG = 25, IAS = 27A.
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04/30/09
IRF6715MPbF
Static @ TJ = 25C (unless otherwise specified)
Parameter
BVDSS VDSS/TJ RDS(on) VGS(th) VGS(th)/TJ IDSS IGSS gfs Qg Qgs1 Qgs2 Qgd Qgodr Qsw Qoss RG td(on) tr td(off) tf Ciss Coss Crss Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Gate Threshold Voltage Coefficient Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Forward Transconductance Total Gate Charge Pre-Vth Gate-to-Source Charge Post-Vth Gate-to-Source Charge Gate-to-Drain Charge Gate Charge Overdrive Switch Charge (Qgs2 + Qgd) Output Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
Min.
25 --- --- --- 1.4 --- --- --- --- --- 135 --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
Typ. Max. Units
--- 17 1.3 2.1 1.9 -6.2 --- --- --- --- --- 40 12 5.3 12 11 17 26 1.1 20 31 16 12 5340 1280 600 --- --- 1.6 2.7 2.4 --- 1.0 150 100 -100 --- 59 --- --- --- --- --- --- 2.0 --- --- --- --- --- --- --- pF nC
Conditions
V VGS = 0V, ID = 250A mV/C Reference to 25C, ID = 1mA m VGS = 10V, ID = 34A VGS = 4.5V, ID V VDS = VGS, ID = 100A mV/C A VDS = 20V, VGS = 0V nA S
i = 27A i
VDS = 20V, VGS = 0V, TJ = 125C VGS = 20V VGS = -20V VDS = 13V, ID = 27A VDS = 13V
nC
VGS = 4.5V ID = 27A See Fig. 15 VDS = 16V, VGS = 0V VDD = 13V, VGS = 4.5VAi ID = 27A RG = 1.8 See Fig. 17 VGS = 0V VDS = 13V = 1.0MHz
ns
Diode Characteristics
Parameter
IS ISM VSD trr Qrr Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode)Ag Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge
Min.
--- --- --- --- ---
Typ. Max. Units
--- --- --- 28 37 98 A 270 1.0 42 56 V ns nC
Conditions
MOSFET symbol showing the integral reverse p-n junction diode. TJ = 25C, IS = 27A, VGS = 0V TJ = 25C, IF = 27A di/dt = 200A/s
i
i
Notes:
Pulse width 400s; duty cycle 2%
2
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IRF6715MPbF
Absolute Maximum Ratings
PD @TA = 25C PD @TA = 70C PD @TC = 25C TP TJ TSTG Power Dissipation Power Dissipation Power Dissipation Peak Soldering Temperature Operating Junction and Storage Temperature Range
e e f
Parameter
Max.
2.8 1.8 78 270 -40 to + 150
Units
W
C
Thermal Resistance
RJA RJA RJA RJC RJ-PCB Junction-to-Ambient Junction-to-Ambient Junction-to-Ambient Junction-to-Case Junction-to-PCB Mounted Linear Derating Factor
el jl kl fl
Parameter
Typ.
--- 12.5 20 --- 1.0 0.022
Max.
45 --- --- 1.6 ---
Units
C/W
eA
W/C
100 D = 0.50
Thermal Response ( Z thJA )
10
0.20 0.10 0.05 0.02 0.01
R1 R1 J 1 2 R2 R2 R3 R3 3 R4 R4 A 1 2 3 4 4 A
1
Ri (C/W)
0.9810 3.1819 22.8717 17.9602
J
i (sec)
0.000229 0.014154 1.0333 40.9
0.1
Ci= i/Ri Ci= i/Ri
0.01
SINGLE PULSE ( THERMAL RESPONSE )
Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc 0.01 0.1 1 10 100 1000
0.001 1E-006
1E-005
0.0001
0.001
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Used double sided cooling , mounting pad with large heatsink. Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. Notes:
R is measured at TJ of approximately 90C.
Surface mounted on 1 in. square Cu (still air).
