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IFX24401 Low Dropout Voltage Regulator IFX24401TEV50 IFX24401ELV50 Data Sheet Rev. 1.02, 2009-12-10 Standard Power Low Dropout Voltage Regulator IFX24401 1 Features * * * * * * * * * * * Overview Output voltage 5 V 2% Ultra low current consumption: 20 A (typ.) 300 mA current capability Enable input Very low-drop voltage Short circuit protection Overtemperature protection Low Dropout Voltage, 250mV (typ.) High Input Voltage 45 V Temperature Range -40 C Tj 125 C Green Product (RoHS compliant) PG-TO252-5 Applications * * * * * Battery powered devices (e.g. Handheld GPS) Portable Radios HDTV Televisions Game Consoles Network Routers PG-SSOP-14 For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series. Functional Description The IFX24401 is a monolithic integrated low-drop voltage regulator for load currents up to 300 mA. The output voltage is regulated to VQ,nom = 5.0 V with an accuracy of 2%. A sophisticated design allows stable operation with low ESR ceramic output capacitors down to 470 nF. The device is designed for the harsh environments. Therefore it is protected against overload, short circuit and overtemperature conditions. Due to its ultra low stand-by current consumption of 20 A (typ.) the IFX24401 is ideal for use in battery powered applications. The regulator can be shut down via an Enable input which further reduces the current consumption to 5 A (typ.). An integrated output sink current circuitry keeps the voltage at the Output pin Q below 5.5 V even when reverse currents are applied. Thus connected devices are protected from overvoltage damage. Type IFX24401TEV50 IFX24401ELV50 Data Sheet Package PG-TO252-5 PG-SSOP-14 2 Marking 2440150 24401V50 Rev. 1.02, 2009-12-10 IFX24401 Block Diagram 2 Block Diagram IFX24401 I Overtemperature Shutdown Bandgap Reference Q 1 EN Enable Charge Pump GND Figure 1 Block Diagram Data Sheet 3 Rev. 1.02, 2009-12-10 IFX24401 Pin Configuration 3 Pin Configuration I NC Figure 2 Pin Configuration PG-TO252-5 (top view) EN Q 3.1 Pin 1 2 3 4 5 Pin Definitions and Functions (PG-TO252-5 ) Symbol I N.C. GND EN Q Function Input Connect ceramic capcitor between I and GND No Connect May be open or connected to GND Ground Internally connected to heat slug Enable Input Low signal level disables the regulator. Pull-down resistor is integrated. Output Place capacitor between Q pin and GND. Capacitor placement should be close to pin. Refer to capacitance and ESR requirements in "Functional Range" on Page 6 Heat Slug Connect to board GND and heatsink Heat Slug -- Data Sheet 4 Rev. 1.02, 2009-12-10 IFX24401 Pin Configuration Figure 3 Pin Configuration PG-SSOP-14 (top view) 3.2 Pin 1,2,3,5,7 4 6 8,10,11,1 2,14 9 Pin Definitions and Functions (PG-SSOP-14 ) Symbol N.C. GND EN N.C. Q Function No Connect May be open or connected to GND Ground Enable Input Low signal level disables the regulator. Pull-down resistor is integrated. No Connect May be open or connected to GND Output Place capacitor between Q pin and GND. Capacitor placement should be close to pin. Refer to capacitance and ESR requirements in "Functional Range" on Page 6 Input Connect ceramic capcitor between I and GND Exposed Pad Connect to board GND and heatsink 13 Pad I Data Sheet 5 Rev. 1.02, 2009-12-10 IFX24401 General Product Characteristics 4 4.1 General Product Characteristics Absolute Maximum Ratings Absolute Maximum Ratings1) Tj = -40 C to 150 C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Input I Voltage Current Enable EN Voltage Current Output Q Voltage Voltage Current Temperature Junction temperature Storage temperature Symbol Limit Values Min. Max. 45 - 45 1 5.5 6.2 - 150 150 V mA V mA V V mA C C - - Observe current limit Unit Test Condition VI II VEN IEN VQ VQ IQ Tj Tstg -0.3 -1 -0.3 -1 -0.3 -0.3 -1 -40 -50 IEN,max2) - - t < 10 s3) - - - 1) Not subject to production test, specified by design. 