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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA38B-80/VYVG-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LA38B-80/VYVG-PF B 11 - Apr.- 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA38B-80/VYVG-PF Page 1/6
Package Dimensions
5.0 5.9 6.8
7.6 8.6
19.5
VG
3.50.5
VY
1/4
0.5TYP 2.54TYP
+ 1
2
+ 3
+- + 123
2.54TYP
1.ANODE GREEN 2.COMMON CATHODE 3.ANODE YELLOW
LVYVG3392-PF
5.0 5.9
7.6 8.6
10.5O 0.5
VG
VY
1.5MAX
+ 1 2 + 3
0.5 TYP
2.0MIN
18.0MIN
1.ANODE GREEN 2.COMMON CATHODE 3.ANODE YELLOW
2.0MIN 2.54TYP 2.54TYP
1
2
3
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA38B-80/VYVG-PF Absolute Maximum Ratings at Ta=25 J Page 2/6
Absolute Maximum Ratings Parameter Symbol VY Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V IF IFP PD Ir 30 60 75 10 VG 30 120 100 mA mA mW UNIT
g A
Electrostatic Discharge( * )
Operating Temperature Storage Temperature
ESD
Topr Tstg
2000
-40 ~ +85 -40 ~ +100
---
V
J J
Electricity or power surge will the Use of conductive wrist band or anti-electrosatic * Static is recommended when handingdamageLED.LED.devices, aequipment and machinery must be properly glove these All grounded.
Typical Electrical & Optical Characteristics (Ta=25 J )
PART NO
MATERIAL Emitted AlGaInP Yellow
COLOR
Lens
Peak Dominant Spectral Forward Luminous Viewing wave angle intensity wave halfwidth voltage length length f @20mA(V) @20mA(mcd) 2c 1/2 nm f Pnm f Dnm (deg) Typ. Min. Max. Min. --590 --20 30 1.7 1.7 2.6 2.6 160 390 50 90 70 70
LA38B-80/VYVG-PF
White Diffused
GaP
Green
565
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA38B-80/VYVG-PF Page 3/6
Typical Electro-Optical Characteristics Curve
VY CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100 10
Relative Intensity Normalize @20mA
1.5 2.0 2.5 3.0
2.5 2.0 1.5 1.0 0.5 0.0
1.0 0.1 1.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25J
Relative Intensity@20mA Normalize @25J
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.0
0.9
0.8 -40 -20 0 20 40 60 80 100
Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength
1.0
Ambient Temperature(J )
Relative Intensity@20mA
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA38B-80/VYVG-PF Page 4/6
Typical Electro-Optical Characteristics Curve
VG CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25J
Relative Intensity@20mA Normalize @25J
-40 -20 0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0
0.9 0.8
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA38B-80/VYVG-PF Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp(C) 260 C3sec Max
260X
5 /sec max
120X
2 /sec max
X 25 0X 0
Preheat
50
100
150
Time(sec)
60 Seconds Max
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA38B-80/VYVG-PF Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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