Mounted to a PCB with small clip heatsink (still air)
Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air)
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IRF6715MPbF
1000
TOP
1000
VGS 10V 5.0V 4.5V 4.0V 3.5V 3.0V 2.8V 2.5V
TOP VGS 10V 5.0V 4.5V 4.0V 3.5V 3.0V 2.8V 2.5V
ID, Drain-to-Source Current (A)
10
BOTTOM
ID, Drain-to-Source Current (A)
100
100
BOTTOM
1 0.1 2.5V 0.01
10
2.5V 1
60s PULSE WIDTH
Tj = 25C
60s PULSE WIDTH
Tj = 150C 0.1 0.1 1 10
0.001 0.1 1 10 100 1000 VDS, Drain-to-Source Voltage (V)
100
1000
Fig 4. Typical Output Characteristics
1000 VDS = 15V 60s PULSE WIDTH 100 T J = 150C 10 T J = 25C T J = -40C
Typical RDS(on) (Normalized)
V DS, Drain-to-Source Voltage (V)
Fig 5. Typical Output Characteristics
2.0 ID = 34A
ID, Drain-to-Source Current (A)
1.5 V GS = 10V V GS = 4.5V 1.0
1
0.1 1 2 3 4 5
0.5 -60 -40 -20 0 20 40 60 80 100 120 140 160 T J , Junction Temperature (C)
Fig 6. Typical Transfer Characteristics
100000
VGS = 0V, f = 1 MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd
VGS, Gate-to-Source Voltage (V)
Fig 7. Normalized On-Resistance vs. Temperature
20 T J = 25C 16
Typical RDS(on) ( m)
C oss = C ds + C gd
C, Capacitance(pF)
10000 Ciss Coss 1000 Crss
12
Vgs = 3.5V Vgs = 4.0V Vgs = 4.5V Vgs = 5.0V Vgs = 8.0V Vgs = 10V
8
4
100 1 10 VDS, Drain-to-Source Voltage (V) 100
0 0 40 80 120 160 200
Fig 8. Typical Capacitance vs.Drain-to-Source Voltage
Fig 9. Typical On-Resistance Vs. Drain Current and Gate Voltage
ID, Drain Current (A)
4
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IRF6715MPbF
1000
10000 1000 100 10 1msec 1 0.1 T A = 25C T J = 150C Single Pulse 0.01 0.10 1.00 10.00 100.00 DC 10msec OPERATION IN THIS AREA LIMITED BY R DS(on)
ISD, Reverse Drain Current (A)
100
T J = 150C T J = 25C T J = -40C
ID, Drain-to-Source Current (A)
100sec
10
1 VGS = 0V 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VSD, Source-to-Drain Voltage (V)
0.01 VDS, Drain-to-Source Voltage (V)
Fig 10. Typical Source-Drain Diode Forward Voltage
200 180 160
ID, Drain Current (A)
Fig11. Maximum Safe Operating Area
Typical VGS(th) Gate threshold Voltage (V)
3.0
2.5
140 120 100 80 60 40 20 0 25 50 75 100 125 150 T C , Case Temperature (C)
2.0 ID = 100A ID = 1.0mA 1.0 ID = 1.0A
1.5
ID = 250A
0.5 -75 -50 -25 0 25 50 75 100 125 150 T J , Temperature ( C )
Fig 12. Maximum Drain Current vs. Case Temperature
900
EAS , Single Pulse Avalanche Energy (mJ)
Fig 13. Typical Threshold Voltage vs. Junction Temperature
ID TOP 2.74A 3.70A BOTTOM 27A
800 700 600 500 400 300 200 100 0 25 50 75
100
125
150
Starting T J , Junction Temperature (C)
Fig 14. Maximum Avalanche Energy vs. Drain Current
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IRF6715MPbF
Id Vds Vgs
L
0
DUT
20K 1K
S
VCC
Vgs(th)
Qgodr
Qgd
Qgs2 Qgs1
Fig 15a. Gate Charge Test Circuit
Fig 15b. Gate Charge Waveform
V(BR)DSS
15V
tp
DRIVER
VDS
L
VGS RG
D.U.T
IAS tp
+ - VDD
A
20V
0.01
I AS
Fig 16b. Unclamped Inductive Waveforms
Fig 16a. Unclamped Inductive Test Circuit
V DS VGS RG
RD
VDS 90%
+
D.U.T.