2) External resistor required to keep current below absolute maximum rating when voltages 5.5 V are applied. 3) Exposure to these absolute maximum ratings for extended periods (t > 10 s) may affect device reliability. Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. 4.2 Parameter Functional Range Symbol Limit Values Min. Max. 42 125 - 10 V C nF - - 1) Unit Remarks Input voltage Junction temperature Output Capacitor VI Tj CQ ESR (CQ) 5.5 -40 470 - f = 10 kHz 1) The minimum output capacitance requirement is applicable for a worst case capacitor tolerance of 30% Note: In the operating range, the functions given in the circuit description are fulfilled. Data Sheet 6 Rev. 1.02, 2009-12-10 IFX24401 General Product Characteristics 4.3 Pos. Thermal Resistance Parameter Symbol Limit Value Min. Typ. 4 115 57 42 Max. - - - - K/W K/W K/W K/W measured to pin 5 Footprint only2) 300mm2 heatsink area on PCB2) 600mm2 heatsink area on PCB2) measured to pin 5 Footprint only2) 300mm2 heatsink area on PCB2) 600mm2 heatsink area on PCB2) Unit Conditions IFX24401TEV50 (PG-TO252-5, ) 4.3.1 4.3.2 4.3.3 4.3.4 IFX24401ELV50 (PG-SSOP-14) 4.3.5 4.3.6 4.3.7 4.3.8 1) not subject to production test, specified by design 2) EIA/JESD 52_2, FR4, 80 x 80 x 1.5 mm; 35 Cu, 5 Sn Junction to Case1) Junction to Ambient 1) RthJC RthJA - - - - Junction to Case1) Junction to Ambient 1) RthJC RthJA - - - - 7 120 59 49 - - - - K/W K/W K/W K/W Data Sheet 7 Rev. 1.02, 2009-12-10 IFX24401 General Product Characteristics Table 1 Parameter Output Q Electrical Characteristics Symbol Limit Values Min. Typ. 5.0 5.0 - - 20 - 5 250 15 5 60 0.5 - - 3 0.5 Max. 5.1 5.1 - 800 30 40 9 500 40 20 - - - 0.8 4 1 V V mA mA A A A mV mV mV dB mV/K V V A A 0.1 mA < IQ < 300 mA; 6 V < VI < 16 V 0.1 mA < IQ < 100 mA; 6 V < VI < 40 V 1) VI = 13.5 V; VEN = 5 V; -40 C < Tj < 125 C (unless otherwise specified) Unit Measuring Condition Output voltage Output voltage Output current limit Output current limit Current consumption; Iq = II - IQ Current consumption; Iq = II - IQ Quiescent current; Disabled Drop voltage Load regulation Line regulation Power supply ripple rejection Temperature output voltage drift Enable Input EN Turn-on Voltage Turn-off Voltage H-input current L-input current VQ VQ IQ,LIM IQ,LIM Iq Iq Iq Vdr VQ, lo VQ, li 4.9 4.9 320 - - - - - -40 -20 - - 3.1 - - - PSRR dVQ/dT VQ = 0V IQ = 0.1 mA; Tj = 25 C IQ = 0.1 mA; Tj 80 C VEN = 0 V; Tj < 80 C IQ = 200 mA; Vdr = VI - VQ1) IQ = 5 mA to 250 mA Vl = 10V to 32 V; IQ = 5 mA fr = 100 Hz; Vr = 0.5 Vpp - VQ 4.9 V VQ 0.3 V VEN ON VEN OFF IEN ON IEN OFF VEN = 5 V VEN = 0 V; Tj < 80 C 1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V. Data Sheet 8 Rev. 1.02, 2009-12-10 IFX24401 Typical Performance Characteristics 5 Typical Performance Characteristics Current Consumption Iq versus Input Voltage VQ 1_Iq -Tj .v s d 3_IQ -V I.V S D Current Consumption Iq versus Junction Temperature TJ Iq [A ] VI = 13.5V 100 Iq [A] T J = 25 C IQ = 100 A 10 40 30 IQ = 50mA IQ = 10mA 20 1 10 I Q = 0.2mA 0.01 -40 -20 0 20 40 60 80 100 120 140 0 10 20 30 40 T J [C] Current Consumption Iq versus Output Current IQ 30 2_IQ-IQ.VSD VI [V ] Output Voltage VQ versus Junction Temperature TJ 5A_VQ-TJ.VSD Iq [A] Tj = 25 C 20 VI = 13.5 V VQ [V] VI = 13.5 V Tj = -40 C 5.05 15 5.00 IQ =100A...100mA 10 4.95 5 4.90 0 20 40 60 100 -40 -20 0 20 40 60 80 100 120 140 IQ [mA] Tj [C] Data Sheet 9 Rev. 1.02, 2009-12-10 IFX24401 Typical Performance Characteristics Dropout Voltage Vdr versus Output Current IQ 600 6_V DR-IQ .V S D Maximum Output Current IQ versus Junction Temperature Tj 620 8_IQMA X -TJ . V S D Vdr [mV ] T J = 150 C IQ [mA ] VI = 13.5 V 400 580 TJj = 25 C 300 560 200 TJ = -40 C 540 100 520 0 100 200 300 500 -40 -20 0 20 40 60 80 100 120 140 IQ [mA] Dropout Voltage Vdr versus Junction Temperature 600 7_V DR-TJ . V S D TJ [C] Maximum Output Current IQ versus Input Voltage VI 600 9_S OA. V S D IQ,L IM Vdr [mV] [mA] T j = 125 C T j = 25 C 400 IQ = 250 mA 400 300 300 IQ = 150mA 200 200 100 100 IQ = 10 mA -40 -20 0 20 40 60 80 100 120 140 0 10 20 30 40 TJ [C] VI [V] Data Sheet 10 Rev. 1.02, 2009-12-10 IFX24401 Typical Performance Characteristics Region of Stability 100 12_ESR-IQ.VSD Output Voltage VQ Start-up behavior 14_V Itime _s tartup. v s d ESRCQ [] CQ = 10nF ...10 F Tj = 25 C VQ [V] EN = HIGH 10 5.05 IQ = 5mA 1 Stable Region 0.1 5.00 4.90 4.80 0.01 0 50 100 150 200 1 2 3 4 5 IQ [mA] t [ms] Load Regulation VQ versus Output Current Change IQ 0 18a_dV Q-dIQ _V i6V. vs d Power Supply Ripple Rejection PSRR versus Frequency f 80 13_P S RR. V S D PSRR [dB ] IQ = 0.1 mA I Q = 30 mA IQ = 100 mA VQ [mV ] VI = 6V 60 -10 T j = -40 C Tj = 25 C 50 -15 40 -20 30 VRIPPLE = 0.5 V PP VI = 13 .5 V CQ = 10 F Tantalum TJ = 25 C 100 1k 10k 100 k -25 T j = 150 C 10 -30 0 50 100 150 250 f [Hz] IQ [mA] Data Sheet 11 Rev. 1.02, 2009-12-10 IFX24401 Typical Performance Characteristics Load Regulation VQ versus Output Current Change dIQ 0 18b_dV Q-dIQ_V i135V. vs d Line Regulation VQ versus Input Voltage Changed VI 0 19_dV Q-dV I__150C. v sd VQ [mV ] V I = 13 .5V VQ [mV ] TJ = 150 C IQ = 1mA IQ = 10 mA IQ = 100 mA -10 -2 T J = -40 C -15 -3 -20 T J = 25 C -4 -25 -5 T J = 150 C -30 0 50 100 150 250 -6 0 5 10 IQ = 200mA 15 20 25 30 35 40 45 IQ [mA] Load Regulation VQ versus Output Current Change IQ 0 18c _dV Q-dIQ_V i28V. vs d VI [V] Line Regulation VQ versus Input Voltage Changed VI 0 19_dV Q-dV I_25C. v sd VQ [mV ] VI = 28 VQ [mV ] T J = 25 C I Q = 1mA -10 IQ = 10mA -2 -15 T J = -40 C -3 I Q = 100 mA IQ = 200 mA -20 -4 TJ = 25 C -25 -5 T J = 150 C -30 0 50 100 150 250 -6 0 5 10 15 20 25 30 35 40 45 IQ [mA] VI [V] Data Sheet 12 Rev. 1.02, 2009-12-10 IFX24401 Typical Performance Characteristics Line Regulation VQ versus Input Voltage Change VI 0 19_dV Q-dV I_-40C. v sd Load Transient Response Peak Voltage VQ 20_Load Tranc ient v s time 125. vs d VQ [mV ] T J =40 C IQ IQ =100mA T J = 125 C V I = 13.5 V IQ = 1mA -2 IQ = 10 mA -3 I Q = 100mA I Q = 200 mA -4 VQ -5 VQ = 100 mV/DIV -6 t = 40 s/DIV 0 5 10 15 20 25 30 35 40 45 VI [V] Load Transient Response Peak Voltage VQ Line Transient Response Peak Voltage VQ 20_Load Tranc ient v s time 25.v sd 21_Line Tranc ient v s time 25. vs d IQ I Q = 100mA T J = 25 C V I = 13.5 V VI VI = 2V T J = 25 C VI = 13.5 V VQ VQ = 50 mV/DIV VQ VQ = 100 mV/DIV t = 40 s/DIV t = 400 s/DIV Data Sheet 13 Rev. 1.02, 2009-12-10 IFX24401 Typical Performance Characteristics Line Transient Response Peak Voltage VQ I 21_Line Tranc ient vs time 125. vs d Enabled Input Current IEN versus Input Voltage VI , EN=Off 25_IINH v s V IN INH _off . v s d VI VI = 2 V T J = 125 C VI = 13.5 V [A ] 1.0 IEN EN = L (i.e. IC OFF) 0.8 T J = 150 C T J = 25 C TJ = -40C 0.6 VQ VQ = 50 mV/DIV 0.4 0.2 t = 400 