- VDD
V GS
Pulse Width 1 s Duty Factor 0.1 %
10% VGS
td(on) tr t d(off) tf
Fig 17a. Switching Time Test Circuit
Fig 17b. Switching Time Waveforms
6
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IRF6715MPbF
D.U.T
Driver Gate Drive
+
P.W.
Period
D=
P.W. Period VGS=10V
+
Circuit Layout Considerations * Low Stray Inductance * Ground Plane * Low Leakage Inductance Current Transformer
***
D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt
-
-
+
RG
*
* * * *
dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test
V DD
VDD
**
+ -
Re-Applied Voltage Inductor Curent
Body Diode
Forward Drop
Ripple 5%
ISD
* Use P-Channel Driver for P-Channel Measurements ** Reverse Polarity for P-Channel
*** VGS = 5V for Logic Level Devices
Fig 18. Diode Reverse Recovery Test Circuit for HEXFET(R) Power MOSFETs
DirectFET Board Footprint, MX Outline (Medium Size Can, X-Designation).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs.
G = GATE D = DRAIN S = SOURCE
D S G S D
D
D
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IRF6715MPbF
DirectFET Outline Dimension, MX Outline (Medium Size Can, X-Designation).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs.
DIMENSIONS
METRIC CODE MIN MAX A 6.35 6.25 B 5.05 4.80 C 3.95 3.85 D 0.45 0.35 E 0.72 0.68 F 0.72 0.68 G 1.42 1.38 H 0.84 0.80 J 0.42 0.38 K 1.01 0.88 L 2.41 2.28 M 0.616 0.676 R 0.020 0.080 P 0.17 0.08 IMPERIAL MIN 0.246 0.189 0.152 0.014 0.027 0.027 0.054 0.032 0.015 0.035 0.090 0.0235 0.0008 0.003 MAX 0.250 0.201 0.156 0.018 0.028 0.028 0.056 0.033 0.017 0.039 0.095 0.0274 0.0031 0.007
DirectFET Part Marking
GATE MARKING LOGO PART NUMBER BATCH NUMBER DATE CODE
Line above the last character of the date code indicates "Lead-Free"
8
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IRF6715MPbF
DirectFET Tape & Reel Dimension (Showing component orientation).
NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6715MTRPBF). For 1000 parts on 7" reel, order IRF6715MTR1PBF STANDARD OPTION METRIC CODE MIN MAX A N.C 330.0 B 20.2 N.C C 12.8 13.2 D 1.5 N.C E 100.0 N.C F N.C 18.4 G 12.4 14.4 H 11.9 15.4 REEL DIMENSIONS (QTY 4800) TR1 OPTION (QTY 1000) IMPERIAL IMPERIAL METRIC MIN MIN MAX MAX MIN MAX 12.992 6.9 N.C N.C 177.77 N.C 0.795 0.75 N.C N.C 19.06 N.C 0.504 0.53 13.5 0.50 0.520 12.8 0.059 N.C 0.059 N.C 1.5 N.C 3.937 2.31 58.72 N.C N.C N.C N.C 0.53 N.C 0.724 N.C 13.50 0.488 0.47 11.9 N.C 0.567 12.01 0.469 0.47 11.9 0.606 12.01 N.C
LOADED TAPE FEED DIRECTION
NOTE: CONTROLLING DIMENSIONS IN MM
CODE A B C D E F G H
DIMENSIONS IMPERIAL METRIC MIN MAX MIN MAX 0.311 7.90 0.319 8.10 0.154 3.90 4.10 0.161 0.469 0.484 11.90 12.30 0.215 5.45 5.55 0.219 0.201 0.209 5.10 5.30 0.256 6.50 6.70 0.264 0.059 1.50 N.C N.C 0.059 1.50 0.063 1.60
Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.04/2009
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