s/DIV 10 20 30 40 V I [V] Enabled Input Current IEN versus Enabled Input Voltage VEN 24_IINH v s V INH. v s d Thermal Resistance Junction-Ambient RTHJA versus Power Dissipation PV 75 32_RTH V S P V TO252.V S D [A ] 50 IEN T J = 150 C RTH-JA [K /W] A = 300mm 2 Cooling Area single sided PCB T J = 25C 40 65 T J = -40 C 30 60 20 TO252-5 55 10 50 10 20 30 40 3 6 9 12 V EN [V] PV [W] Data Sheet 14 Rev. 1.02, 2009-12-10 IFX24401 Application Information 6 Application Information V Bat 100 nF IFX24401 1I Q5 470 nF + 4.7 F V CC Overtemperature Shutdown Bandgap Reference 1 e. g. Ignition 2 EN Enable Charge Pump GND 3, Tab Figure 4 Application Diagram Input, Output An input capacitor is necessary for damping line influences. A resistor of approx. 1 in series with CI, can damp the LC of the input inductivity and the input capacitor. The IFX24401 requires a ceramic output capacitor of at least 470 nF. In order to damp influences resulting from load current surges it is recommended to add an additional electrolytic capacitor of 4.7 F to 47 F at the output as shown in Figure 4. Additionally a buffer capacitor CB of > 10F should be used for the output to suppress influences from load surges to the voltage levels. This one can either be an aluminum electrolytic capacitor or a tantalum capacitor following the application requirements. A general recommendation is to keep the drop over the equivalent serial resistor (ESR) together with the discharge of the blocking capacitor below the allowed Headroom of the Application to be supplied (e.g. typ. dVQ = 350mV). Since the regulator output current roughly rises linearly with time the discharge of the capacitor can be calculated as follows: dVCB = dIQ*dt/CB The drop across the ESR calculates as: dVESR = dI*ESR To prevent a reset the following relationship must be fullfilled: dVC + dVESR < VRH = 350mV Example: Assuming a load current change of dIQ = 100mA, a blocking capacitor of CB = 22F and a typical regulator reaction time under normal operating conditions of dt ~ 25s and for special dynamic load conditions, such as load step from very low base load, a reaction time of dt ~ 75s. dVC = dIQ*dt/CB = 100mA * 25s/22F = 113mV So for the ESR we can allow dVESR = VRH2 - dVC = 350mV - 113mV = 236mV The permissible ESR becomes: ESR = dVESR / dIQ = 236mV/100mA = 2.36Ohm Data Sheet 15 Rev. 1.02, 2009-12-10 IFX24401 Package Outlines 7 Package Outlines 6.5 +0.15 -0.05 5.7 MAX. (4.24) 1 0.1 1) A B 0.8 0.15 2.3 +0.05 -0.10 0.5 +0.08 -0.04 (5) 9.98 0.5 6.22 -0.2 0.9 +0.20 -0.01 0...0.15 0.51 MIN. 0.15 MAX. per side 5 x 0.6 0.1 1.14 0.5 +0.08 -0.04 0.1 B 4.56 0.25 M A B GPT09527 1) Includes mold flashes on each side. All metal surfaces tin plated, except area of cut. Figure 5 PG-TO252-5 0.35 x 45 Stand Off (1.45) 1.7 MAX. 3.9 0.11) 0.1 C D 0 ... 0.1 0.19 +0.06 0.08 C 6 0.2 0.65 0.25 0.05 2) C 0.64 0.25 D 0.2 8 MAX. M 0.15 M C A-B D 14x D 8x A 14 8 Bottom View 3 0.2 1 7 1 7 B 0.1 C A-B 2x Exposed Diepad 14 8 4.9 0.11) Index Marking GPT09113 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion PG-SSOP-14-1,-2,-3-PO V02 Figure 6 PG-SSOP-14 Data Sheet 16 2.65 0.2 Rev. 1.02, 2009-12-10 IFX24401 Revision History 8 Revision Revision History Date Changes 1.02 1.01 1.0 2009-12-10 2009-10-19 2009-04-28 Corrections to pin assignment Coverpage changed Overview page: Inserted reference statement to TLE/TLF series. Initial Release Data Sheet 17 Rev. 1.02, 2009-12-10 Edition 2009-12-10 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. |
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